Patents Examined by Stephen S Sul
  • Patent number: 11516942
    Abstract: A rack and system for cooling computing devices such as in a data center is disclosed. In one embodiment, the rack supports computing devices and comprises planar annular sector or trapezoidal shelves, each having one or more positions for holding computing devices. The rack may be configured to be connected to other similar racks to form a vertical geometric prism or annular cylinder, which may be tapered, and the computing devices may be installed to discharge exhaust at an angle. A number of vertical supports may hold the shelves in a vertically spaced arrangement to from a helix within the prism or cylinder. An air barrier may be affixed to the rack and have openings permitting exhaust air to flow from the computing devices through the air barrier. The helix formed by the shelves may channel the airflow generated by the computing devices into a vortex to improve cooling.
    Type: Grant
    Filed: December 18, 2020
    Date of Patent: November 29, 2022
    Assignee: Core Scientific, Inc.
    Inventor: Devon Baldwin
  • Patent number: 11513571
    Abstract: An information handling system may include a chassis having a first region and a second region, wherein the first region includes a memory module, and wherein the second region includes a processing unit; at least one air mover configured to provide airflow; and an airflow shroud including an airflow baffle. When the airflow shroud is installed in the information handling system in a first orientation, the airflow baffle may be configured to block at least a portion of the airflow from flowing through the first region. When the airflow shroud is installed in the information handling system in a second orientation, the airflow baffle may be configured to block at least a portion of the airflow from flowing through the second region.
    Type: Grant
    Filed: April 7, 2021
    Date of Patent: November 29, 2022
    Assignee: Dell Products L.P.
    Inventors: Ming-Hui Pan, Cho Shih Huai
  • Patent number: 11500434
    Abstract: An air cooling structure of computer chassis includes: a first chassis, a second chassis, a third chassis, a computer motherboard, and a cooling fan; wherein, the first chassis, the second chassis, and the third chassis are provided in turn; the computer motherboard is provided in the first chassis, a CPU is provided on the side surface of the computer motherboard towards the second chassis, a peripheral interface is provided on the side surface of the computer motherboard far away from the second chassis, a cooling hole is provided on the second chassis, the cooling fan is provided in the second chassis, a graphics card is provided in the third chassis. Because of the openness and specific function of the middle-zone cooling system, the disclosure, the cooling becomes more efficient.
    Type: Grant
    Filed: March 2, 2021
    Date of Patent: November 15, 2022
    Assignee: EDAC ELECTRONICS TECHNOLOGY (HANGZHOU) CO., LTD
    Inventor: Huantang Lin
  • Patent number: 11501936
    Abstract: A temperature switch includes an elastically deformable movable plate, a movable contact on the movable plate, a fixed contact facing the movable contact, a thermally deformable member, a vibration suppression section, and a cover. The thermally deformable member is elastically deformed in accordance with a temperature change to elastically deform the movable plate such that the movable contact is in contact with the fixed contact or spaced apart from the fixed contact. The vibration suppression section suppresses vibrations of the movable plate by contacting a fixed-edge side when the movable plate is elastically deformed to shift the movable plate from being in contact with the fixed contact to being spaced apart therefrom. The cover surrounds the movable and fixed contacts, and the vibration suppression section is a projecting section provided on the cover.
    Type: Grant
    Filed: July 19, 2019
    Date of Patent: November 15, 2022
    Assignee: Uchiya Thermostat Co., Ltd.
    Inventor: Hideaki Takeda
  • Patent number: 11495519
    Abstract: An electronic device includes a heat-generating electronic component, a heat spreader and a heat sink. The heat spreader has an area at least about 4 times greater than the heat-generating component. A first surface of the heat spreader is in thermal contact with the first surface of the heat-generating component along a first, non-dielectric interface. The heat sink has greater mass than the heat spreader and comprises one or more layers of thermally conductive material. A first surface of the heat sink is in thermal contact with the second surface of the heat spreader along a second interface having greater area than the first interface. Dielectric thermal interface material is provided at the second interface in direct contact with the heat spreader and the heat sink, such that the second interface is dielectric.
    Type: Grant
    Filed: June 5, 2020
    Date of Patent: November 8, 2022
    Assignee: Dana Canada Corporation
    Inventor: Doug Vanderwees
  • Patent number: 11495147
    Abstract: The present disclosure provides a display device including a display panel, a pair of supporting components, a rotating component, a first fixing part and a second fixing part. The display panel comprises: a first side and a second side which are opposite to each other, and the first side is fixedly connected to the first fixing part, and the second side is fixedly connected to the second fixing part. The pair of supporting components comprises: a first supporting component and a second supporting component which are opposite to each other. A first end of the first supporting component is fixedly connected to a first end of the rotating component, and a second end of the first supporting component is fixedly connected to a first end of the second fixing part at the second side of the display panel.
    Type: Grant
    Filed: May 30, 2019
    Date of Patent: November 8, 2022
    Assignees: HEFEI BOE OPTOELECTRONICS TECHNOLOGY CO., LTD., BEIJING BOE TECHNOLOGY DEVELOPMENT CO., LTD.
    Inventors: Bowen Qu, Dongling Sun, Haitao Wang, Juncai Ma, Hongqiao Xu, Jinbo Xu
  • Patent number: 11490543
    Abstract: A DC power supply device includes a housing including a wall portion, a first opening and a second opening, a circuit portion, a regulation wall portion, and a fan. The first and second openings are formed in the wall portion. The circuit portion includes first and second circuit elements those fixed within the housing. The regulation wall portion provide a first air passage in communication with the first opening, a second air passage in communication with the second opening, and a bent air passage allowing the first air passage and the second air passage to communicate with each other. The fan is configured to generate an air-flow flowing between the first air passage and the second air passage. The fan is positioned to face the first opening. The first circuit element is positioned in the first air passage. The second circuit element is positioned in the second air passage.
    Type: Grant
    Filed: February 22, 2019
    Date of Patent: November 1, 2022
    Assignee: KOKI HOLDINGS CO., LTD.
    Inventors: Naoto Ichihashi, Takuya Yoshinari, Yuji Kishima
  • Patent number: 11483943
    Abstract: A computing device, comprising: a chassis; an optical base layer, including optical connectors; a power base layer, including power connectors; a thermal base layer, including a cold supply line with liquid disconnects, hot return lines with liquid disconnects, and thermal infrastructure interfaces; a radio frequency base layer, including radio frequency connectors; a power interface, wherein the power interface connects to the power base layer; a power supply to connect to the power interface and provide power to the power base layer through the power interface; and bays defined by bay divider walls, wherein each bay divider wall is removable and each bay comprises one of the optical connectors, one of the power connectors, one liquid disconnect for the supply line, one of the liquid disconnects for a hot return line, and one of the radio frequency connectors.
    Type: Grant
    Filed: April 30, 2020
    Date of Patent: October 25, 2022
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Kevin B. Leigh, John R. Grady
  • Patent number: 11476737
    Abstract: An integrated power control assembly configured as an inverter for a motor is mounted directly on an axial end of the motor. The integrated power control assembly includes one or more power plates, one or more cooling plates coaxially disposed on and thermally connected to the one or more power plates, and one or more circuit boards circumferentially disposed around the one or more power plates. An individual power plate has a power card having one or more switching semiconductor devices corresponding to individual phases of the motor. The individual power card is electrically coupled to the motor through one or more busbars. An individual circuit board is electrically coupled to an individual power card corresponding to an individual phase of the motor. The individual circuit board has a first surface electrically coupled to the one or more power plates and a second surface opposite to the first surface.
    Type: Grant
    Filed: March 13, 2020
    Date of Patent: October 18, 2022
    Assignee: Toyota Motor Engineering & Manufacturing North America. Inc.
    Inventors: Shailesh N. Joshi, Yanghe Liu, Fa Chen
  • Patent number: 11477920
    Abstract: The present disclosure relates to the field of power electronics technology, and proposes a power module, including: a case and an isolating part disposed in the case; a first air duct and a second air duct stacked to each other, separated by the isolating part, and penetrated in a front-to-rear direction in the case; a high-voltage power unit; a low-voltage power unit; and a transformer, including a high-voltage portion and a low-voltage portion, wherein the high-voltage portion includes a first magnetic core and a high-voltage coil disposed on the first magnetic core, and the low-voltage portion includes a second magnetic core and a low-voltage coil disposed on the second magnetic core, wherein the high-voltage power unit and the high-voltage portion are disposed in the first air duct, and the low-voltage power unit and the low-voltage portion are disposed in the second air duct.
    Type: Grant
    Filed: October 22, 2020
    Date of Patent: October 18, 2022
    Assignee: Delta Electronics (Shanghai) CO., LTD
    Inventors: Lin Lan, Weiqiang Zhang, Quanliang Zhang
  • Patent number: 11477921
    Abstract: A power conversion system includes a housing (outer housing) and a power converter. The power converter is arranged in an internal space of the housing. An outer peripheral surface of the housing is provided with an air inlet and an air outlet. The air outlet communicates with the air inlet via the internal space of the housing and is located below the air inlet.
    Type: Grant
    Filed: August 7, 2019
    Date of Patent: October 18, 2022
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Min Xu, Tetsuji Yamashita, Toru Matsugi
  • Patent number: 11470749
    Abstract: Systems for forced air cooling of display assemblies are provided. An electronic display subassembly is located behind a cover and includes an interior channel. An open loop centrifugal fan is positioned at an intake or an exhaust and forces ambient air through an open loop pathway when activated. A closed loop airflow pathway encircles the electronic display subassembly. A closed loop centrifugal fan is positioned at a side channel and forces circulating gas through the closed loop airflow pathway. Electronic components for operating the display assembly are provided with the rear compartment.
    Type: Grant
    Filed: October 23, 2020
    Date of Patent: October 11, 2022
    Assignee: Manufacturing Resources International, Inc.
    Inventors: William Dunn, Marcos Diaz, Alex Moreau
  • Patent number: 11467638
    Abstract: A water-cooling head adjustment structure for computer water cooling includes a water-cooling head attached to a heating element of a circuit board, a water-cooling head adapter including a bottom panel attached to the water-cooling head, a hollow frame located on the bottom panel and a cover plate covering the hollow frame and equipped with two water inlet and outlet connectors, a steering adapter having two water pipes connected to a water cooling row connector of a water cooling row and two connection pipes respectively connected to the water inlet and outlet connectors of the water-cooling head adapter, and a one-dimensional movement adjustment mechanism provided between the cover plate and the hollow frame for adjustment of the relative position between the cover plate and the hollow frame to align the connection pipes and the water inlet and outlet connectors.
    Type: Grant
    Filed: November 6, 2020
    Date of Patent: October 11, 2022
    Assignee: AMERICAN FUTURE TECHNOLOGY
    Inventor: You-Chi Liu
  • Patent number: 11464143
    Abstract: A heat dissipation device of a display apparatus and a method for dissipating heat of a display apparatus, and a display device are provided. The heat dissipation device includes a front cover assembly including a front cover, a support assembly including a support base, and a rear cover assembly including a rear cover and a heat dissipation component. The front cover is provided with a heat dissipation control switch and a receiving groove configured to receive the display apparatus. The support base is slidably mounted in first sliding grooves respectively provided on both sides of the receiving groove. The rear cover is provided with an air inlet and an air outlet. When the display apparatus is inserted into the receiving groove, the support base slides under weight of the display apparatus, to press the heat dissipation control switch, to control the heat dissipation component to dissipate heat.
    Type: Grant
    Filed: December 3, 2020
    Date of Patent: October 4, 2022
    Assignee: XIAMEN TIANMA MICRO-ELECTRONICS CO., LTD.
    Inventor: Xiaoyin Zhang
  • Patent number: 11456141
    Abstract: A temperature-sensitive pellet type thermal fuse having a metal case (10); a first lead wire (L1) on an open end of the metal case (10) and insulated from the metal case (10); a second lead wire (L2) electrically connected to the bottom wall (12) of the metal case (10); a temperature-sensitive pellet (30) installed inside the case (10); a movable terminal (60) being in contact with the second lead wire (L2) and a fixed terminal (40) when below a fuse cutoff operation temperature, and being in contact with the metal case (10) but separated from the second lead wire (L2) when above the fuse cutoff operation temperature; the movable terminal (60) having a movable contact element (50) slidably contacting with the inner wall of a through hole (41) of the fixed terminal (40) to electrically connect to the fixed terminal (40).
    Type: Grant
    Filed: October 19, 2018
    Date of Patent: September 27, 2022
    Assignee: DONG-YANG ELECTRONICS CO., LTD.
    Inventor: Sung Woong Yoon
  • Patent number: 11450501
    Abstract: The invention refers to a fuse switch module (1) that comprises a casing (2) having an aperture (3) and a cover (4) for closing and opening the aperture (3), and a rotatable fuse cartridge (11) for receiving a fuse (8). The fuse cartridge (11) is rotatable between a switch module closed position in which a fuse (8) is connected with fixed contacts (5,6) to enable current circulation, and a switch module open position in which current circulation through the fixed contacts (5,6) is impeded. The cover (4) and the fuse cartridge (11) are engaged when the cover (4) is closing the aperture (3) and when the fuse cartridge (11) is in the switch closed position, thus, the cover (4) is locked by the fuse cartridge (11) and opening of the cover (4) is impeded while current is circulating through the switch module.
    Type: Grant
    Filed: August 5, 2020
    Date of Patent: September 20, 2022
    Assignee: GORLAN TEAM, S. L. U
    Inventor: Jose Oscar Andaluz SorlĂ­
  • Patent number: 11450994
    Abstract: A plug connection has a plug socket and a plug which can be releasably inserted therein, as well as a plurality of electrically conductive contact areas and spring contacts. The spring contacts are divided into a first group and a second group. In a first state, the spring contacts of the first group are in contact with their associated contact areas and the spring contacts of the second groups rest on at least one stop and are not in contact with their associated contact areas. A trigger causes the spring contacts of the second group to overcome the at least one stop when a defined temperature is exceeded so as to come into contact with their associated contact areas in a second state.
    Type: Grant
    Filed: September 13, 2019
    Date of Patent: September 20, 2022
    Assignee: Bayerische Motoren Werke Aktiengesellschaft
    Inventors: Matthias Brasse, Joachim Froeschl, Juergen Gebert, Johannes Meisenzahl
  • Patent number: 11450495
    Abstract: The object is to provide an actuator that consumes less power. An actuator comprises: a stator that rotatably supports a plurality of stator rollers; a mover that rotatably supports a mover roller disposed between the stator rollers; and a wire made of a shape memory alloy that is disposed between the stator rollers and the mover roller and has both ends connected to respective two stator terminals provided in the stator.
    Type: Grant
    Filed: September 26, 2018
    Date of Patent: September 20, 2022
    Assignee: MARUWA Corporation
    Inventor: Yoshio Tanabe
  • Patent number: 11452232
    Abstract: Provided is an electronic device. The electronic device includes a housing, a heat generating element, a plurality of fans, and a guide structure. The housing includes a first outlet. The heat generating element is disposed in the housing. The fans are disposed in the housing. Each fan includes a second outlet. The second outlets at least partially face the interior of the housing. The guide structure is disposed in the housing, and is at least partially located between the fans. The guide structure at least partially extends toward the first outlet.
    Type: Grant
    Filed: December 23, 2020
    Date of Patent: September 20, 2022
    Assignee: ASUSTEK COMPUTER INC.
    Inventors: Chun-Chieh Wong, Cheng-Yu Wang
  • Patent number: 11439045
    Abstract: A chassis structure is disclosed. The chassis structure has a chassis with a storage space and a computer node. The storage space is provided for accommodating the computer node. The node has a body removably stored in the storage space. The body has a front and a back portion. The node has a tray frame located in the front portion. The node has a sliding assembly for longitudinally and slideably moving the tray frame between a received and a withdrawn position. The back portion has a first and a second ducting structure, and is provided for accommodating two components. The first ducting structure disposed over the first component, and the second ducting structure disposed over the second component. The first ducting structure is offset from the second ducting structure for guiding different portions of the fluid flow over the first component and the second component, respectively.
    Type: Grant
    Filed: November 12, 2020
    Date of Patent: September 6, 2022
    Assignee: YANDEX EUROPE AG
    Inventors: Andrey Olegovich Korolenko, Andrey Alekseevich Blokhin, Oleg Valerevich Fedorov, Igor Iurevich Znamenskii, Ivan Vladimirovich Prostov, Vladimir Viktorovich Khulagov, Aleksandr Alekseevich Konovalov, Konstantin Aleksandrovich Klubnichkin, Nikita Aleksandrovich Vedeneev