Abstract: An as-sliced wafer processing method includes a grinding step of grinding a first surface of an as-sliced wafer, an outer periphery positioning step of moving a chuck table and a grinding unit relative to each other in directions parallel to a holding surface of the chuck table so as to position an edge on an outer periphery of grinding stones at an outer peripheral edge of the first surface after the grinding step is carried out, and a chamfering step of chamfering an outer periphery of the first surface of the as-sliced wafer by the grinding stones after the outer periphery positioning step is carried out.

Abstract: A mobile cleaning robot can include a body, a drive wheel, and a wheel stop. The drive wheel can be connected to the body and can be operable to move the mobile cleaning robot about an environment. The wheel stop can be movable with respect to the body and the drive wheel between a stop position and a release position. The wheel stop can be engageable with the drive wheel in the stop position to limit vertical travel of the drive wheel with respect to the body.

Abstract: A chemical-mechanical polishing pad comprising a thermosetting polyurethane polishing layer includes an isocyanate-terminated urethane prepolymer, a polyamine curative, and a cyclohexanedimethanol curative. The polyamine curative and the cyclohexanedimethanol curative are in a molar ratio of polyamine curative to cyclohexanedimethanol curative in a range from about 20:1 to about 1:1.

Abstract: A pad-temperature regulating apparatus is disclosed, which includes a heat exchanger capable of being cleaned in a limited space. A pad-temperature regulating apparatus includes a heat exchanger configured to contact a polishing pad to exchange heat with the polishing pad, a moving mechanism configured to move the heat exchanger between a temperature regulating position where the heat exchanger can exchange heat with the polishing pad, and a retreat position located on a side of the polishing pad, and a cleaning mechanism configured to clean the heat exchanger moved to the retreat position. The heat exchanger has an approximate triangular shape in a horizontal cross-section, and a longest side of the heat exchanger faces the polishing pad when the heat exchanger is moved to the retreat position.

Abstract: A cleaning method capable of removing abrasive grains adhering to a light passage provided in a polishing table is disclosed. The cleaning method includes: while supplying slurry containing abrasive grains onto a polishing pad supported by a polishing table, placing a substrate in sliding contact with the polishing pad to polish the substrate; during polishing of the substrate, directing light to the substrate through a light passage provided in the polishing table, and causing reflected light from the substrate to pass through the light passage; removing the polished substrate from the polishing pad; and supplying a chemical liquid into the light passage when the substrate is not present on the polishing pad to remove the abrasive grains adhering to the light passage by the chemical liquid.

Abstract: A liquid-permeable brush roll may include a main body having a radial surface, a cavity having an open end, a stopper removably coupled to the main body at the open end of the cavity, and one or more weep holes defined in the radial surface of the main body and fluidly coupled to the cavity. The cavity extends within the main body and is configured to store a cleaning fluid therein.

Abstract: The present invention provides a scrubbing robot, including a window scrubbing device, including a suction assembly configured to be sucked to a window body, a first travelling assembly configured to move on the window body, and a window body cleaning system; and a floor scrubbing device, including a second travelling assembly configured to move on a floor and a floor cleaning system, where the body of the floor scrubbing device has a mounting recess, and the window scrubbing device is configured to be capable of being embedded into and removed from the mounting recess. The scrubbing robot is an integrally functional cleaning robot integrating multiple functions of floor sweeping, floor scrubbing, and window scrubbing.

Abstract: CMP polishing pads or layers made from a polyurethane reaction product of a reaction mixture comprising (i) a liquid aromatic isocyanate component comprising one or more aromatic diisocyanates or a linear aromatic isocyanate-terminated urethane prepolymer, and (ii) a liquid polyol component comprising a) one or more polymeric polyols, b) from 12 to 40 wt. %, based on the total weight of the liquid polyol component, of a curative mixture of one or more small chain difunctional polyols having from 2 to 9 carbon atoms, a liquid aromatic diamine, wherein the mole ratio of the total moles of hydroxyl and amino moieties in the liquid polyol, small chain difunctional polyols and liquid aromatic diamine to mole of isocyanate in the aromatic diisocyanates or linear aromatic isocyanate-terminated urethane prepolymer ranges from 1.0:1.0 to 1.15:1.0.

Abstract: A substrate processing apparatus includes a first polishing chamber, a second polishing chamber, a dry polishing chamber and a loading chamber on a turntable. The dry polishing chamber includes a polishing device on the turntable, and a chamber cover including a cover plate, an interception filter at an intake port at the cover plate, and a particle barrier connected to the cover plate. The particle barrier faces the interception filter, and is between the polishing device and the interception filter.

Abstract: A floor mopping machine includes a casing and a motor. A partition plate is arranged at a middle of the casing, and a battery is arranged at a side of the partition plate. A first support roller is provided at an end of the battery away from the motor, and a second support roller is provided at an end of the first support roller away from the battery. A set of second pressure rollers are arranged between the first support roller and the second support roller, and a set of third pressure rollers are arranged between the first support roller and a driving roller.

Abstract: CMP polishing pads or layers made from a polyurethane reaction product of a reaction mixture comprising (i) a liquid aromatic isocyanate component comprising one or more aromatic diisocyanates or a linear aromatic isocyanate-terminated urethane prepolymer, and (ii) a liquid polyol component comprising a) one or more polymeric polyols, b) from 12 to 40 wt. %, based on the total weight of the liquid polyol component, of a curative mixture of one or more small chain difunctional polyols having from 2 to 9 carbon atoms, a liquid aromatic diamine, wherein the mole ratio of the total moles of hydroxyl and amino moieties in the liquid polyol, small chain difunctional polyols and liquid aromatic diamine to mole of isocyanate in the aromatic diisocyanates or linear aromatic isocyanate-terminated urethane prepolymer ranges from 1.0:1.0 to 1.15:1.0.

Abstract: An apparatus for applying torque to a body includes a base defining an inner chamber. The apparatus includes a plurality of pins supported by base and disposed in the inner chamber, the plurality of pins moveable relative to the base between engaged positions and disengaged positions. The apparatus includes a trigger actuatable to move at least one of the plurality of pins to the disengaged position.

Abstract: The present invention discloses a wafer polishing device, which comprises a second pressure medium cavity for detecting pressure changes; a porous disc with a plurality of through holes, and its lower surface is covered with a flexible single cavity film; a conduction valve unit for conduction or isolation between the second pressure medium cavity and the third pressure medium cavity, which at least includes a conduction valve seat, a conduction valve and an elastic part. The lower end of the conduction valve seat extends into the through hole, and protrudes from the lower end face of the conduction valve seat; The conduction valve seat, the porous disc and the covered flexible single cavity membrane combined to form the third pressure medium cavity; a first pressure medium cavity.

Abstract: A method of chemical mechanical polishing includes bringing a conductive layer of a substrate into contact with a polishing pad, supplying a polishing liquid to the polishing pad, generating relative motion between the substrate and the polishing pad, monitoring the substrate with an in-situ electromagnetic induction monitoring system as the conductive layer is polished to generate a sequence of signal values that depend on a thickness of the conductive layer, and determining a sequence of thickness values for the conductive layer based on the sequence of signal values. Determining the sequence of thickness values includes at least partially compensating for a contribution of the polishing liquid to the signal values.

Abstract: An oral care implement (100) having a head (120). The head (120) has a support structure (130) and a monolithic cleaning unit (140) that is coupled to the support structure (130). The head (120) has a side surface (123) that includes a first lateral portion (124) and a second lateral portion (125). The monolithic cleaning unit (140) includes a base portion (141) that is coupled to the support structure (130) and a plurality of bristles (150) extending from the base portion (141). The plurality of bristles (150) include a plurality of first peripheral bristles (171) positioned adjacent to the first lateral portion (124) of the head (120), a plurality of second peripheral bristles (172) positioned adjacent to the second lateral portion (125) of the head (120), and a plurality of central bristles (175).

Abstract: A substrate processing apparatus includes: a holding portion configured to hold a substrate including a bevel and an end surface in a peripheral edge portion of the substrate; a rotator configured to rotate the holding portion; a polishing head configured to be brought into contact with the peripheral edge portion of the substrate held by the holding portion and to polish the peripheral edge portion of the substrate; and a holder to which the polishing head is installed.

Abstract: A method of chemical mechanical polishing includes bringing a substrate having a conductive layer disposed over a semiconductor wafer into contact with a polishing pad, generating relative motion between the substrate and the polishing pad, monitoring the substrate with an in-situ electromagnetic induction monitoring system as the conductive layer is polished to generate a sequence of signal values that depend on a thickness of the conductive layer, determining a sequence of thickness values for the conductive layer based on the sequence of signal values, and at least partially compensating for a contribution of conductivity of the semiconductor wafer to the signal values.

Abstract: A power clamp includes a body. A piston assembly is coupled with the body. The piston assembly includes an actuation mechanism and a movable piston rod. A linkage is housed in the body. The linkage is movably coupled with the piston rod. A plunger is movably coupled with the linkage. A clamp hook is coupled with the plunger for clamping a workpiece. The linkage moves the clamp hook between a release and clamping position.

Abstract: A screw driving tool includes a torque output element which defines an axis and is mounted in a housing, a torque transmission section with a plurality of depressions, and a torque transmission element, which is pretensioned by the force of a force accumulator and engages into at least one of the depressions, for coupling the torque transmission section to the housing so as to transmit a torque. The coupling is released when the torque transmission element leaves the depression in an edge-controlled manner against the force of the force accumulator, which is adjustable by an adjustment device, when a limit torque is exceeded. A switchover element is movable from a release position into a blocking position and allows the torque transmission element to leave the depression in the release position but blocks the torque transmission element in the blocking position.

Abstract: An autonomous floor cleaning system includes an interlock for physically interlocking an autonomous floor cleaner with a docking station. The interlock selectively engages when the robot is docked at the docking station, and can automatically engage as when a predefined locking criterion is met. The interlock can remain engaged until a predefined unlocking criterion is met. Methods for docking an autonomous floor cleaner with a docking station are disclosed.