Abstract: A plating apparatus for forming a wiring pattern on a surface of a semiconductor wafer by causing a plating liquid into contact with the surface of the semiconductor wafer, comprises a storage tank storing and heating a plating liquid, a plating tank provided adjacent to the storage tank and having an opening formed in a wall at the side opposite to the side adjacent to the storage tank. The plating tank is supplied with the plating liquid from the storage tank, and the opening is configured to bring the surface of the semiconductor wafer into contact with the treatment liquid within the treatment tank. A holding mechanism is provided for holding the semiconductor wafer vertically and pushing the surface of the semiconductor wafer to the opening. With this arrangement, it is possible to prevent the unevenness of the plating which would otherwise have been caused by the bubbles generated in the process of the plating.

Abstract: In a process of electroforming a metal to produce a dental prosthesis, the improvement comprising employing as the metal a metallic glass alloy such as cobalt and phosphorus containing 8-30% by weight of phosphorus. The electrolytic bath comprises:15-300 g/L CoSo.sub.4.7H.sub.2 O40-80 g/L CoCl.sub.2.6H.sub.2 O25-35 g/L H.sub.3 BC.sub.330-100 g/L H.sub.3 PO.sub.31-2 ml/L wetting agentpH about 0.8-2.0.

Abstract: A system is provided for regenerating reducing agents used in ancillary chemical or electrochemical processes such as restoring solderability of electronic components. The system includes a cathode, an anode, and an electrolyte system that is separated by a semipermeable ionic barrier into a catholyte and an anolyte. The catholyte includes the reduced member of a redox couple, which can be regenerated electrochemically. The redox couple of the electrolyte system is charged like a battery and discharged during the ancillary process. Regeneration of the reduced member of the redox couple is accomplished at the cathode. The cathode comprises an electrode having a high hydrogen overvoltage so that sufficiently negative potentials can be attained while minimizing hydrogen evolution. Chemical balance is maintained by the semipermeable ionic barrier, which permits proton migration from the anolyte to the catholyte but acts as a barrier against diffusion and migration of cations from the catholyte to the anolyte.

Abstract: A process for applying silver-graphite dispersion electrodeposits from an electrolyte with a conducting salt that is free of free cyanide. The process facilitates working at relatively high current densities to achieve high speed plating.

Abstract: An organic solvent electrolyte is provided for electrolytically forming a plating film on the surface of a R.sub.2 T.sub.14 B intermetallic compound permanent magnet. The organic solvent electrolyte comprises a metallic salt including at least one metalic element with a supporting electrolyte, the balance being an organic solvent for forming a plating film on the surface of a R.sub.2 T.sub.14 B intermetallic compound permanent magnet, wherein R denotes a rare earth element including Y and T denotes a transition metal including R, Fe and B as main components. The supporting electrolyte includes at least one selected from a group consisting of:(1) a boric acid compound including at least one of R'.sub.3 BO.sub.3 methyl, ethyl, propyl, butyl group, MBO.sub.2 (in which M denotes H or Na, K, Li metal), M'BO.sub.3 (M' denotes B or Na, K, Li metal), M'"BO.sub.x O.sub.(3x+2)/2 (X is an even number of more than 2).(2) a C10.sub.4 salt of an alkali metal or tetraalkylammonium including at least one of M'C10.sub.

Abstract: The method of the invention deposits positively charged metal species, preferably platinum-amine, at sites where the negatively charged sulfonic acid groups of the SPE are in contact with carbon. Then an electrochemical reaction causes formation of elemental metal (platinum) particle from the metal species at these sites. Platinum localization is achieved by electro-depositing platinum from a dilute electrolyte consisting essentially of tetramine platinum (II) chloride Pt(NH.sub.3).sub.4 Cl.sub.2 electrolytes. Copper deposition is achieved by electrodepositing copper from a dilute electrolyte consisting essentially of copper sulfate.

Abstract: The disclosure relates, inter alia, to a composition and, a method of making the composition. The composition comprises an electrically conductive polymer having a porous structure and a compound formed in situ and coating at least a portion of the surfaces of said polymer. The method of making the composition comprises forming an electrically conductive polymer having a porous structure, contacting the surfaces of the polymer with a solution comprising chemical species capable of being electrochemically formed into a coating material on the surfaces of said structure and electrochemically forming the coating material on the surfaces of the structure.

Abstract: A method and apparatus for the uniform electroplating of printed circuit boards is described. At least one non conductive apertured mask covers selected areas of the electroactive surface of the anode or cathode electrode, whereby to establish substantially uniform electroplating ion transfer over the target areas of the target cathode.

Abstract: An apparatus and method for electroplating a graphite-epoxy workpiece in-situ. An electroplating assembly includes a rigid base that is retained a fixed distance about the surface region by insulated standoff legs. A flexible vacuum bag is coupled to the graphite-epoxy workpiece with a fluid-tight seal. The vacuum bag surrounds the surface region and encloses the rigid base to form a plating chamber. A supply chamber, containing a plating fluid, is coupled to the plating chamber by a fluid-tight tubing. A storage chamber is coupled to the plating chamber by a fluid-tight tubing. A vacuum source is coupled by tubing to the supply chamber and to the storage chamber. Valves in each tubing permit the selective coupling of the vacuum source and plating chamber to either the supply chamber or the storage chamber. Electroplating is carried out while plating fluid is drawn by the vacuum, from the supply chamber into the plating chamber and into the storage chamber.

Abstract: A manufacturing method for a vacuum fluorescent display is performed by the steps of dividing a substrate into a plurality of areas, and sequentially forming a signal line, an insulating layer, and a segment electrode on each area, arranging common wiring layers with a predetermined distance therebetween on the substrate to be electrically connected to all signal lines formed on the substrate, submerging the substrate into a container filled with a dispersed fluorescent material, and settling the fluorescent material on the segment electrode by applying power to the common wiring layers, and forming rear plates by cutting the substrate having the fluorescent material settled thereon into the plurality of individual areas. A separate settling jig is not required, and cost for the formation of the settling jig and manpower for its handling can be reduced, so that productivity is enhanced.

Abstract: The present invention relates to a manufacturing method for an orifice plate to be used for an ink jet printer or the like. First, a master having a predetermined pattern firmly provided on a substrate is prepared. An electroformed film is then formed on the master by an electroforming method. Finally, the electroformed film is separated from the substrate. In this case, the mask pattern is firmly provided on the substrate, and a mechanical strength of the mask pattern itself is large. Furthermore, the mask pattern is insoluble to an alkali aqueous solution. Thus, the master can be reused, and it can be strongly washed. Accordingly, the master has a durability to repeated usage, thereby contributing to an improvement in the quality of the orifice plate to be manufactured and a reduction in the manufacturing cost.

Abstract: A method of manufacturing printed wiring board is disclosed. The method comprising steps of providing a double-sided copper clad laminate; embedding a conductive ink into a through hole provided in the copper clad laminate; subjecting the opposing surfaces of the double-sided copper clad laminate to copper electroplating to form a copper plated layer after curing the conductive ink under the given conditions; providing a circuit for displacing component mounting lands onto the copper plated layer directly over the cured conductive ink with the use of a dry film or ink for forming other circuit; and forming a printed wiring circuit with the material removing treatment.

Abstract: Thick layers of hard dense chromium coatings are formed on metal substrates by an electrolytic brush plating operation in which a lead-tin electrode having a porous polypropylene felt topped by an polypropylene molded brush element is maintained during coating continuously over the area to be electrolytically coated. The correct current density and flow of electrolytic coating solution as well as relative movement between the anode and brush element and the work piece are closely controlled to enable the hard chromium coating to be produced.

Abstract: An infrared cold shield comprises a side wall, a top wall and at least one baffle extending across the interior of the cold shield. The top wall and baffles comprise aligned apertures. The cold shield is preferably made by securing one or more metal foil disks and aluminum mandrel segments in an alternating stacked arrangement wherein the outer edges of the metal foil disks are exposed. The assembly is then electroplated to deposit a layer of metal over the side surfaces of the mandrel segments and to capture and bond with the exposed edges of the metal foil sections. The mandrel segments are then dissolved.

Abstract: A method for manufacturing a tin-electroplated cold-rolled steel strip, which comprises the steps of: continuously annealing a degreased cold-rolled steel strip; then, subjecting, following the continuous annealing treatment, the continuously annealed cold-rolled steel strip to a continuous tin-electroplating treatment in a tin-electroplating bath to form, on at least one surface of the cold-rolled steel strip, a tin-electroplating layer having a plating weight within a range of from 0.1 to 2.8 g/m.sup.2 per surface of the cold-rolled steel strip; and then, temper-rolling, following the continuous tin-electroplating treatment, the cold-rolled steel strip having the tin-electroplating layer on at least one surface thereof, at a reduction ratio within a range of from 1 to 5%.

Abstract: Process for the manufacture of dental or maxillo-facial prostheses, particularly endo-osseous prostheses or pivots, in which a layer of pure aluminum is deposited on a conductive substrate, preferably a metal, which forms the core of the prosthesis. The aluminum layer is obtained by electrochemical deposition of pure aluminum with non-aqueous electrolyte base of the type which has an aluminumorganic complex bath. The layer is then oxidized by anodization such that an alumina layer which is sealed and electrically insulated, is obtained, separating the core and the biological tissues surrounding the prosthesis.

Abstract: The present invention provides a method of producing a zinc-chromium alloy-plated steel sheet having excellent properties such as bare corrosion resistance, corrosion resistance after coating, plating adhesiveness and weldability.The method is characterized by plating the surface of the steel sheet using an acid plating bath containing zinc ion (Zn.sup.2+) and chromium ion (Cr.sup.3+) at a molar concentration ratio of about 0.1.ltoreq.Cr.sup.3+ /(Zn.sup.3+ +Cr.sup.3+).ltoreq.0.9 in a total amount of at least about 0.5 mol/1 within the dissolution range, and about 0.1 to 30 g/1 of at least one nonionic organic additive having at least a triple bond, at a bath temperature of about 25.degree. to 70.degree. C. and a pH of about 1.0 to 4.0 with a current density of about 50 to 200 A/dm.sup.2.

Abstract: An apparatus and corresponding method for electroplating wafers includes supporting a plurality of wafers on a backing board in the electroplating tank such that one surface of each wafer is masked from the electrolytic reaction. A programmable controller is used to regulate the waveform, frequency and duration of current passing between each individual wafer and a corresponding anode electrode during the electroplating process. Voltage is monitored between the wafers and the anode electrodes to ensure a proper electrical connection is maintained with each individual wafer during the electroplating process.

Abstract: A method for selectively electroplating a metallic coating, such as solder, onto a plurality of small and closely spaced electrical contacts. The method includes sealingly enclosing the contacts in an electroplating cell having an anode, a cathode and a chamber, forming an electrical connection between the cathode and the contacts and electroplating the contacts.

Abstract: In a method of grinding a workpiece employing a metallic grinding wheel sorting a non-conductive abrasive medium, a cathode is provided in spaced relationship with the abrasive surface so as to define a gap therewith. Electrolyte is caused to flow through the gap, and a low direct current is passed between the grinding wheel and the cathode through the electrolyte so that a small amount of metal is continually removed from the grinding wheel so that material trapped in the abrasive surface is dislodged and flushed away by the electrolyte flowing through the gap.