Abstract: A method and apparatus for selectively electroplating a metallic coating, such as solder, onto a plurality of small and closely spaced electrical contacts. The method includes sealingly enclosing the contacts in an electroplating cell having an anode, a cathode and a chamber, forming an electrical connection between the cathode and the contacts and electroplating the contacts.

Abstract: A method for fabricating solid electrolytic capacitors which comprises providing a valve metal foil having a dielectric film and a conductive inorganic film formed on the valve metal foil in this order, contacting an electrode for electrolytic polymerization with part of the valve metal foil wherein the electrode is made of a material incapable of undergoing anodization in an electrolytic polymerization solution, subjecting the valve metal foil to electrolytic polymerization by application of a potential between the electrode and a counter electrode to form a conductive polymer film on the conductive inorganic film, and removing the electrode along with the contacted portion of the valve metal foil. At least one conductive paste film may be formed on the conductive polymer film prior to the removal of the electrode. In addition, an insulating film may be formed on an exposed portion of the valve metal foil after the removal of the electrode.

Abstract: A method of manufacturing a magnetic disk substrate made of titanium, in which chemical etching is performed on a titanium disk for magnetic disk substrate, thereby removing a surface portion thereof having a thickness of at least 2 nm, and the new surface of the titanium disk, formed by the chemical etching, is anodized, thereby forming anodized film on the titanium disk.

Abstract: An electroforming process for forming a multilayer endless metal belt includes forming increasingly compressively stressed successive layers on a mandrel, and assembling the layers to form a multilayer belt. The belt is particularly useful as a driving member for a continuously-variable transmission.

Abstract: Durable and clear blue color of freely controlled density can be expeditiously and efficiently impated to an anodic oxide film of aluminum by a method which comprises forming the anodic oxide film on the aluminum or aluminum alloy, then subjecting the aluminum or aluminum alloy to AC electrolysis in a bath containing an inorganic ferrous salt as a main component thereof thereby inducing deposition of iron in the pores of the oxide film, and subsequently placing the aluminum or aluminum alloy as an anode in a bath containing hexacyano iron (II) acid salt as a main component thereof and subjecting the same to DC electrolysis therein. In the alternative method, the pore-widening treatment is added next to said step of anodic oxidation. The pore-widening treatment is effected by immersing the aluminum or aluminum alloy in sulfuric acid or phosphoric acid or electrolyzing the same in phosphoric acid or a mixed solution of phosphoric acid and sulfuric acid.

Abstract: A method for forming a plurality of solder bumps on an electronic component substrate utilizes a transfer plate to electrodeposit solder deposits and subsequently reflow the deposits onto the substrate. The plate comprises discrete pad electrodes formed of a ceramic material that is suitably electrically conductive to permit electroplating of the solder alloy, but is not wet by the molten solder to permit reflow onto the substrate. A preferred electrode material is an indium oxide compound. The solder deposits are plated onto the electrodes, and the transfer plate is superposed on the substrate such that the bumps rest upon bond pads on the substrate. The assembly is heated and cooled to melt and resolidify the solder alloy, whereupon the solder bonds to the substrate pads to form the bumps.

Abstract: A one-step electrolytic process and apparatus for producing metal foil, e.g., copper foil having a low profile treated surface for use in fabricating printed circuit boards, wherein primary foil is electrodeposited on a cathode in a first electrodeposition zone using a first current density while circulating electrolyte therein under turbulent flow conditions, and micronodules of the metal are electrodeposited on a matte surface of the primary foil in a second electrodeposition zone using a second current density greater than the first current density while circulating electrolyte therein under laminar flow conditions. A grain refining agent is employed in the electrolyte to further improve the quality. The process provides a low profile finished foil having a high peel strength.

Abstract: The conveying trough of the vibrator conveyor is disposed spirally around a central pipe and is surrounded by a gasproof vessel. This vessel contains a treatment medium, preferably an electrolyte free of oxygen and water, into which the vibrator conveyor with thee central pipe dips partially. According to the invention, a gas cushion (10) is provided between the bottom (3) or the cover (4) of the central pipe (2) and the bottom (8) of the vessel (6). In this form of realization bulk material can be transported over great differences in height.

Abstract: Copper conductive foil for use in preparing printed circuit boards is electrodeposited from an electrolyte solution containing copper ions, sulphate ions, animal glue and thiourea. The thiourea operates to decrease the roughness of the foil, to enable operation at higher current densities and/or to modify the ductility characteristics of the foil.

Abstract: A method of forming a conductive electrode bump on a first side of a dielectric substrate. The electrode bump is located such that it is in electrical contact with one end of an electrically conductive via passing through the substrate. An electrically conductive test pad, located on a second side of the substrate, is in electrical contact with the opposite end of the via. The method includes the steps of (a)forming a layer of conductive material of generally uniform thickness onto the first side of the substrate, the layer being in a routing pattern for routing electrical signals along the first side; and (b)selectively reducing the thickness of the layer in locations defining the routing pattern to a greater extent than in the location of the bump to provide a bump, that extends from the first side at a height greater than the routing pattern.

Abstract: In accordance with one embodiment, a method for increasing the useful working life of a tool comprises providing a bath capable of removing a surface region of an unused tool containing material near the surface under mechanical stress, immersing the tool in the bath and applying an electric potential for a time period sufficient to remove the region.

Abstract: A method is disclosed for producing an anodized film on titanium, its alloys and other metals such that the film deposited will have a specific leak rate of less than one nanoamp per square centimeter at room temperature with an impressed electric field of at least five volts, where the anodization is performed in a solution consisting of liquid ortho-phosphoric acid of reduced water content in an aprotic solvent, and articles of manufacture therefrom.

Abstract: An electroplating apparatus having a plurality of upper electrolyte feeder elements and upper electrolyte discharge elements aligned transversely relative to a throughput path of the printed circuit boards and arranged in alternation above the throughput path, a plurality of lower electrolyte feeder elements and lower electrolyte discharge elements aligned transversely relative to the throughput path and arranged in alternation under the throughput path, wherein each lower electrolyte discharge element is positioned opposite an upper electrolyte feeder element and each upper electrolyte discharge elements is positioned opposite a lower electrolyte feeder element, and wherein vertical and horizontal flow components of the electrolyte solution result and their direction alternatingly changes as seen along the throughput path of the printed circuit boards.

Abstract: A method for coating implantable medical devices, such as orthopaedic prostheses, with a dense, substantially non-porous oxide coating so as to minimize ion release therefrom, and the product of that process is described. The prosthesis is subjected to anodic electrolytic deposition in an alcoholic electrolyte containing alkali metal nitrate or nitric acid. In a preferred embodiment the anodically coated prosthesis is also coated with a bioactive layer of calcium phosphate.

Abstract: An acid etching bath for activating titanium alloy components, especially turbo-machine blades and discs, before macrographic anodic oxidation in an electrochemical etching process, known as the "blue-etch" process, for the non-destructive checking of the components, comprises 75.+-.5 ml/1 of sulphuric acid, from 11 to 15 g/1 of sodium fluoride, and water as the balance.

Abstract: A circuit is produced by using a formed mandrel (10,12) and semi-additive techniques for creating circuit traces. A stainless steel mandrel (10) flash plated with copper (14) includes a depression (12) which will form a raised interconnection feature (24). Using a photolithographically formed pattern of photoresistive material (16) on the mandrel the selected pattern of circuit traces (18,20) and raised features (24) are electroplated onto the flash plated mandrel. After stripping the photoresist (16), a dielectric substrate (26) is laminated to the circuit traces, effectively encapsulating the traces on three sides. After removing the laminated circuit traces and dielectric from the mandrel the flash plated copper (14) is removed and the circuit covered with an insulation coverlay.

Abstract: A process for electroplating a nonconducting substrate comprising formation of a catalytic metal sulfide on the surface of a nonconducting substrate and electrolytic deposition of metal thereover. The catalytic metal chalcogenide is preferably palladium sulfide.

Abstract: An apparatus for continuous electrolytic treatment of an article of aluminum web or an aluminum alloy including an electrolytic part, a pre-stage power supply part provided upstream of the electrolytic part, a post-stage power supply provided, downstream of the electrolytic part and a power source, at least one electrode in the pre-stage power supply part and at least one electrode in the post-stage power supply part part being connected with one pole of the power source, and at least one electrode of the electrolytic part being connected with the other pole of the power source. This apparatus can decrease a running cost such as the electric cost and the cooling cost as well as the facilities cost, can conduct a high speed treatment and increase the thickness of a film without fusing an aluminum article, even if the aluminum article has a small sectional area, such as a wire, a foil or a thin web.

Abstract: An improved treatment for copper foil comprising electrodepositing a metallic barrier layer of copper, zinc and antimony on at least one side of the foil which, preferably, has a matte surface formed prior to forming the barrier layer. The so-treated foil provides a high bonding strength when laminated to polymeric substrates and resists undercutting by mineral acid etchants and rinses during production of printed circuit boards.

Abstract: A method and apparatus for retarding the pitting of aluminum by coating the luminum with a film which includes molybdenium oxide.The aluminum material is preexposed to a molybdate solution before anadizing in a sodium tartrate solution.