Patents Examined by Tho Duong
  • Patent number: 7428919
    Abstract: A heat exchanger evaluation system (84) includes a refrigeration subsystem (126) and a platform (94) in communication with the subsystem (126) for attachment of a heat exchanger (32). The system, (84) further includes a thermal imaging camera (168) and a monitor (100). A method (180) entails routing a fluid (38) through the heat exchanger (32) via the refrigeration subsystem (126). The camera (168) detects the temperature variation across the heat exchanger (32) as the fluid (38) flows through the heat exchanger, and provides successive thermal images representing the temperature variation responsive to the flow of the fluid (38). The thermal images are utilized to determine an efficacy of the flow through the heat exchanger (32). In particular, a determination can be made as to whether the flow deviates from a pre-determined flow path (79) of the fluid (38) through the heat exchanger.
    Type: Grant
    Filed: August 2, 2004
    Date of Patent: September 30, 2008
    Inventors: David P. Young, John Allen Coates, James D. Snow
  • Patent number: 7367385
    Abstract: The invention includes a heat transfer geometry having first and second flow channels in parallel with each other. The flow cross-sectional area of individual channels varies along the length of the flowpath, with one channel undergoing an expansion and the other undergoing a contraction. Different amounts of additional heat transfer surface are located within different regions. In at least some instances, contraction and expansion may occur as a result of a shift of both the left and right boundaries which principally define the channel, and may occur symmetrically with respect to a centerline of the individual channel. With a cell being a first channel and associated second channel, the overall exiting flow may be offset slightly from the overall entering flow. An array may be formed containing multiple cells, and cells at edges of the array may be atypical so that the overall array fits within a simple geometric envelope.
    Type: Grant
    Filed: June 30, 2005
    Date of Patent: May 6, 2008
    Inventor: Peter A. Materna
  • Patent number: 7360580
    Abstract: A heat exchanger is mounted external to a section of flue pipe or is an integral part of a section of flue pipe. The heat exchanger preheats a domestic hot water supply and boosts the return water temperature prior to reentry to the furnace coil. The heat exchanger reduces fuel use, pollution and wear of the furnace and burner. A typical heat exchanger installation includes an oil or gas burner located on a furnace or boiler having a flue pipe leading to a gaseous outlet, such as a masonry chimney. A short vertical flue section leads to a draft-regulating damper. The flue heat exchanger may be a coil of tubing wrapped around flue section, such that the tubing picks up heat from the heated flue gasses. Preheated water exits from the heat exchanger.
    Type: Grant
    Filed: March 12, 2007
    Date of Patent: April 22, 2008
    Inventor: Joseph C. Ferraro
  • Patent number: 7357174
    Abstract: A supporting seat includes a base adapted to be securely connected to the heat conductive plate, two arms extending obliquely from the base from two opposed sides of the base, two engagement plates each formed on a free end of a corresponding arm and adapted to engage with a bottom face of a lowermost one of the heat dissipating fins and multiple through holes defined through each of the two engagement plates for extension of the heat dissipating tubes. Weight of the heat dissipating fins is supported and deformation of the heat dissipating tubes is prevented.
    Type: Grant
    Filed: May 30, 2006
    Date of Patent: April 15, 2008
    Assignee: Cooler Master Co., Ltd.
    Inventors: Tsung-Jui Hsu, Ying-Lin Hsu
  • Patent number: 7353863
    Abstract: A method of surface treating an aluminum alloy base body of an heat exchanger which method enables an etching procedure to be carried out uniformly and quickly and a corrosion-resistant chemical conversion coating to be formed, is effected by pretreating the Al heat exchanger base body with an aqueous pre-treating liquid having a pH of 9.0 or less, etching the pretreated base body with an aqueous alkaline solution having a pH of 9.0 or more, and then subjecting the etched base body to a chemical conversion treatment or a hydrophilicity-enhancing treatment.
    Type: Grant
    Filed: May 12, 2004
    Date of Patent: April 8, 2008
    Assignee: Denso Corporation
    Inventors: Kengo Kobayashi, Osamu Kasebe, Hiroyoshi Sugawara, Kazuhisa Uchiyama, Kenji Karube, Kazunari Hamamura, Kensuke Shimoda
  • Patent number: 7353862
    Abstract: A liquid cooling device (10) includes a heat sink (12), a panel (14) distant from the heat sink, a heat transfer member includes a heat exchanger (22) thermally engaging with the heat sink and at least one heat pipe (24), a duct (16) connecting with the panel, a flexible tube (18) connected to the duct and the heat exchanger. Therefore, the panel, the duct, the flexible tube and the heat exchanger cooperatively form a hermetical liquid container filled with liquid therein. The at least one heat pipe is extended in the liquid container and submerged in the liquid to transfer heat from one place near to the heat sink to another place in the panel.
    Type: Grant
    Filed: October 3, 2005
    Date of Patent: April 8, 2008
    Assignees: Fu Zhun Precision Industry (Shenzhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Li He, Tsung-Lung Lee
  • Patent number: 7347254
    Abstract: The invention relates to a heat exchanger for motor vehicles, having a large number of flat tubes through which a liquid cooling medium can flow, and having corrugated fins which are associated with these flat tubes and to which environmental air or other media can be applied. The flat tubes having indentations pointing inward on at least one of their flat faces. Heat transfer between the core flow of the cooling medium and the flat tube walls is improved, and the power density of the heat exchanger is thus increased. The indentations are preferably in the form of elongated vortex generators.
    Type: Grant
    Filed: July 21, 2004
    Date of Patent: March 25, 2008
    Assignee: BEHR GmbH & Co.
    Inventors: Eberhard Pantow, Arnoldt Rehm, Rainer Richter, Lubens Simon
  • Patent number: 7347252
    Abstract: An improved centrifugal impeller having between 20 and 26 rearwardly curved blades blades, a ratio of blade annulus width to wheel radius between 0.31 and 0.37, and an inlet blade angle in the range 32° to 36° and a discharge blade angle in the range 36° to 40°.
    Type: Grant
    Filed: October 28, 2004
    Date of Patent: March 25, 2008
    Assignee: The Bergquist Torrington Company
    Inventor: John F. O'Connor, Jr.
  • Patent number: 7337829
    Abstract: A cooling unit has a heat receiving unit that receives heat from a body radiating heat; a radiator disposed at a distance from the heat receiving unit and radiating recovered heat; a liquid coolant transporting heat generated at the heat receiving unit to the radiator; and a hollow tube disposed so that the liquid coolant circulates between the heat receiving unit and the radiator, a circulating flow of the liquid coolant formed by an elevating force of air bubbles generated from the heat received at the heat receiving unit, the radiator having an air pocket forming one part of the circulation path of the liquid coolant together with the hollow tube and capable of collecting the air bubbles.
    Type: Grant
    Filed: April 7, 2003
    Date of Patent: March 4, 2008
    Assignee: Fujitsu Limited
    Inventors: Ryuuji Miyazaki, Masumi Suzuki, Minoru Hirano
  • Patent number: 7331376
    Abstract: A stackable spacer element for use in a energy recovery core formed by stacking a plurality of relatively thin energy transfer media (e.g. sheets, panels, or plates (un-perforated exchanger sheets) so as to define a plurality of stacked energy transfer stages providing air passages for two separate air flows.
    Type: Grant
    Filed: December 19, 2003
    Date of Patent: February 19, 2008
    Assignee: Venmar Ventilation Inc.
    Inventors: Martin Gagnon, Martin Gamelin, Michel Julien
  • Patent number: 7325593
    Abstract: It is an object of the present invention to provide an inexpensive heat radiating fin having a high cooling effect. A coating metal layer consisting of a metallic material with an ionization tendency larger than that of silver is coated on a surface of a heat radiating fin main body by plating or the like to form the heat radiating fin. Thus, the coating metal layer has a layer thickness which increases a difference between a heat capacity of the coating metal layer and a heat capacity of the air, and facilitates chemical adsorption of molecules in the air. The heat radiating fin radiates heat while being brought into contact with the air serving as a cooling fluid.
    Type: Grant
    Filed: March 19, 2002
    Date of Patent: February 5, 2008
    Assignee: Suikoh Top Line Co., Ltd.
    Inventor: Masami Kujirai
  • Patent number: 7325590
    Abstract: A cooling structure for a portable computer includes a cooling fan creating an air stream to release heat generated in a main body of the computer to the outside through at least one vent. First and second heat pipes transfer heat generated in first and second heat sources on a main board of the computer to a path of the air stream. A portion of the air stream is also directed to the interior of the main body.
    Type: Grant
    Filed: October 18, 2004
    Date of Patent: February 5, 2008
    Assignee: LG Electronics Inc.
    Inventors: Ye Yong Kim, Ki Tak Ko
  • Patent number: 7322401
    Abstract: Ventilator including a case having a first flow passage and a second flow passage therein, at least one fan in the case for supplying room air to a room through the first flow passage, and guiding outdoor air to the room through the second flow passage, and a heat exchanger in the case, the heat exchanger having a working fluid therein for repeating evaporation (heat absorption) and condensing (heat dissipation) by a temperature difference of the air flowing through the first flow passage and the second flow passage, for making the air flowing through the first flow passage and the air flowing through the second flow passage to heat exchange, thereby providing a ventilator which is thin, can be installed conveniently, and can recover a thermal energy from room air, and reduce a pressure loss and noise.
    Type: Grant
    Filed: February 3, 2005
    Date of Patent: January 29, 2008
    Assignee: LG Electronics Inc.
    Inventor: Jeong Yong Kim
  • Patent number: 7316264
    Abstract: A heat pipe includes a tubular member, a capillary wick, and a liquid. The tubular member has a plurality of capillary ditches formed on an internal sidewall thereof. The capillary wick is disposed on the internal sidewall of the tubular member and located on openings of the capillary ditches for covering and sealing the ditches. The liquid is contained inside the tubular member. The capillary wick and ditches provide the liquid with larger cross-sectional area for the capillary action to enhance guidance of the liquid and to further enhance the thermally conductive efficiency.
    Type: Grant
    Filed: August 12, 2005
    Date of Patent: January 8, 2008
    Assignee: Tai-Sol Electronics Co., Ltd.
    Inventors: Yaw-Huey Lai, Chih Ming Liu
  • Patent number: 7316265
    Abstract: In one embodiment, a method includes forming a conductive structure having a cavity, injecting a phase change material into the cavity, injecting a plurality of spheres into the cavity, and sealing the cavity.
    Type: Grant
    Filed: November 17, 2003
    Date of Patent: January 8, 2008
    Assignee: Intel Corporation
    Inventors: Damion T. Searls, Terrance J. Dishongh, David Pullen
  • Patent number: 7316261
    Abstract: A heat exchanging system of a ventilating device includes: a heat exchanging housing communicating with an outdoor air passage and an indoor air passage; a rotational shaft rotatably supported at one side of the case of a ventilating device; and a heat exchanging elements mounted at an outer circumferential surface of the rotational shaft at regular intervals, and performing a heat-exchanging operation of outdoor air and indoor air while being rotated by a wind force of outdoor air passing the outdoor air passage and a blow force of indoor air passing the indoor air passage. Thus, any additional driving unit is not necessary to rotate the heat exchanging system, so that a fabrication cost can be reduced, the overall size of the ventilating device can be reduced, and a noise and vibration can be reduced.
    Type: Grant
    Filed: December 6, 2002
    Date of Patent: January 8, 2008
    Assignee: LG Electronics Inc.
    Inventors: Min-Chul Cho, Soo-Yeon Shin, Seong-Hwan Lee
  • Patent number: 7311138
    Abstract: A stacking-type, multi-flow, heat exchanger includes heat transfer tubes and fins, which are stacked alternately, an end plate disposed at an outermost position of the stacked heat transfer tubes and fins in a stacking direction, and inlet and outlet pipes connected to the end plate. The heat exchanger includes a pipe connection plate provided on the end plate, having a pipe insertion hole formed therethrough, into which at least one of the inlet and outlet pipes is inserted and which temporarily fixes an end portion of an inserted pipe in the pipe insertion hole. The pipe connection plate and the entire heat exchanger may be formed with a reduced size and weight, and the brazing quality between the plate and the pipe may be improved.
    Type: Grant
    Filed: May 24, 2005
    Date of Patent: December 25, 2007
    Assignee: Sanden Corporation
    Inventors: Kengo Kazari, Tomohiro Chiba, Takayuki Ohno
  • Patent number: 7308931
    Abstract: A cooling apparatus may include an attach block manufactured using at least partially a graphite material. The attach block may be coupled to two heat pipes. The graphite material may be positioned in between the two heat pipes and in a direction that enables high heat conductivity and low thermal resistance.
    Type: Grant
    Filed: December 1, 2004
    Date of Patent: December 18, 2007
    Assignee: Intel Corporation
    Inventor: Himanshu Pokharna
  • Patent number: 7306027
    Abstract: A fluid-containing cooling plate includes a bottom plate, a top plate, and metal wire or tubing formed into a circuit and sandwiched between the plates to form a chamber. The wire is plated or otherwise coated with a brazeable or solderable alloy which bonds it to the plates when the assembly is heated, thereby sealing the chamber. To make a two-phase cooling plate, slugs of plated metal are placed in the chamber and are bonded to the plates to provide support against collapse. The chamber is provided with a wicking structure, and is partially filled with an evaporable fluid via an inlet. A partial vacuum is then drawn, and the inlet is closed off. To make a single-phase cooling plate, wire partitions serving as baffles are provided in lieu of the slugs. These partitions can be arranged to provide a serpentine flow path between the inlet and an outlet, and are likewise plated with an alloy which melts to bond them to the plates.
    Type: Grant
    Filed: July 1, 2004
    Date of Patent: December 11, 2007
    Assignee: Aavid Thermalloy, LLC
    Inventors: Bradley R. Whitney, Randolph H. Cook, John R. Cennamo, Sukhvinder S. Kang
  • Patent number: 7303001
    Abstract: A heat pipe (20) includes a pipe (21), a wick (22), and an operating fluid. The wick is fixedly engaged with an inside wall of the pipe. The operating fluid is sealed in the pipe and soaks the wick. The operating fluid includes a pure liquid, and a plurality of carbon nanocapsules (23) suspended in the pure liquid. The pure liquid can be selected from the group consisting of pure water, ammonia, methanol, acetone and heptane. Each carbon nanocapsule is a polyhedral carbon cluster (231), with a metal (232) having high thermal conductivity filled therein. The operating fluid has high thermal conductivity and uniform operation, and is recyclable with no pollution of the environment. The heat pipe has correspondingly high thermal conductivity.
    Type: Grant
    Filed: August 31, 2004
    Date of Patent: December 4, 2007
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventors: Charles Leu, Tai-Cherng Yu, Ga-Lane Chen