Patents Examined by Tho Duong
  • Patent number: 7191824
    Abstract: A core for a charge air cooler comprises inner and outer concentric tubes providing an axially extending annular passageway for flow of a fluid, preferably a liquid coolant. A first inlet and a first outlet are provided at the ends of the axial annular passageway. Arranged on an outer surface of the outer tube is at least one circumferential fluid flow passageway for flow of a fluid, preferably air. Each circumferential flow passageway is provided with a corrugated strip fin comprising a plurality of rows of corrugations. The core is combined with an outer housing to form a heat exchanger. The housing is provided with an inlet and an outlet for the fluid flowing through the circumferential flow passageways. Other embodiments are disclosed in which the heat exchanger is adapted for use with three fluids and in which additional cooling capacity is provided by the provision of coolant passageways in the housing.
    Type: Grant
    Filed: November 21, 2003
    Date of Patent: March 20, 2007
    Assignee: Dana Canada Corporation
    Inventors: Alan K. Wu, Brian E. Cheadle, Eric Luvisotto
  • Patent number: 7185696
    Abstract: A cooling element for heat dissipation in one or more electronic components includes a metal element with one or more slit-shaped receiving openings for one or more electronic components that are to be cooled. In its lengthwise extension, each receiving opening has a receiving bore that holds a helical spring and that runs parallel to the lengthwise extension. The receiving bore is arranged in such a way that it is open on the lengthwise side towards the receiving opening and the spring placed in it projects with a radial partial section into the receiving opening that holds the electronic component. As a result, in partial areas, the spring presses the electronic component against the inner wall of the receiving opening that lies opposite from the spring, thus establishing thermal contact.
    Type: Grant
    Filed: June 8, 2004
    Date of Patent: March 6, 2007
    Assignee: Phoenix Contact GmbH & Co., KG
    Inventor: Elmar Schaper
  • Patent number: 7182123
    Abstract: The rib and the block are applicable in heating appliances construction. They have increased operational safety and heat transfer velocity. The rib comprises an upper (1.1) and lower hole (1.2), a joining profile (2), a first (3) and second (4) internal foldings, a third intermediate (5) and a fourth external (6) folding, which ends in a fifth reversed folding (7). The fourth external folding (6) and the fifth reverse folding (7) extend from below to the end of their respective chamfers (8), and at the upper side of the rib, together with the second (4) and the third (5) folding, they connect its two vertical walls via two chamfers (9). Centrally in relation to the upper hole (1.1), on its both sides, and above, on the surface of the second internal folding 4 and the third intermediate folding (5), there are spherical concavities (10), and on both sides of the lower hole (1.2) there are similar spherical concavities (11).
    Type: Grant
    Filed: October 30, 2003
    Date of Patent: February 27, 2007
    Assignee: Ficosota OOD
    Inventor: Dobri Dimitrov Marinov
  • Patent number: 7174955
    Abstract: A heat sink (10) includes a plurality of fins (12) joined with each other. In one embodiment, each fin includes a main body (13) with an elongated flange (14) and two shortened flanges (16) extending from each of two opposite sides thereof. The shortened flanges extend from the body in an opposite direction to the elongated flange with the elongated flange located therebetween. The elongated flange (14) defines two holes (142) at respective opposite sides thereof and each shortened flange (16) provides an engaging piece (164) in alignment with one hole of the elongated flange. The engaging pieces of one fin engage in corresponding holes of an adjacent fin to thereby combine the fins together.
    Type: Grant
    Filed: December 20, 2004
    Date of Patent: February 13, 2007
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co. Ltd., Foxconn Technology Co., Ltd.
    Inventors: Yong Zhong, Wan-Lin Xia, Tao Li
  • Patent number: 7174951
    Abstract: A radiator module structure includes at least a heat guide pipe, a frame member, a fan and at least two cooling fin sets. The guide pipe has a heat receiving section joined to a base and at least two heat dissipation sections extending upward and being away the base. The frame member is upright disposed on the base and faces the heat receiving section. The frame part of the frame member at least has a clip hook part at the bottom thereof to engage with base and the fan is received in the frame part to respectively face the two cooling fin sets, which are penetrated with the heat dissipation sections.
    Type: Grant
    Filed: August 30, 2005
    Date of Patent: February 13, 2007
    Assignee: Asia Vital Component Co., Ltd.
    Inventor: Sheng-Huang Lin
  • Patent number: 7172015
    Abstract: A heat exchanger used in a screw air compressor has a low temperature chamber through which low temperature fluid flows and a high temperature chamber through which high temperature fluid flows. The low temperature chamber and the high temperature chamber are separated by a partition plate. The high temperature chambers and the low temperature chambers are alternately arranged in layers, so that the low temperature chambers are disposed at both ends in a layered direction. Additionally, the flowing direction of the low temperature fluid in the low temperature chambers and the flowing direction of the high temperature fluid in the high temperature chambers are substantially orthogonal to each other.
    Type: Grant
    Filed: August 18, 2004
    Date of Patent: February 6, 2007
    Assignee: Hitachi Plant Technologies, Ltd.
    Inventors: Haruo Miura, Kazuki Takahashi, Seiji Tsuru, Minoru Taniyama, Tomohiro Naruse, Toshio Hattori
  • Patent number: 7172016
    Abstract: A header construction intended for use in a heat exchanger (36) employed in a relatively high pressure application includes an array of generally parallel tube runs (84) with fins (82) extending between adjacent ones of the tube runs. At least one relatively flat header plate (86) has a plurality of tube slots (88) for receiving ends (90) of the tubes (84) and a tank (94) is mounted to and sealed to the header plate (86). Peripheral flanges (112) are located about tube slots (86) in the headers and a header reinforcing plate (114) is bonded to the header plate (86) oppositely of the tank (94). Stiffening beads in the form of flanges (120) are located on the header reinforcing plate (114) between openings (118) therein through which the tubes (84) pass and extend away from the header plate (86).
    Type: Grant
    Filed: October 4, 2002
    Date of Patent: February 6, 2007
    Assignee: Modine Manufacturing Company
    Inventors: Steven P. Meshenky, Robert J. Barfknecht, B. Joseph Fietkiewicz, LeRoy Goines, Peter C. Kottal
  • Patent number: 7168479
    Abstract: Provided is a highly efficient, slim heat transfer apparatus, including a main body connected to an end of a condensing zone through a liquid coolant reservoir. An extension of the main body is connected to the other end of the condensing zone. The main body has a coolant reservoir that stores liquid coolant supplied from the condensing zone, a vaporization zone in which the liquid coolant supplied from the coolant reservoir is vaporized, and a channel region connecting the coolant reservoir to the vaporization zone. The channel region acts as a channel for supplying the liquid coolant from the coolant reservoir to the vaporization zone.
    Type: Grant
    Filed: December 11, 2003
    Date of Patent: January 30, 2007
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Young-ki Hong, Kyung-il Cho, Byeoung-ju Ha, Jong-beom Kim, Hye-jung Cho
  • Patent number: 7168484
    Abstract: An apparatus and system, may include a thermal interface material comprised of an array of carbon nanotubes and a buffer layer disposed between the thermal interface material and one of a die or a heat spreader. In some embodiments the carbon nanotubes may be formed above a buffer layer formed above a surface of the heat spreader.
    Type: Grant
    Filed: June 30, 2003
    Date of Patent: January 30, 2007
    Assignee: Intel Corporation
    Inventors: Yuegang Zhang, C. Michael Garner, Andrew A. Berlin, Valluri Rao, Bryan M. White, Paul A. Koning
  • Patent number: 7165603
    Abstract: A tower type heat sink wherein a heat pipe for transporting a heat whereby a latent heat of a working fluid encapsulated therein is erected generally vertical on a top face of a flat plate shaped base portion, and a plurality of heat radiating fins are mounted on said heat pipe, and comprises an intermediate portion formed with bending a portion of said heat pipe where the heat radiating fins are not mounted thereon, and a through hole formed on said base portion for letting through said heat pipe to protrude one of its end portion of which said fins are mounted thereon from the top face of said base portion, and to expose the said heating portion on the bottom face of said base portion.
    Type: Grant
    Filed: April 11, 2003
    Date of Patent: January 23, 2007
    Assignee: Fujikura Ltd.
    Inventors: Masataka Mochizuki, Koichi Mashiko
  • Patent number: 7165606
    Abstract: A heat exchanging tube is provided with a flat tube main body having a predetermined length and a plurality of refrigerant passages extending in a tube longitudinal direction and arranged in a tube widthwise direction. The following relational equations (a) to (c) are satisfied: W=6 to 18 mm . . . (a); Ac/At×100=50 to 70% . . . (b) and P/L×100=350 to 450% . . . (c), where “W” is a width of the tube main body, “Ac” is a total cross-sectional area of the refrigerant passages, “At” is a total cross-sectional area of the tube main body ( including the refrigerant passages), “L” is an external perimeter of the tube main body and “P” is a total inner perimeter of the refrigerant passages. With this tube, enough pressure strength can be obtained and the passage resistance can be decreased while keeping the light weight, and further the heat exchanging performance can be improved.
    Type: Grant
    Filed: October 1, 2003
    Date of Patent: January 23, 2007
    Assignee: Showa Denko K.K.
    Inventor: Koichiro Take
  • Patent number: 7163049
    Abstract: A cooling fin assembly (10) includes a plurality of cooling fins (10a) joined together. Each of the cooling fins includes a main body (11a) forming four engaging members (14a) at four corners thereof respectively. Each of the engaging members includes a roll piece (15a) with an elongated hole (16a) defined therein and a connecting piece (17a) with an engaging piece (18a) extending therefrom. In assembly of the cooling fins, the engaging pieces of each of the cooling fins engage in the corresponding holes of the roll pieces of an adjacent cooling fin to thereby fasten and join the cooling fins with one another.
    Type: Grant
    Filed: December 20, 2004
    Date of Patent: January 16, 2007
    Assignees: Fu Zhun Precision Industry (Shenzhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Yong Zhong, Wan-Lin Xia, Tao Li
  • Patent number: 7163050
    Abstract: A heat dissipating device for a CPU includes a chassis (10), a heat sink (20), a fan cover (50) and a fan (60). The heat sink includes a coin-shaped connecting piece (22) and a plurality of cooling fins (30) arranged radially and defining an inter space for receiving the connecting piece. A plurality of airflow passages is formed between adjacent cooling fins. A plurality of heat pipes (40) is attached to a periphery of the cooling fins and the chassis. The fan cover partially surrounds the heat sink. The fan is secured to the fan cover to provide forced airflow through the airflow passages of the cooling fins radially.
    Type: Grant
    Filed: June 29, 2005
    Date of Patent: January 16, 2007
    Assignees: Fu Zhun Precision Industry (Shenzhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Dong Wang, Tsung-Lung Lee, Li He
  • Patent number: 7159645
    Abstract: A cooling assembly for removing heat form an enclosed environment containing a gimbal device. The assembly comprises an exhaust bellows equipped with a device to draw heated air from the heat source to the outer environment an inlet bellows through which cool, outside air enters to displace the heated air.
    Type: Grant
    Filed: June 1, 2004
    Date of Patent: January 9, 2007
    Assignee: Lockheed Martin Corporation
    Inventors: George Go, James R. Myers
  • Patent number: 7159646
    Abstract: An electrohydrodynamically enhanced heat transfer system (EHD) includes an electrode completely encapsulated in an insulating material and coupled to a power supply to generate an electric field between a heat transfer surface and the encapsulated electrode when energized for interacting with the heat exchange surface and the working media to reduce frost formation on the heat transfer surface and to enhance heat transfer. The power supply may be completely encapsulated and immersed into the working media. In order to reduce accumulation of condensed liquid onto the electrode, the surface of the insulating material of the encapsulated electrode is either covered with a water repellent, or heated a few degrees above the dew point temperature of the air surrounding the heat transfer surface. The encapsulated electrode can be energized by an AC or DC electric field through a controlling switch.
    Type: Grant
    Filed: April 15, 2003
    Date of Patent: January 9, 2007
    Assignee: University of Maryland
    Inventors: Serguei V. Dessiatoun, Igor Ivakhnenko, Michael M. Ohadi
  • Patent number: 7156159
    Abstract: An apparatus and method of circulating a heat-absorbing material within a heat exchanger. The apparatus comprises a manifold layer coupled to an interface layer. The manifold layer comprises an inlet manifold and an outlet manifold. The interface layer comprises a plurality of channels that extend from the inlet manifold, toward a heat-exchanging plane, and turn away from the heat-exchanging plane, terminating at the outlet manifold. The plurality of channels are stacked in a plane non-parallel to the heat-exchanging plane. Each of the channels is adjacent to another, thus allowing heat radiated from a heat-generating device to be conducted to a cooling material circulating within the channels, away from the heat-generating device. Preferably, each of the channels has a U-shape or an elongated U-shape.
    Type: Grant
    Filed: July 1, 2003
    Date of Patent: January 2, 2007
    Assignee: Cooligy, Inc.
    Inventors: James Lovette, Peng Zhou, James Gill Shook
  • Patent number: 7156161
    Abstract: A lightweight thermal heat transfer apparatus, including a core section and a laminate composite section. The core section is substantially similar to a diamond shape. The laminate composite section has a plurality of thermally conductive fibers, which are disposed around the core section and oriented at a configuration similar to the core section.
    Type: Grant
    Filed: January 24, 2002
    Date of Patent: January 2, 2007
    Assignee: The United States of America as represented by the Secretary of the Navy
    Inventors: Steve Thoman, Ronald Trabocco, Mary Donnellan
  • Patent number: 7156156
    Abstract: A heat exchanger for a heat transfer fluid circuit comprising ducts for the circulation of the heat transfer fluid, which are inserted between an inlet and an outlet, is described. Cavities designed to contain a heat storage fluid adjacent to the cooling fluid circulation ducts and associated with heat-exchanger surfaces, so that heat storage fluid is capable of exchanging heat with the air flow, if the circulation of the heat transfer fluid is stopped, are also described.
    Type: Grant
    Filed: November 25, 2003
    Date of Patent: January 2, 2007
    Assignee: Valeo Climatisation
    Inventors: Regine Haller, Loic Lepetit, Christian Petit, Didier Loup
  • Patent number: 7156160
    Abstract: A liquid cooling system includes a container (10) defining communicable first and second chambers (125a, 125b) therein, a pump (15) mounted on the container and having an entrance port (152) in flow communication with the second chamber, and an exit port (150) in flow communication with the first chamber so that the pump, the first chamber, and the second chamber together form a loop for circulation of coolant, and a heat dissipation unit (2) located at the loop for cooling the coolant.
    Type: Grant
    Filed: September 21, 2004
    Date of Patent: January 2, 2007
    Assignees: Fu Zhun Precision Ind. (Shenzhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Hsieh Kun Lee, Cheng-tien Lai, Shi-Wen Zhou
  • Patent number: 7152667
    Abstract: A heat sink comprises: a base portion having one face to be contacted by an exothermic member; a heat pipe erected on the other face of the base portion; and a plurality of fins mounted on the outer face of the heat pipe. Further comprised are: an axially short cylindrical member erected on the other face of the base portion; and a heat pipe container having one end portion closed and the other end portion opened and fitted at its opened end closely in the cylindrical member. The heat pipe is constructed by evacuating the inside of the heat pipe container and then by encapsulating a working fluid in the heat pipe container, so that a heat may be transferred to the heat pipe through the base portion and the cylindrical member.
    Type: Grant
    Filed: August 30, 2002
    Date of Patent: December 26, 2006
    Assignee: Fujikura Ltd.
    Inventors: Masataka Mochizuki, Koichi Mashiko