Abstract: A charger for a hand-held power tool includes a power source interface, a charger base and a charging cradle rotatably supported on the charger base. The rotatable charging cradle includes at least two charging output terminals electrically connected to the power source interface. A power tool system includes the charger and the hand-held power tool. A method of charging the power tool system includes contacting charging input terminals of the power tool with the charging output terminals, rotating the charging cradle and the power tool relative to the charging base and supplying charging current to at least one battery cell while the charging cradle and the power tool are allowed to freely swing relative to the charging base.

Abstract: A method for adding an electrical interconnection within a three-dimensional integrated circuit (3-D IC) is disclosed. The method may include creating, within a design file of a 3-D IC that specifies a layout for a first chip of the 3-D IC, design data corresponding to a set of through-silicon via (TSV) reservation areas. The method may also include receiving an engineering change order (ECO) and releasing, in response to the ECO, at least one TSV reservation area for reuse. The method may also include adding, by re-using at least one TSV reservation area, an electrical interconnection within the design file of the first chip of the 3-D IC.

Abstract: A configurable delay cell for an integrated circuit includes a CMOS inverter and first through fourth transistors. A drain of the third transistor is connected to a drain of the fourth transistor for generating an output signal. A connection between an output terminal of the CMOS inverter and a source of the first transistor, a connection between the output terminal of the CMOS inverter and a drain of the second transistor, and a connection between the source of the first transistor and the drain of the second transistor are configurable, using an electronic design automation (EDA) tool, for achieving first, second, third, fourth, and fifth delay values. The resulting delay value can be programmed by making changes only in one or more of the metal layers of the integrated circuit.

Abstract: This application discloses a system implementing tools and mechanisms to selectively load design data for logical equivalency check. The tools and mechanisms can identify a hierarchy of modules in a circuit design, perform a depth-first search of the hierarchy of modules starting with a root module to identify a subset of modules to parse, and selectively parse the subset of the modules in the circuit design. The tools and mechanisms can utilize the parsed subset of the modules to determine logical equivalence of the circuit design with at least another circuit design.

Abstract: A digital circuit design method includes: before performing physical design: performing a logic synthesis according to a Register Transfer Level (RTL) design and a plurality of constraints to at least generate a netlist, a standard delay format file and a first constraint file; retrieving information of at least a specific node of circuit from the first constraint file to generate a second constraint file; generating an updated standard delay format file at least according to the standard delay format file and the second constraint file, wherein a delay of the specific node of the updated standard delay format file is less than a delay of the specific node of the standard delay format file; and using the netlist and the updated standard delay format file to perform a pre-post-layout simulation.

Abstract: A semiconductor device includes a substrate including a circuit region, a dummy region, and a dummy clearance section surrounding the circuit region, and a plurality of dummy patterns formed in the dummy region, the plurality of dummy patterns comprising a first dummy pattern and a second dummy pattern, a distance between the first dummy pattern and the circuit region being less than a distance between the second dummy pattern and the circuit region, and a dummy pattern being absent between the first dummy pattern and the circuit region. The first dummy pattern includes an area which is greater than an area of the second dummy pattern.

Abstract: Embodiments that design integrated circuits using a 1×N compiler in a closed-loop 1×N methodology are disclosed. Some embodiments create a physical design representation based on a behavioral representation of a design for an integrated circuit. The behavioral representation may comprise RTL HDL with one or more 1×N building blocks. The embodiments may alter elements of the 1×N building block by using logic design tools, synthesis tools, physical design tools, and timing analysis tools. Further embodiments comprise an apparatus having a first generator to generate a behavioral representation of a design for an integrated circuit, a second generator to generate a logical representation of the design, and a third generator to generate a physical design representation of the design, wherein the representation generators may create updated versions of the representations which reflect alterations made to 1×N building block elements.

Abstract: The present disclosure provides one embodiment of an IC method. First pattern densities (PDs) of a plurality of templates of an IC design layout are received. Then a high PD outlier template and a low PD outlier template from the plurality of templates are identified. The high PD outlier template is split into multiple subsets of template and each subset of template carries a portion of PD of the high PD outlier template. A PD uniformity (PDU) optimization is performed to the low PD outlier template and multiple individual exposure processes are applied by using respective subset of templates.

Abstract: System and method of checking logic equivalence following flip-flop insertions to identify paths with inversion errors. All the flip-flops in a gate-level netlist and the corresponding RTL design are treated as buffers in a logic equivalence check (LEC) tool. A logic mismatch of a path between the RTL design and the netlist indicates an odd number of inverters have been inserted in the path during a flip-flop insertion process. Accordingly, the identified path is adjusted to ensure an even number of inverters.

Abstract: In a battery system for a vehicle, a lead battery is connected in parallel to a sub-battery, and a charging resistance r2 of the sub-battery 2 is lower than a charging resistance r1 of the lead battery.

Abstract: In one embodiment, a tangible, non-transitory, computer-readable medium, includes instructions to receive a first circuit design, determine one or more variations of the first circuit design using register retiming with speculative circuit design changes, determine one or more performance improvements of the variations when fed clock signals over the first circuit design, determine one or more tradeoffs of the one or more variations of the first circuit design in comparison to the first circuit design, display a summary of the one or more variations of the first circuit design, the one or more performance improvements, and the one or more tradeoffs, and provide a user-selectable user interface element to enable selection of the first circuit design, at least one of the one or more variations of the first circuit design, or a combination thereof.

Abstract: A secondary battery has a progressively degrading SOC that is an SOC at which the battery performance degrades during storage, and is charged and discharged by a controller. An information processor holds a first threshold value set in advance and lower than the progressively degrading SOC of the secondary battery, and a second threshold value set in advance and higher than the progressively degrading SOC, makes the controller continue an operation to charge the secondary battery from the first threshold value to the second threshold value at the time of charging the secondary battery based on the value of the SOC of the secondary battery detected by the controller, and makes the controller continue an operation to discharge the secondary battery from the second threshold value to the first threshold value at the time of discharging the secondary battery based on the value of the SOC of the secondary battery detected by the controller.

Abstract: A global placement grating (GPG) is defined for a chip level to include a set of parallel and evenly spaced virtual lines. At least one virtual line of the GPG is positioned to intersect each contact that interfaces with the chip level. A number of subgratings are defined. Each subgrating is a set of equally spaced virtual lines of the GPG that supports a common layout shape run length thereon. The layout for the chip level is partitioned into subgrating regions. Each subgrating region has any one of the defined subgratings allocated thereto. Layout shapes placed within a given subgrating region in the chip level are placed in accordance with the subgrating allocated to the given subgrating region. Non-standard layout shape spacings at subgrating region boundaries can be mitigated by layout shape stretching, layout shape insertion, and/or subresolution shape insertion, or can be allowed to exist in the final layout.

Abstract: Embodiments relate to pre-silicon device testing using a persistent command table. An aspect includes receiving a value for a persistent command parameter from a user. Another aspect includes determining whether the value of the persistent command parameter is greater than zero. Another aspect includes based on determining whether the value of the persistent command parameter is greater than zero, selecting a number of commands equal to the value of the persistent command parameter from a regular command table of a driver of a device under test. Another aspect includes adding the selected commands to the persistent command table of the driver. Another aspect includes performing testing of the device under test via the driver using only commands that are in the persistent command table of the driver.

Abstract: Some embodiments correlate various manufacturing or design information or data with patterns used to represent electronic designs and provide pertinent pattern-based information to metrology, fabrication, or testing tools to enhance their performances of their intended functions. Some embodiments further utilize cross-design or cross-process analytics to perform various pattern-based analyses on electronic designs. Some embodiments perform squish analysis with a squish pattern library on an electronic design to represent the electronic design with squish patterns by performing pattern matching, pattern decomposition, and pattern classification process.

Abstract: A method, system, and computer program product to merge storage elements on multi-cycle signal distribution trees into multi-bit cells of an integrated circuit include determining initial placement regions and initial placement locations for a plurality of storage elements arranged in two or more levels on the one or more trees, determining potential merge storage elements among the plurality of storage elements, and merging one or more pairs of the potential merge storage elements across the one or more trees into the multi-bit cells based on satisfying an additional condition. The two or more levels of each of the one or more trees includes a root level closest to a tree source of the respective one or more trees and a leaf level closest to a tree sink of the respective one or more trees.

Abstract: A wireless communication device includes a wireless charging circuit configurable to receive a wireless power signal from a power transmitting unit and to charge the wireless communication device under control of a processing device and in conjunction with a charging session with the power transmitting unit. A wireless interface device operates under control of the processing device to establish a wireless connection with the power transmitting unit via a connection establishment procedure, wherein the wireless connection is separate from the wireless power signal. Control data is exchanged with the power transmitting unit via the wireless connection, wherein the control data is used by the processing device to implement the charging session with the wireless charging circuit. A response is generated to a disruption event of the wireless communication device that includes implementing a restoration procedure for restoring the wireless connection, without implementing the connection establishment procedure.

Abstract: Some embodiments of the invention provide a configurable integrated circuit (“IC”). The configurable IC includes a set of multiplexers that each has a set of input terminals, a set of output terminals, and a set of select terminals. The set of multiplexers includes a group of multiplexers, where at least one input terminal of each multiplexer in the group is a permanently inverting input terminal. During at least a set of cycles during the operation of the configurable IC, several multiplexers in the group of multiplexers are used to implement a particular function.

Abstract: Some implementations provide a package that includes a first die and a second die adjacent to the first die. The second die is capable of heating the first die. The package also includes a leakage sensor configured to measure a leakage current of the first die. The package also includes a thermal management unit coupled to the leakage sensor. The thermal management unit configured to control a temperature of the first die based on the leakage current of the first die.

Abstract: A CoDec in a design for test integrated circuit. In embodiments described herein, portions of the CoDec are distributed over the area of the IC. In particular, both the compressor and the decompressor may be distributed over the IC. To this end, XOR gates are located locally to the scan chains over the area of the chip to reduce wire length back to the input/output test pins. The compressor and decompressor may be distributed in a 2-dimensional grid. The compressor may XOR each scan chain in two different directions such that a fault may be resolved back to a specific region of the IC.