Abstract: A highly heat-dissipating flexible printed circuit board (GFPCB) efficiently emits heat transferred from a heat source such as an LED to the flexible printed circuit board. The highly heat-dissipating flexible printed circuit board comprises: a flexible board layer which is formed in a flexibly bendable thin-film form by bonding a polyimide (PI) film to the lower side of a copper (Cu) film using an adhesive and has a heat element installed on the upper side thereof; and a heat dissipation layer which is formed in a thin-film form by coating any one of graphitic carbon and a graphite powder binder on the upper side of an aluminum (Al) film and is bonded to the lower side of the flexible board layer using a pressure sensitive adhesive (PSA) to receive heat generated and transferred from the heat element and emit the heat to the outside.

Abstract: A power semiconductor module includes a half-bridge circuit having a first power semiconductor element and a second power semiconductor element that are connected in series with each other. The power semiconductor module also includes first to third external terminals, a first wiring member that connects a high-potential-side main electrode of the first power semiconductor element to the first external terminal, a second wiring member that connects a low-potential-side main electrode of the second power semiconductor element to the second external terminal, a third wiring member that connects an output of the half-bridge circuit to a third external terminal, and at least one of a first corrosion sensor disposed in an installation environment of the first wiring member, a second corrosion sensor disposed in an installation environment of the second wiring member, or a third corrosion sensor disposed in an installation environment of the third wiring member.

Abstract: An electronic component includes an insulating layer, a low voltage conductor pattern formed inside the insulating layer, a high voltage conductor pattern formed inside the insulating layer such as to face the low voltage conductor pattern in an up/down direction, and a withstand voltage enhancement structure of conductive property formed inside the insulating layer and along the high voltage conductor pattern such as to protrude further outside than the low voltage conductor pattern in plan view.

Abstract: The present disclosure describes a grommet formed of a polymeric material and adapted for securing a cable within a cable hanger. The grommet includes a main body having a generally cylindrical profile surrounding an interior cavity, the main body further having a length, a thickness, and a longitudinal axis, a slot extending the length of the main body which provides an entry point for the cable to be inserted into the interior cavity, a plurality of flex retention members extending into the interior cavity configured to grip and secure the cable within the interior cavity, and one or more grip enhancement features residing between an inner surface of the main body and the flex retention members. The grip enhancement features are configured to provide additional support to the flex retention members when a cable is inserted into the interior cavity.

Abstract: A method for manufacturing a multilayer substrate including first and second insulating resin base material layers including different materials, includes configuring a conductor film-attached insulating resin base material with a conductor film on the first insulating resin base material layer, or a second conductor film-attached insulating resin base material with a conductor film on a main surface of the first insulating resin base material layer including a main surface of a stacked body including at least the first insulating resin base material layer, and stacking the first or second conductor film-attached insulating resin base material and another base material layer such that the conductor film is in contact with the second insulating resin base material layer. An adhesion strength of the first insulating resin base material layer to the conductor film is higher than an adhesion strength of the second insulating resin base material layer to the conductor film.

Abstract: A flexible substrate, a manufacturing method thereof, and a flexible display device are provided. The method includes: step S10, forming a first aerogel layer with a cross-linked structure and a nanoporous structure on a substrate; step S20: forming an inorganic layer on the first aerogel layer; step S30, forming a second flexible substrate layer on the first aerogel layer, and allowing the second flexible substrate layer to cover the inorganic layer; and step S40, peeling the first aerogel layer, the inorganic layer, and the second flexible substrate layer from the substrate to form the flexible substrate.

Abstract: A shielded electrical ribbon cable includes adjacent first and second longitudinal conductor sets where each conductor set includes two or more insulated conductors. The first conductor set also includes a ground conductor that generally lies in the plane of the insulated conductors of the first conductor set. At least 90% of the periphery of each conductor set is encompassed by a shielding film. First and second non-conductive polymeric films are disposed on opposite sides of the cable and form cover portions substantially surrounding each conductor set, and pinched portions on each side of each conductor set. When the cable is laid flat, the distance between the center of the ground conductor of the first conductor set and the center of the nearest insulated conductor of the second conductor set is ?1, the center-to-center spacing of the insulated conductors of the second conductor set is ?2, and ?1/?2 is greater than 0.7.

Abstract: The disclosure relates to capacitive heatsink devices and systems. In one embodiment, the heat sink capacitor includes a positive (P) bus plate; a negative (N) bus plate; a first dielectric material; a second dielectric material; and a heat sink comprising a first side and a second side, the first side of the heat sink attached to the first dielectric material and the second dielectric material, wherein the first dielectric material and the second dielectric material are separated by a portion of the heat sink, wherein the first dielectric material electrically insulates the P bus plate from the first side of the heat sink to form a first capacitor, and wherein the second dielectric material electrically insulates the N bus plate from the first side of the heat sink to form a second capacitor.

Abstract: A secondary battery includes: an electrode assembly including electrode sheets and a separator interposed between the electrode sheets; a pouch-like battery casing in which the electrode assembly is received; an electrode lead connected to the electrode assembly and protruding out from the battery casing; and a lead film covering the electrode lead and interposed between the electrode lead and the battery casing, wherein the lead film includes an outer layer covering the electrode lead and an inner layer disposed inside of the outer layer, and the inner layer includes a material having a higher air permeability as compared to the outer layer.

Abstract: An electronic module is provided with a housing with an inlet to conduct alternating current (AC) power and an outlet to conduct direct current (DC) power to charge a vehicle battery, the housing defining a cavity. A circuit board assembly is supported within the cavity to convert the AC power to DC power. At least two power distribution wires are connected between the circuit board assembly and the outlet. A base is supported by the housing and extends between the at least two power distribution wires and the circuit board assembly to shield the DC power from electromagnetic interference generated by the circuit board assembly. A plurality of walls extend transversely from the base and are spaced apart from each other to define at least two channels, each channel is sized to receive one of the at least two power distribution wires.

Abstract: A wiring board may include a core portion having first and second surfaces, and first and second buildup portions on the first and second surfaces, respectively. Each of the first and second buildup portions may include a first insulating layer on the core portion, a wire pattern on the first insulating layer, a second insulating layer on the first insulating layer to cover the wire pattern, and a protection layer covering the second insulating layer and exposing a portion of the wire pattern. The second insulating layer may include a resin layer and inorganic fillers distributed in the resin layer. The fillers may not be provided in the protection layer, and the resin layer of the second insulating layer and the protection layer may be formed of the same material. The wire patterns of the first and second buildup portions may be electrically connected to each other.

Abstract: A multilayer electronic component, in which the external electrode may be thinned to secure capacitance per unit volume, while securing the external electrode at a corner in a specific thickness or higher with improved reliability for moisture resistance.

Abstract: A wire guide device A includes a wire guide body 15 that is formed by coupling a plurality of link members 17 in series such that the link members 17 can rotate relative to each other, and inside which an accommodation space 16 for a wire W is formed. The link member 17 includes a link body 20 and a lid 31. The link body 20 is provided with an opening 29 through which the accommodation space 16 is open toward the outside of the wire guide body 15. The lid 31 is locked to the link body 20 and thereby closes the opening 29. The openings 29 and the lids 31 are arranged on surfaces of the link members 17 that are located on an inner side of a curved portion of the wire guide body 15 when the wire guide body 15 is curved.

Abstract: The present application relates to the technical field of adapter devices, and in particular to an adapter shell and an adapter. The adapter shell, used for providing a circuit board, comprises: a first shell, a second shell and a sliding plate. The first shell comprises a first bottom plate and a first annular lateral plate. The second shell comprises a second bottom plate and a second annular lateral plate. The sliding plate is movably connected to the second bottom plate, and the sliding plate and the second annular lateral plate are respectively positioned on two sides of the second bottom plate. The first annular lateral plate and the second annular lateral plate are detachably connected to each other in a sleeved manner to form a placing cavity for providing the circuit board.

Abstract: Cables, cable connectors, and support structures for cantilever package and/or cable attachment may be fabricated using additive processes, such as a coldspray technique, for integrated circuit assemblies. In one embodiment, cable connectors may be additively fabricated directly on an electronic substrate. In another embodiment, seam lines of cables and/or between cables and cable connectors may be additively fused. In a further embodiment, integrated circuit assembly attachment and/or cable attachment support structures may be additively formed on an integrated circuit assembly.

Abstract: A design is presented for a structured cable suitable for carrying a large electric current in a cable-in-conduit comprising an assembly of rectangular stacks of thin superconducting tapes, with provisions for mechanical support of large mechanical stress and cross-flow of cooling fluid capable of removing large amounts of heat.

Abstract: The present invention is directed to a multilayer ceramic capacitor. A plurality of active electrodes may be arranged within a monolithic body of the capacitor and parallel with a longitudinal direction. A first shield electrode may be arranged within the monolithic body and parallel with the longitudinal direction. The first shield electrode may be connected with a first external terminal. The first shield electrode may have a first longitudinal edge and a second longitudinal edge that are each aligned with the lateral direction and face away from the first external terminal. The second longitudinal edge may be offset in the longitudinal direction from the first longitudinal edge by a shield electrode offset distance. A second shield electrode may be connected with a second external terminal. The second shield electrode may be approximately aligned with the first shield electrode in the Z-direction.

Abstract: The present invention discloses an encapsulated duct cable with identification tags and a manufacturing method thereof. The logging encapsulated duct cable comprises an encapsulation layer. The cross section of the encapsulation layer is polygonal or arc-shaped. At least one cable protective tube and at least one oil-liquid tube are arranged in the encapsulation layer. A cable is arranged in the cable protective tube. Identification tags with different color identifiers are respectively arranged on one side of the cable protective tube and one side of the oil-liquid tube in one to one correspondence. The manufacturing method of the logging encapsulated duct cable mainly comprises three steps of machining the cable protective tube and paving the cable pavement, machining the oil-liquid tube, and machining the encapsulation layer. The present invention has double functions of conveying the oil and the liquid and transmitting the data.

Abstract: A circuit board cover having a housing having a first surface, a perimeter edge, a housing cavity partially defined by the first surface and the perimeter edge, a skirt extending from the perimeter edge away from the first surface in a first direction to partially define the housing cavity, and a plurality of ports disposed on the first surface. The housing cavity can be operable to house a printed circuit board. Each of the plurality of ports can include (i) a sidewall extending away from the first surface in a second direction opposite to the first direction, (ii) a port cavity partially defined by the sidewall, and (iii) one or more terminals disposed at least partially within the port cavity.

Abstract: Provided is a wiring member that can be held in a bent state more reliably even if a reaction force is large. A wiring member includes a cable including a bent portion that is routed along a bent path, and a bracket including a holding portion for holding the cable and a vehicle fixing portion that protrudes outward of the holding portion, and the holding portion includes a bend holding portion for holding the bent portion of the cable, and the bend holding portion includes an inner wall portion located on an inner circumferential side of the cable, and an outer wall portion located on an outer circumferential side of the cable.