Abstract: A process is described for electrolessly depositing or electrodepositing a solder layer composed of copper and silver and having an overall composition of silver/copper of from 75:25 to 70:30 and a total layer thickness of 15 to 100 .mu.m on a metallized ceramic. In this process, copper layers and silver layers are deposited alternately on the metallized ceramic. The number of layers is at least 3 and the individual layer thickness is 5 to 10 .mu.m.

Abstract: A process for the production of structural parts or substrates with composite coatings by electrolytic or electroless deposition of a metal matrix in which the structural part or substrate surface is first coated with a mixture of a water-soluble powder of salt or acid and dispersed particles, fibers, felt, mat or woven fabric. Then the salt or the acid is melted and transformed to a water-soluble substance which fixes the particles, fibers, felt, mat or woven fabric to the surface of the structural part or substrate. The water-soluble substance is dissolved by immersing the structural part or substrate in an electrolytic or electroless deposition bath, and a metal matrix is deposited onto the structural part or substrate to incorporate the dispersed particles, fibers, felt, mat or woven fabrics in the matrix as a composite coating.

Abstract: The metal (for example, copper) to base material adhesion in an additive printed wiring board is improved by contacting the base material with a solution containing a ureidosilane, preferably also comprising a disilyl crosslinking agent, followed by drying the solution to remove solvent, before contacting the base material with an activating agent for an electroless deposition step. Heating of the board, after the deposition of the metal, for example by baking in an oven or in an autoclave, gives the highest level of adhesion between metal and base material.

Abstract: The invention is to a method of spot plating parts of a plated semiconductor lead frame. The entire lead frame is first plated. Then parts of the lead frame, internal to the subsequent encapsulating package, are spot plated prior to encapsulating the semiconductor device. A spot of silver is plated in the mount and/or bond area of the lead frame.

Abstract: Disclosed is a method of monitoring electroless plating solutions. The solutions are used to plate a light-transmitting medium. Measurements are made to determine the time it takes for light transmission through the medium to be reduced to a certain level. This measurement can be used to determine whether articles will be sufficiently plated by the solutions.

Abstract: A process for producing a tungsten oxide film which comprises the steps of: reacting a tungstate with a salt of an organic compound represented by formula (I) to obtain a tungstic acid compound; mixing the tungstic acid compound with an organic solvent to prepare a composition; and removing an organic substance and the solvent from the composition:R.sub.1 R.sub.2 R.sub.3 NH.sup.+ X.sup.- (I)wherein R.sub.1, R.sub.2, and R.sub.3 each represents a hydrogen atom or a saturated or unsaturated hydrocarbon group having from 1 to 20 carbon atoms, and X.sup.- represents a halogen atom. A tungsten oxide film obtained by the above-described process and an electrochromic device comprising the tungsten oxide film.

Abstract: High power diode lasers of the formula GaInP/InGaAsP on GaAs substrates which operate at powers up to 5.3W with increased power levels and efficiencies are disclosed. By increasing the thickness of the optical cavity of the heterostructure and by doping to a level of 10.sup.20 atoms/cm.sup.3 the cap layer surface with a p-type dopant such as diethyl zinc, increased power at an increased efficiency level is observed.

Abstract: A process for electroless gold plating using plating solution comprizing cyanoaurate, alkaline cyanide, reducing agent, alkaline hydroxide, crystal condition controlling agent and stabilizer characterized in that an aldehyde or a ketone compound is added together with replenished gold salt, and hydrogen peroxide is also added, if necessary.

Abstract: A method of selectively seeding or activating metal interconnections patterned on polyimide dielectric surfaces using an aqueous solution of palladium sulfate, palladium perchlorate, palladium trifluoromethane sulfonate, palladium nitrate or other palladium salts having poorly coordinating counter ions. This strongly selective seeding and the corresponding ability to reliably remove all traces of the seeding material from the polyimide surface eliminates shorting, bridging and reduction of breakdown voltage during electroless plating of a thin layer of nickel or cobalt.

Abstract: An electroless process has been developed to deposit nickel and gold onto optical fibers using aqueous chemistry. The key to the process is a sensitization of a surface of an optical fiber using a dilute aqueous stannous fluoride solution in absence of oxygen. Stannous fluoride solution is prepared by dissolving crystalline SnF.sub.2 in deionized water. Subsequent treatment includes immersion of sensitized optical fiber in a palladium chloride/HCl aqueous solution and commercially available electroless nickel and electroless gold solutions. The process is compatible with either chemical or fusion lensing operations by using a strippable polymer coating to selectively metallize near the fiber end. The solder joints to the metallized fiber are hermetic as determined by helium leak testing, and solder pull-test strengths typically range from 3-5 pounds, depending on the type of solder.

Abstract: An antistatic solution is disclosed to aid in the measurement of patterned resists by scanning electronic microscopes. The solution comprises a quaternary ammonium salt and a suitable solvent. The anion of the salt is selected from the group consisting of saccharinate, nitrate, sulfates, alkyl sulfates and alkoxylate. The four groups of the cation are selected from the group consisting of alkyl and alkyl derivatives.

Abstract: An assembly of an article and a polyimide composition is prepared. The assembly resists dimensional change, delamination, or debonding when exposed to changes in temperature. An article is provided. A polyamic acid solution which yields a polyimide having a low coefficient of thermal expansion (CTE) was prepared. Equimolar quantities of an aromatic diamine and an aromatic dianhydride were reacted in a solvent medium to form a polyamic acid solution. A metal ion-containing additive was added to the solution. Examples of this additive are: TbCl.sub.3, DyCl.sub.3, ErCl.sub.3, TmCl.sub.3, Al(C.sub.5 H.sub.7 O.sub.2).sub.3, and Er.sub.2 S.sub.3. The polyamic acid solution was imidized and is combined with the article to form the assembly.

Abstract: Method for applying liquid varnish coating over raised conductor pattern of a printed circuit board. The circuit board is passed through nip rolls at least one of which has a coating of liquid varnish thereon. The thickness of the coating on the nip roll is adjusted to between 5 and 100 .mu.m by adjusting the thickness of liquid varnish on an applicator roll in contact with the nip roll. The flow of liquid varnish applied to the applicator roll is at least 1.5 times the rate of transfer from the nip rolls to the circuit board.

Abstract: A halogenated polymeric material is exposed to a reducing agent and/or an electrolyte and applied voltage to render exposed portions capable of being metallized and of being etched. The exposed portions can also be doped to thereby induce electrical conductivity therein. Also, new structures containing a free standing halogenated polymeric-containing layer and electrical conductive pattern thereon are provided.

Abstract: A monolithic piezoelectric key structure having a piezoelectric layer adherently connected between two conductive areas. The piezoelectric layer is applied as a fluid on the base conductive area and transformed into a coherent solid adhering to the base conductive area. The other conductive area is adherently formed on the piezoelectric layer. The monolithic structure is polarized.

Abstract: A process for fabricating an active electrode for an oxygen sensor involves preparing a solution by dissolving an alkoxide of a metal constituting an oxide semiconductor or solid electrolyte in a mixture of a solvent and diethanol amine, adding chloroplatinic acid to said solution to obtain a precipitation, calcining and pulverizing said precipitation to form a micro-composite power of an oxide of said metal and platinum, and forming an electrode on said oxide semiconductor or solid electrolyte using said composite powder.

Abstract: A method for enhancing the dielectric properties of a new or in-service electrical cable is disclosed, the method comprising supplying the interstitial void space of the cable's conductor with a water-reative antitreeing agent having a diffusion coefficient of at least 1.times.10.sup.-7 cm.sup.2 /second at 50.degree. C. in the insulation of the cable and having an initial viscosity of .ltoreq.100 cP at 25.degree. C. The instant method provides a more symmetrical distribution of dielectric enhancing fluid in the insulation than prior art fluids and results in a significant reduction in cable treatment time.

Abstract: The invention relates to a closed-loop regulating method for a metallurgical treatment carried out on a moving product (1), in which treatment the check measurement is obtained with a significant and variable delay in relation to the regulated treatment, in which method a digital regulator (14) having dynamic adjustment (RST sampled transfer-function) is used, characterized in that the sampling rate is continuously varied such that the abovementioned delay always remains equal to a predetermined integral number of sampling periods.

Abstract: The present invention has as its object providing a solder mask which permits high density mounting, is suitable for protecting conductor circuits, particularly has mask thickness on the circuit parts and each edge part of the circuits which make almost no difference from those on other parts, and is excellent in electrical insulation, heat resistance and solvent resistance.

Abstract: The present invention includes a method and stencil design for printing on non-planar hybrid substrates wherein the stencil has a bottom face with a reverse topography to the non-planar hybrid substrate such that the stencil comes in direct contact and rest on the printing area immediately surrounding the print hole formed in the stencil. This eliminates any gap between the stencil and the surface of the substrate where material is to be printed. The stencil may be a metal and may be etched to provide the reversed topography.