Abstract: A pattern forming method comprises at least a lower pattern forming step for printing a setting ink on a substrate, a setting step for setting the setting ink, an upper layer pattern forming step for forming a metalo-organic compound paste layer on the lower layer pattern by a printing method, and a firing step for firing at high temperature to remove the lower layer pattern. In the upper layer pattern forming step, the metalo-organic compound paste is printed so that the metalo-organic compound paste may be divided on the hardened setting ink so as to fill up gaps of the lower layer pattern. Otherwise the metalo-organic compound paste is printed on the hardened setting ink, and the metalo-organic compound paste is mechanically cut off, before the metalo-organic compound paste is dried, on the hardened setting ink, thereby forming an upper layer pattern. The setting ink comprises a thermo-setting resin, a setting agent, and an organic solvent, with an amount of nonvolatile materials of 50 to 70 wt.

Abstract: A first method for manufacturing a solid oxide film having a highly densified solid oxide film having a small thickness and an improved electric conductivity; and a second method for manufacturing a solid oxide fuel cell in which a solid oxide film formed on an air electrode or a fuel electrode is manufactured by the first method. The solid oxide fuel cell according to the present invention is capable of generating a high power. The solid oxide film is formed on a substrate in such manner that a solid oxide material is sprayed on the substrate to form a sprayed solid oxide film thereon; Then a solution of metal compound including at least one metal selected from a group of manganese, iron, cobalt, nickel, copper and zinc is impregnated into the sprayed solid oxide film; and the sprayed solid oxide film is subjected to a heat treatment in order to increase an airtightness of the film. It may be possible to use a material for spraying, in which 1.about.

Abstract: A new metallization method for metal lines formation of a very large scale integrated circuit (VLSI) is described. The metal lines are formed in a "wavy" or "snaky" pattern. It is a "wavy" pattern when the metal line goes through a vertically vibratory path. It is a "snaky" pattern when a metal line goes through a horizontally vibratory path. This includes both uniform and random "wavy" and "snaky" patterns. A metal line can also be formed in a pattern that is both "wavy" and "snaky." For the "wavy" pattern, the topography under the metal lines is fabricated using, for example, field oxide. The "wavelength" can vary from 1 to 10 micrometers. A slight modification of the metal mask can produce the "snaky" structure of the metal line. The stresses will be released by a small curvature change of the metal line. For the contact structures, a multi-contact layout with "wavy" structure can release more stress than can a single-contact layout of the same contact area.

Abstract: The present invention describes a process for protecting aluminum nitride circuit substrates during electroless plating using a sol-gel technique. The aluminum nitride substrate is coated with a metal. The coated substrate is etched to form a circuit pattern thereby exposing the aluminum nitride. The etched substrate is placed in a solution of tetraethylorthosilicate and withdrawn. The substrate is dried in air and then baked in an oven to remove all of the organic solvents leaving a stoichio metric film of silica on the exposed substrate. The substrate is then placed in an electroless plating solution and the circuit pattern is plated to a predetermined thickness.

Abstract: The invention provides an apparatus and methods of using the apparatus to transfer conductive patterns onto substrates under conditions of heat and pressure. The apparatus comprises a master mold with a printing surface on which is produced a permanent mirror image of the conductive pattern to be created. This pattern is then coated with a loosely adherent film of conductive metal, such as copper, which is transferred onto a substrate to be printed.

Abstract: A low temperature chemical vapor deposition process is used to encapsulate aluminum conductors on the surface of a silicon substrate to form bimetallic conductors. The refractory material is desirably tungsten.

Abstract: Arrays of microfabricated hotplates have been used as substrate arrays for materials processing on a microscopic scale. Properties of individual elements (pixels) of the array, such as temperature and voltage bias, are controlled by addressing a given pixel with appropriate signals. Materials are deposited onto pixels with individually controlled deposition conditions (pixel temperature, bias). Pixels are also addressed to control properties during post-deposition processing steps such as heating in vacuum or various gases to alter stoichiometry of a single material, or to alloy multiple composition materials. The addressable heating characteristics may also be used for a maskless lithography on pixel elements. The result is an array of separately, but simultaneously, processed films. Properties of film elements may be measured using electrical contact pads.

Abstract: A heat transfer insulated part including a heat transfer substrate formed of a sintered metal of Cu-W or Cu-Mo, an insulating ceramic layer for electrically insulating the heat transfer substrate, formed of ceramic such as Al.sub.2 O.sub.3, SiO.sub.2 and Si.sub.3 N.sub.4, and a barrier layer provided between the heat transfer substrate and an insulating ceramic layer composed of at least either one of metal layers of W and Mo. Furthermore, preferably, an intermediate layer composed of titanium carbide and/or titanium nitride and so forth for enhancing the adhesive property between the insulating ceramic layer and the barrier layer is provided.

Abstract: The method for dispensing liquid on a substrate includes providing a plate (108) having a plurality apertures (110). These apertures (110) conform to the pattern of a plurality of pads (104, 106) of at least one component of a substrate (102). The apertures (110) are filled with the liquid to be dispensed, and are then aligned with the plurality of pads (104, 106) on the substrate (102). The liquid is simultaneously transferred out of the apertures (110)and onto the plurality of pads (104, 106) using a blower (112 ).

Abstract: Disclosed herein is a process for reducing the flammability of aramids by contacting a solvent swollen or never dried aramid with an aqueous solution of a tungsten compound, removing the solvent from, and then drying the aramid. The resulting aramids have superior Limiting Oxygen Indices, making them particularly useful where lower flammability is desired, as in firefighters' overcoats.

Abstract: A method of manufacturing a flexible amorphous silicon solar cell includes the steps of: a) coating a PI varnish on a glass substrate; b) imidizing the PI varnish film; c) vacuum-depositing a metal film on the PI film; d) vacuum-depositing an amorphous silicon film on the metal film; e) vacuum-depositing a transparent conducting film on the amorphous silicon film; and f) separating the PI film from the glass substrate. The method also provides for preparing the PI varnish by the steps of: 1) preparing a mixed solution of 60-100% by weight aprotic solvent, and 0-40% by weight aromatic solvent; 2) adding into the mixed solution in a mole ratio of 1:9 two aromatic diamines; and 3) further adding in the mixed solution in a mole ratio of 1:5 two aromatic dianhydrides.

Abstract: Disclosed is a method to obtain a film of composite material based on particles of conductive polymer, stabilized by a highly steric or highly ionic surfactant. The efficient stabilization of the particles makes it possible to control the progress of the dielectrical properties of the materials as a function of the conductive entity content, leading to the preparation of films with variable impedance. The method can be applied to the making of coatings that meet goals related to electromagnetic wide-band attenuation. FIG. 2 .

Abstract: A protective film of plastic is applied to a printed-circuit board fitted with electronic components on at least one side. In order to keep some areas free of plastic film, a vat has an exposed rim which corresponds in shape to the outline of the surface(s) to be coated and lies in a single plane. The circuit board is placed, with the side to be partly coated facing inward, against the coplanar rim of the vat and is pressed against the rim defining the shape of the surface(s) to be coated. The vat is subsequently pivoted, together with the circuit board on it, into a position in which the circuit board forms the floor of the vat and liquid coating material contained in the vat spreads over the surface(s) to be coated, wetting them. The vat is then pivoted into a position in which excess coating material can drain off the circuit board.

Abstract: A gas discharge tube using a tunnel effect type electron emitting device as a cathode is provided. The electron emitting device comprises a conductive metal base and a dielectric film formed preferably of a material containing MgO as a main component on the metal base. The dielectric film faces an anode and is exposed to a gas in the tube. In the cathode of this structure, discharge is effected at a relatively low DC voltage.

Abstract: In one form of the invention, an electronic device having a conformally coated Faraday cage, comprising a non-conductive conformal layer (30) substantially coveting the electronic device (10, 12) and a conductive conformal layer (34) substantially coveting the non-conductive conformal layer.

Abstract: A method of plating hydrous metal oxides on at least one substrate, which method is indifferent to the electrochemical properties of the substrate, and comprises reacting metallic ions in aqueous solution with an appropriate oxidizing agent such as sodium hypochlorite or calcium sulfite with oxygen under suitable conditions of pH and concentration such that oxidation and precipitation of metal oxide are sufficiently slow to allow satisfactory plating of metal oxide on the substrate.

Abstract: This invention concerns a method of manufacturing printed wiring boards by electrolessly plating copper on a precatalyzed base material which contains a polymeric resin, woven glass cloth reinforcement and a noble metal catalyst on clay support to precatalyze the base material for electrolessly depositing copper. The improvement comprises providing in the polymeric resin, a phenolic resin component and a silicate filler. The silicate filler is present in an amount between 30 and 100 part per hundred parts of the polymeric resin, and in an amount sufficient to provide a take time for the initiation of electroless copper deposition at least two times faster than a comparable precatalyzed base material without the silicate filler and phenolic resin.

Abstract: A method of forming a multilayered structure by flattening an uneven deposited surface thereof. It comprises the steps of: forming lower and higher portions on the deposited surface with different kinds of materials; and depositing a material selectively on the lower portions alone on the surface using the difference in nucleation density between the deposited materials due to the kinds of the materials of the deposited surface, thereby flattening the surface.

Abstract: A conformal, substantially uniform thickness layer of photoresist is deposited on a semiconductor wafer by causing photoresist solids to "sediment" out of solution or suspension. Generally, the more conformal the layer, the more uniform the reflectance of the layer and the less variation in underlying feature critical dimension (cd). In order to accommodate possible resulting deviations in photoresist layer thickness causing undesirable reflectance nonuniformities (and cd variations), a top antireflective coating may be applied to the photoresist layer. In the case of a point-by-point lithography process, such as e-beam lithography, the thickness/reflectance variations can be mapped, and exposure doses adjusted accordingly.

Abstract: A dielectric substrate is conditioned for subsequent electroless plating thereon by contacting with a catalytic metal salt and then with a reducing agent and with an electroless metal plating bath followed by contacting with a second catalytic metal salt. In addition, a dielectric substrate is conditioned for electroless plating thereon by obtaining a substrate of a dielectric material that contains metal particles therein and contacting with a catalytic metal salt.