Patents Examined by Zhengfu J Feng
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Patent number: 11799999Abstract: The protective corner apparatus is fitted along a portable mobile device, such that the protective corner apparatus provides sufficient protection while maintaining and complementing the core aesthetic design of the portable smart device. The protective corner apparatus contains a first protective layer, and a second protective layer. The first protective layer contains a first backing, a first mounting surface, and at least one retaining hook. The second protective layer contains a second backing, a second mounting surface, a slit, and a retaining ridge. The first protective layer is connected adjacent to the second protective layer. The first mounting surface is positioned on the first backing. The at least one retaining hook is angularly connected to the first backing. The second mounting surface is positioned on the second backing. The retaining ridge is angularly connected to the second backing. The slit is positioned between the second backing and the retaining ridge.Type: GrantFiled: April 28, 2021Date of Patent: October 24, 2023Inventor: Eric Adjesson
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Patent number: 11785717Abstract: An electronic board assembly comprises a board comprising an electronic component and a connector mounted to the board and electrically connected to the electronic component. The connector is configured to receive an electronic card assembly, and the connector comprises an electrical contact and a friction contact. The electrical contact is configured to exert a first amount of force on the electronic card assembly when the electronic card assembly is being seated in the connector. The friction contact is configured to exert a second amount of force on the electronic card assembly when the electronic card assembly is being seated in the connector. The second amount of force is greater than the first amount of force.Type: GrantFiled: December 23, 2020Date of Patent: October 10, 2023Assignee: International Business Machines CorporationInventors: Tyler Jandt, Mark Plucinski, Sandra J. Shirk/Heath, Phillip V. Mann
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Patent number: 11778765Abstract: An electronic device is provided. The electronic device includes a housing having an insertion slot, a connecting interface, and an adaptor card. The connecting interface is disposed in the housing for connecting with a first electronic module or a second electronic module separately and has a first connecting part and a second connecting part. The adaptor card is detachably disposed in the housing and includes a flow guide. When the electronic device is in a first mode, the first electronic module is connected to the first connecting part, and the adaptor card is disposed between the insertion slot and the connecting interface. The flow guide directs an airflow toward the first electronic module. When the electronic device is in a second mode, the adaptor card is removed from the housing, and the second electronic module is connected to the first connecting part and the second connecting part.Type: GrantFiled: August 11, 2021Date of Patent: October 3, 2023Assignee: WISTRON NEWEB CORPORATIONInventors: Tsung-Han Wu, Yu-Shuo Wu
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Patent number: 11758677Abstract: A release mechanism is disclosed that can facilitate safely and efficiently removing an expansion card from a computing device. The release mechanism can be installed on a motherboard around an expansion slot, and can include an opening that permits access to the expansion slot to allow an expansion card to be installed therein. When removal of the expansion card is desired, a handled of the release mechanism can be pulled, causing contact surfaces of the release mechanism to push the expansion card away from the expansion slot with even force, removing the need to tilt the expansion card.Type: GrantFiled: August 4, 2020Date of Patent: September 12, 2023Assignee: QUANTA COMPUTER INC.Inventors: Chun Chang, Hsin-Chieh Lin, Chih-Hao Chang, Yi-Fu Liu
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Patent number: 11751341Abstract: An electronic apparatus includes a bottom cover, a main board provided with a stud, a screw, a washer, and a sponge. The screw has a head portion having a diameter larger than that of an attachment hole, a male screw portion configured to be screwed into a first female screw portion, and a columnar portion having a diameter smaller than a root diameter of the male screw portion. The washer has a flange portion having a diameter larger than that of the attachment hole, a cylindrical portion having a diameter smaller than that of the attachment hole, and a second female screw portion which the male screw portion is screwable into and passable through. The head portion abuts on the bottom cover to fix the bottom cover by the male screw portion. The flange portion is between the stud and the bottom cover.Type: GrantFiled: July 19, 2021Date of Patent: September 5, 2023Assignee: LENOVO (SINGAPORE) PTE. LTD.Inventors: Tatsuya Ushioda, Jun Iwasaki, Masaaki Bandoh, Ryota Watanabe, Hiroshi Yamazaki
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Patent number: 11751352Abstract: A method and assembly for locking/unlocking, formed of one of several a removable module (2) and a mount plate (3). The assembly includes a support wall (4) supporting each removable module (2). The removable module (2) being provided with two lugs (5) through which an aperture passes. The lugs (5) extending out of the removable (2) so that they can be inserted into opening (7) formed in the support wall (4). This assembly is equipped with a locking/unlocking system (100) having a lever (10) extending under the support wall (4) and provided with circular eccentric cams (11) arranged with offset axial symmetry in the form of an S about a central rotation axle (20) perpendicular to the support wall (4). The lever (10) being fixed in terms of rotation on this central axle (2) at equal distances from the two openings (7).Type: GrantFiled: May 2, 2019Date of Patent: September 5, 2023Assignee: LATELECInventors: Jean Francois Bousquet, Bastien Puertolas
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Patent number: 11744036Abstract: A rooftop mounted display assembly includes a first and second electronic display located at a housing for mounting to a roof of a vehicle. Apertures are vertically spaced apart along either end of thermal plates located behind the electronic displays. Fan(s), when activated, force ambient air through an inlet aperture located at a proximal end of the housing, the apertures at a first end of the thermal plates, channels located between the thermal plates and the electronic displays, the apertures at a second end of the thermal plates, and an exhaust aperture at a distal end of the housing.Type: GrantFiled: September 18, 2020Date of Patent: August 29, 2023Assignee: Manufacturing Resources International, Inc.Inventor: Marcos Diaz
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Patent number: 11729939Abstract: A cooling assembly includes a panel defining an opening, a cooling unit including an output and coupled to the panel such that the output at least partially covers the opening of the panel, and spring-loaded latch assemblies coupled to the panel and configured to couple the cooling assembly to an enclosure.Type: GrantFiled: February 7, 2020Date of Patent: August 15, 2023Assignee: Seagate Technology LLCInventor: Michael J. Russell
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Patent number: 11706883Abstract: A power semiconductor module contains a power semiconductor assembly, a housing which in a housing side with an outer surface has a recess with a direction of passage in the normal direction of the outer surface, having an internal contact device which has an electrically conducting contact inside the housing to an external connection element, designed as a load terminal element, with one section in the recess and having a spring element. The connection element is designed as a rigid metallic shaped body with an inner and an outer contact surface, and the outer contact surface is accessible from the outside, and the connection element is connected to the housing via an electrically insulating and mechanically elastic retaining device such that the connection element is moveable in the direction of passage, and wherein the spring element is arranged and designed in such a way that the spring action thereof acts directly or indirectly on the connection element in the direction of passage.Type: GrantFiled: March 18, 2020Date of Patent: July 18, 2023Assignee: SEMIKRON ELEKTRONIK GMBH & CO. KGInventors: Sandro Bulovic, Harald Kobolla
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Patent number: 11699884Abstract: An apparatus for grounding a heatsink utilizing an EMC spring press-fit pin includes a printed circuit board, a logic chip, a heatsink, and a grounding member, where the grounding member includes an integrated spring and a first terminal pin at a first end of the grounding member. The logic chip is electrically coupled to the printed circuit board and the heatsink is disposed on a top surface of the logic chip. The first terminal pin at the first end of the grounding member is disposed in a plated-through hole of the printed circuit, where the grounding member is configured to electrically couple the heatsink to the printed circuit board.Type: GrantFiled: July 27, 2020Date of Patent: July 11, 2023Assignee: International Business Machines CorporationInventors: David J. Braun, John R. Dangler, Timothy P. Younger, James D. Bielick, Stephen Michael Hugo, Theron Lee Lewis, Jennifer I. Bennett, Timothy Jennings
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Patent number: 11678461Abstract: A fan tray system includes a fan tray base that couples to a chassis and that includes fan system connector(s) for connecting to a fan system. A fan tray side wall includes fan system guide member(s) that align the fan system for connection to the fan system connector(s), and is connected to the fan tray base by a moveable coupling that allows relative movement between the fan tray side wall and the fan tray base. That relative movement allows the fan tray side wall to be positioned in a first orientation when the fan tray base is coupled to the chassis such that the fan tray side wall is positioned adjacent a chassis wall of the chassis and impedes access component(s) in the chassis. That relative movement also allows the fan tray side wall to be moved to a second orientation that allows access to the component(s) in the chassis.Type: GrantFiled: February 8, 2021Date of Patent: June 13, 2023Assignee: Dell Products L.P.Inventors: Darren Burke Pav, Jake Hill Lavallo
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Patent number: 11604491Abstract: The described embodiments relate generally to computing devices including liquid crystal displays (LCDs) and more particularly to methods for attaching a cover glass layer to a structural housing while minimizing an amount of stress transferred through the cover glass layer to the LCD module. A continuous and compliant foam adhesive can be used to bond the cover glass layer to a structural. The compliant bond can absorb and distribute local stress concentrations caused by structural loads, mismatched surfaces and differing thermal expansion rates between various structures and cover glass layer. This can reduce stress concentrations in the cover glass layer that can lead to stress induced birefringence in the LCD cell. In other embodiments, the cover glass layer can be attached using magnets or a tongue and groove design.Type: GrantFiled: July 13, 2017Date of Patent: March 14, 2023Assignee: Apple Inc.Inventors: Dinesh C. Mathew, Edward J. Cooper, Brett W. Degner, Keith J. Hendren, Nicholas Alan Rundle, Dave Tarkington
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Patent number: 11602066Abstract: The invention relates to a structure (1) for housing electronic apparatuses (10) such as boards (11) and the like, wherein the apparatuses are arranged in a container with a drawer (40) insertable and extractable with respect to a frame (20) of the structure (1). On the back wall of the drawer (40) and on the frame (20) connectors (53, 54) are provided which are coupled directly and automatically when the drawer is inserted.Type: GrantFiled: September 8, 2017Date of Patent: March 7, 2023Assignee: HITACHI RAIL STS S.P.A.Inventors: Renzo Tresanini, Nicola Baschiera, Paolo Spiga
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Patent number: 11582890Abstract: An equipment enclosure (1) for electromagnetically isolating an electronic device, the equipment enclosure 1 comprising a conductive housing (3) and a plurality of conductive sheets (5). Each sheet (5) includes an aperture (7). The sheets (5) are stacked in a spaced-apart relationship within the housing (3) thereby defining a plurality of electromagnetically-isolated cavities (9) each within a respective Faraday cage formed by the conductive housing (3) and the conductive sheets (5). The apertures (7) form a channel (11) that extends through the enclosure (1) providing a route for connections between the cavities (9).Type: GrantFiled: September 10, 2020Date of Patent: February 14, 2023Assignee: BAE Systems plcInventors: Simon Bishop, Carl Martin Matthews, Curtis Baker
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Patent number: 11582886Abstract: A modular server design includes a server chassis, a cooling module within the server chassis housing at least one cooling unit, an electronics module within the server chassis holding a motherboard, and a cooling connecting panel. The cooling connecting panel includes a number of cooling channels to fluidly connect the at least one cooling unit of the cooling module with a cooling device on the motherboard. The cooling module includes components to enable proper heat and fluid transfer.Type: GrantFiled: February 5, 2020Date of Patent: February 14, 2023Assignee: BAIDU USA LLCInventor: Tianyi Gao
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Patent number: 11570924Abstract: In one embodiment, an apparatus is provided. The apparatus includes a printed circuit board. The apparatus also includes a first connector coupled to the printed circuit board. The first connector is configured to couple the apparatus to a computing device. The apparatus further includes a second connector coupled to the printed circuit board. The second connector is configured to couple the apparatus to a data storage device. The apparatus further includes a securement mechanism comprising a first portion and a second portion. The securement mechanism is movable about the apparatus between a first position and a second position. The first portion is configured to maintain the securement mechanism at the first position. The second portion is configured to secure the data storage device to the apparatus when the securement mechanism is in the first position.Type: GrantFiled: February 24, 2020Date of Patent: January 31, 2023Assignee: Western Digital Technologies, Inc.Inventors: Everett Lyons, Daniel Linnen, Randy Gillespie
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Patent number: 11557529Abstract: A microprocessor heat sink fastener assembly, comprising a base to couple to a heat sink a retention nut to be received by a cavity of the base, and a retention clip to be attached to the base and to be cantilevered therefrom. The retention clip is to engage with a latching structure extending from a latching structure of a retention plate.Type: GrantFiled: March 30, 2018Date of Patent: January 17, 2023Assignee: Intel CorporationInventors: Thomas Boyd, Ming-Chen Chang, Evan A. Chenelly, Divya Swamy Bandaru, Craig J. Jahne, Andrew Larson, Eric W. Buddrius, Eric D. McAfee, Mustafa Haswarey, Ralph V. Miele, Rolf Laido
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Patent number: 11540411Abstract: A coupling for connecting a circuit board to a mount with a fastener. The mount may be connected to a component. The fastener includes a first snap-fit connection formation for establishing a snap-fit connection with a second snap-fit connection formation provided on the mount. When connected, the fastener clamps the circuit board against the mount. The fastener further includes a first engagement formation configured to engage with a second engagement formation on the mount for bracing the snap-fit connection.Type: GrantFiled: April 16, 2021Date of Patent: December 27, 2022Assignee: Aptiv Technologies LimitedInventors: Ralf Slawik, Thorsten Mauff
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Patent number: 11536292Abstract: A fan assembly includes a socket to receive a fan module, a fan flap coupled to a first side wall of the socket, and an anti-reflow device coupled to a second side wall of the socket. The fan flap moves in a curved path between a first position and a second position. The anti-reflow device has an attachment feature, an embossed feature, and a stopping feature. The attachment feature attaches the anti-reflow device to the second side wall. The embossed feature extends through a first aperture in the second side wall. The stopping feature extends through a second aperture in the second side wall and contacts the fan flap. When the fan module is removed, the stopping feature retains the fan flap in the first position to block the socket and prevent air from reflowing through the socket.Type: GrantFiled: March 15, 2019Date of Patent: December 27, 2022Assignee: QUANTA COMPUTER INC.Inventors: Yaw-Tzorng Tsorng, Chun Chang, Ting-Kuang Pao, Chih-Hao Chang
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Patent number: 11527458Abstract: A 2-in-1 power electronics assembly includes a frame with a lower dielectric layer, an upper dielectric layer spaced apart from the lower dielectric layer, and a sidewall disposed between and coupled to the lower dielectric layer and the upper dielectric layer. The lower dielectric layer includes a lower cooling fluid inlet and the upper dielectric layer includes an upper cooling fluid outlet. A first semiconductor device assembly and a second semiconductor device assembly are included and disposed within the frame. The first semiconductor device is disposed between a first lower metal inverse opal (MIO) layer and a first upper MIO layer, and the second semiconductor device is disposed between a second lower MIO layer and a second upper MIO layer. An internal cooling structure that includes the MIO layers provides double sided cooling for the first semiconductor device and the second semiconductor device.Type: GrantFiled: September 13, 2019Date of Patent: December 13, 2022Assignee: TOYOTA MOTOR ENGINEERING & MANUFACTURING NORTH AMERICA, INC.Inventors: Ercan Mehmet Dede, Shailesh N. Joshi