Abstract: A flight control device includes a housing, a main control board provided in the housing, an inertial measurement unit provided in the housing and electrically connected to the main control board, and a power management unit provided at the housing and electrically connected to the main control board. The main control board, the inertial measurement unit, and the power management unit are fixedly connected to and integrated with the housing as a whole.

Abstract: Provided is an enclosure for use in a modular storage system, the enclosure comprising a plurality of drive bays, a controller canister, an expansion canister, and a midplane connecting the drive bays to the canisters, wherein the controller canister occupies a greater volume of the enclosure than the expansion canister.

Abstract: A flexible printed circuit board assembly (PCBA) for a conformal wearable battery (CBB) includes attachment sections for a plurality of battery cells that are arranged in a grid-like pattern on a same side of the flexible PCBA. The flexible PCBA is configured to fold along a bend axis so that the flexible PCBA is folded approximately in half. To reduce mechanical stresses placed on the flexible PCBA when folding the flexible PCBA along the bend axis, the flexible PCBA includes a plurality of cut-outs dispersed along the bend axis and parallel to adjacent battery cells. The CWB is configured to flex during use. The flexible PCBA includes a plurality of cut-outs disposed perpendicular to the bend axis, between adjacent rows of battery cells, and on the bend axis to relieve mechanical stresses applied to a bent portion of the flexible PCBA when the CWB is flexed during use.

Abstract: In an example, a server system is provided. The server system includes a frame including a support structure and a server supported by the support structure. The server system includes an actuator configured to cause the server to transition from a first position to a second position to increase exposure of the server to airflow to transfer heat away from the server via convection. The actuator is also configured to cause the server to transition from the second position to the first position to decrease exposure of the server to the airflow.

Abstract: The present invention provides an inverter including: a middle frame in which a main circuit is disposed; an upper case disposed above the middle frame and configured to accommodate the main circuit; and a lower case disposed under the middle frame and having a first vent hole formed in one side surface thereof; a fan disposed at the other side surface of the lower case facing the first vent hole; a heat sink interposed between the first vent hole and the fan; an auxiliary housing disposed under the lower case, configured to accommodate an auxiliary circuit, and including a second vent hole in at least one side surface thereof; and a controller disposed in the main circuit of the auxiliary circuit.

Abstract: A battery is provided. The battery includes a battery pouch including at least one conductive terminal exposed to the outside, a printed circuit board electrically connected with the at least one conductive terminal and including a signal area and a non-signal area, a protection circuit electrically connected with the battery pouch, disposed on the signal area, and a heat dissipation plate connected with the non-signal area.

Abstract: A streamlined air baffle for efficiently directing air flow from a fan unit to a heat sink is disclosed. The streamlined air baffle has a top cover plate and a pair of side walls. The side walls are connected to the top cover plate. The top cover plate and one end of the side walls define an inlet. A curved surface of the top cover plate defines the outlet with the opposite ends of the side walls. The cross section area of the outlet is smaller than the cross section area of the inlet.

Abstract: An electronic memory module can be cooled by a cooling assembly that consists of at least a printed circuit board connected to at least one data storage component. The memory module may be housed within, and in physical contact with, a cooling frame that surrounds a periphery of the printed circuit board. The cooling frame can have a seating tab that is separated from the memory module, spans the memory module, and supports a heatsink in contact with the at least one data storage component.

Abstract: A solid-state drive device includes a memory module in which at least one non-volatile memory device is mounted, a first heat storage unit and a second heat storage unit covering upper and lower parts of the memory module, respectively, to store heat emitted by the memory module, and having at least portions connected to each other, respectively, a cover having a space in which the memory module and the first and second heat storage units are received and arranged with a spacing distance from the first and second heat storage units, respectively, and an inner frame arranged between the cover and at least one of the first and second heat storage units, to provide the spacing distance.

Abstract: Embodiments of the disclosure relate to the technical field of display, and in particular, to a mobile display device, comprising: a housing; a battery and a circuit board both provided within the housing, the battery being interposed between the circuit board and the housing, or alternatively, the battery and the circuit board being arranged side by side; a chip provided on the circuit board; a heat dissipation unit which is also provided on the circuit board and is configured to dissipate heat from the chip; and a first thermally-conductive connector which connects the heat dissipation unit with the housing.

Abstract: An electronic component unit includes a heatsink, a substrate on which electronic component is installed, a fixing metal fitting that fixes the electronic component and the substrate to the heatsink, and a fastening member that fixes the fixing metal fitting to the heatsink, and the heatsink includes a body portion, and a fixing portion that is projecting from the body portion toward the substrate side and to which the fixing metal fitting is fixed, and the substrate includes a through-hole that the fixing portion penetrates through, and the fixing metal fitting includes a base portion that contacts the fixing portion and is fixed to the fixing portion by the fastening member, and a pressing portion that extends from one end of the base portion, elastically deforms with respect to the base portion, and presses the electronic component toward the substrate side.

Abstract: A fan tray system includes a fan tray base that couples to a chassis and that includes fan system connector(s) for connecting to a fan system. A fan tray side wall includes fan system guide member(s) that align the fan system for connection to the fan system connector(s), and is connected to the fan tray base by a moveable coupling that allows relative movement between the fan tray side wall and the fan tray base. That relative movement allows the fan tray side wall to be positioned in a first orientation when the fan tray base is coupled to the chassis such that the fan tray side wall is positioned adjacent a chassis wall of the chassis and impedes access component(s) in the chassis. That relative movement also allows the fan tray side wall to be moved to a second orientation that allows access to the component(s) in the chassis.

Abstract: A heat dissipating assembly suited for an electronic device is provided. The electronic device has at least one heat source. The heat dissipating assembly includes a first tube, a second tube, and a fluid. The first tube has an inlet and an outlet, wherein a bore size of the inlet is smaller than a bore size of the outlet. Heat generated from the heat source is transferred to the first tube. Two opposite ends of the second tube are connected to the inlet and the outlet such that the first and the second tubes are formed into a closed loop. The fluid is filled in the closed loop. The fluid in the first tube transferred from the inlet toward the outlet absorbs the heat and is transferred to the second tube for heat dissipating. An electronic device is also provided.

Abstract: A printed circuit board assembly is provided. A printed circuit board assembly includes a printed circuit board; an electronic component mounted on the printed circuit board; a heat radiating member which contacts the electronic component and is configured to receive and conduct heat generated by the electronic component; and at least one connection part connecting the printed circuit board and the heat radiating member to each other and configured to transfer the heat conducted through the heat radiating member to the printed circuit board.

Abstract: A printed circuit board includes at least one of a first coil pattern disposed on a first main surface and a second coil pattern disposed on a second main surface. The first coil pattern includes a first portion arranged between a first core portion and a second core portion. The second coil pattern includes a third portion arranged between the first core portion and the second core portion. A first heat transfer member is mounted on at least one of the first portion and the third portion. Therefore, temperature increase of at least one of the first portion and the third portion can be suppressed.

Abstract: A liquid-cooled electric drive component for a powertrain of a vehicle includes a first housing part and a second housing part. The first and second housing parts are joined to one another by a fluid-tight welded joint and configured such as to form at least a segment of a cooling duct. The vehicle can be a hybrid vehicle or an electric vehicle.

Abstract: A cooling device includes a fan for blowing air to a control board arranged on the downstream side by rotation of a rotator. The cooling device further includes a bypass structure provided so as to avoid the rotator and configured to oil liquid to flow, at least, from the upstream side of the fan to the downstream side of the fan, and a gutter provided on the upstream side of the fan to lead the oil liquid to the bypass structure.

Abstract: A thermal interface assembly for transferring heat from a heat generating component to a heat dissipating component. The thermal interface assembly includes a plurality of discrete thermal sheets attached to a resilient pad.

Abstract: A memory heat dissipation unit is disclosed. The memory heat dissipation unit includes a main body having a first portion, a second portion and a connection portion having two lateral edges separately connected to the first and the second portion. The first and the second portion have at least one first heat-receiving section and at least one second heat-receiving section formed thereon, respectively; and the first and the second heat-receiving section are correspondingly in contact with at least one memory chip each to exchange heat with the chips and accordingly cool the same.

Abstract: There is provided an electronic apparatus that includes a heat radiation unit capable of radiating heat efficiently from a heat pipe. The electronic apparatus includes: a blower fan that blows air toward an exhaust port formed in a main body chassis; a heat radiation fin provided in an air-blowing outlet of the blower fan; and a heat pipe fixed to the heat radiation fin. In a region in contact with the heat pipe, the heat radiation fin is of a partial connection structure in which multiple fin members are partially fixed and connected to one another, and in a region with no contact with the heat pipe, the heat radiation fin is a structure of continuous fins.