Patents by Inventor Abdlmonem H. Beitelmal
Abdlmonem H. Beitelmal has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 6981915Abstract: A control system for controlling airflow through a vent. The system includes a vent assembly having a frame. The frame includes an opening to allow air to flow through the frame. The vent assembly also includes a movable damper for variably restricting the fluid flow through the opening in the vent assembly, a motor for controlling movement of the damper, and a sensor for determining the position of the damper. In addition, a controller is provided to control the motor to vary the position of the damper to thereby vary the airflow through the opening in the vent assembly.Type: GrantFiled: March 15, 2004Date of Patent: January 3, 2006Assignee: Hewlett-Packard Development Company, L.P.Inventors: David Allen Moore, Abdlmonem H. Beitelmal, Cullen E. Bash
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Patent number: 6945058Abstract: In a cooling system for cooling racks in a data center, cooling fluid is circulated in the data center by a cooling device having a fan. In addition, this system includes a plenum having a plurality of returns and an outlet. The outlet of the plenum is in fluid communication with the fan and the plurality of returns are configured for removing the cooling fluid from the data center. Furthermore, the returns and are operable to vary a characteristic of the removal of the cooling fluid.Type: GrantFiled: May 14, 2004Date of Patent: September 20, 2005Assignee: Hewlett-Packard Development Company, L.P.Inventors: Cullen E. Bash, Chandrakant D. Patel, Abdlmonem H. Beitelmal, Ratnesh K. Sharma
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Patent number: 6926078Abstract: A system and method for reducing temperature variation among components in a multi-component system. In this respect, component temperatures are controlled to remain relatively constant (approximately within 5° C.) with respect to other components, while allowing for multiple fluctuating heat loads between components. A refrigeration system possessing a variable capacity (speed) compressor and a thermostatic expansion valve is utilized to control the flow of refrigerant through the refrigeration system. The temperatures of the components are reduced by metering the mass flow rate of the refrigerant cooling the components to compensate for the heat load applied to the refrigeration system. The temperature variation among the components is reduced by supplemental heaters independently providing heat to each respective component.Type: GrantFiled: September 30, 2003Date of Patent: August 9, 2005Assignee: Hewlett-Packard Development Company, L.P.Inventors: Abdlmonem H. Beitelmal, Cullen E. Bash, Chandrakant D. Patel
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Patent number: 6904968Abstract: A cooling system is configured to supply individually metered amounts of cooling fluid to heat generating components of an electronic system. The cooling system includes at least one variable speed fan configured to supply fluid through a centralized plenum and thereafter through a plurality of nozzles to the components of the electronic system. Each of the nozzles contains a valve to control the amount of fluid flow through the each of the nozzles. A controller is provided to control the operation of the variable speed fan and the operation of each of the valves is also controlled by a controller.Type: GrantFiled: September 14, 2001Date of Patent: June 14, 2005Assignee: Hewlett-Packard Development Company, L.P.Inventors: Abdlmonem H. Beitelmal, Chandrakant D. Patel
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Patent number: 6876549Abstract: A cooling system is configured to supply individually metered amounts of cooling fluid to heat generating components, e.g., processors, micro-controllers, high speed video cards, disk drives, semi-conductor devices, and the like, of an electronic system. The cooling system includes at least one variable speed fan, e.g., blower, configured to supply fluid through a centralized plenum and thereafter through a plurality of nozzles to the components of the electronic system. Each of the nozzles contains a valve to control the amount of fluid flow through the each of the nozzles. A controller is provided to control the operation of the variable speed fan and the operation of each of the valves is also controlled by a controller.Type: GrantFiled: October 31, 2003Date of Patent: April 5, 2005Assignee: Hewlett-Packard Development Company, L.P.Inventors: Abdlmonem H. Beitelmal, Chandrakant D. Patel
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Patent number: 6868683Abstract: In a cooling system for cooling racks in a data center, cooling fluid is circulated in the data center by a cooling device having a fan. In addition, this system includes a plenum having a plurality of returns and an outlet. The outlet of the plenum is in fluid communication with the fan and the plurality of returns are configured for removing the cooling fluid from the data center. Furthermore, the returns and are operable to vary a characteristic of the removal of the cooling fluid.Type: GrantFiled: October 31, 2003Date of Patent: March 22, 2005Assignee: Hewlett-Packard Development Company, L.P.Inventors: Cullen E. Bash, Chandrakant D. Patel, Abdlmonem H. Beitelmal, Ratnesh K. Sharma
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Patent number: 6862179Abstract: In a data center, a plurality of racks are cooled by activating a cooling device and opening a controllable partition configured to vary a supply of cooling fluid within a zone of the data center. The zone includes at least one associated rack of the plurality of racks. In addition, the temperature of at least one associated rack is sensed and it is determined whether the sensed temperature is within a predetermined temperature range. Furthermore, the controllable partition is manipulated to vary the supply of the cooling fluid to the zone in response to the sensed temperature being outside the predetermined temperature range.Type: GrantFiled: November 26, 2002Date of Patent: March 1, 2005Assignee: Hewlett-Packard Development Company, L.P.Inventors: Abdlmonem H. Beitelmal, Chandrakant D. Patel
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Patent number: 6854284Abstract: In a cooling system for cooling racks in a data center, cooling fluid is circulated in the data center by a cooling device having a fan. In addition, this system includes a plenum having a plurality of returns and an outlet. The outlet of the plenum is in fluid communication with the fan and the plurality of returns are configured for removing the cooling fluid from the data center. Furthermore, the returns and are operable to vary a characteristic of the removal of the cooling fluid.Type: GrantFiled: October 31, 2003Date of Patent: February 15, 2005Assignee: Hewlett-Packard Development Company, L.P.Inventors: Cullen E. Bash, Chandrakant D. Patel, Abdlmonem H. Beitelmal, Ratnesh K. Sharma
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Patent number: 6832489Abstract: In a cooling system for cooling racks in a data center, cooling fluid is circulated in the data center by a cooling device having a fan. In addition, this system includes a plenum having a plurality of returns and an outlet. The outlet of the plenum is in fluid communication with the fan and the plurality of returns are configured for removing the cooling fluid from the data center. Furthermore, the returns and are operable to vary a characteristic of the removal of the cooling fluid.Type: GrantFiled: October 31, 2003Date of Patent: December 21, 2004Assignee: Hewlett-Packard Development Company, LPInventors: Cullen E. Bash, Chandrakant D. Patel, Abdlmonem H. Beitelmal, Ratnesh K. Sharma
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Patent number: 6832490Abstract: In a cooling system for cooling racks in a data center, cooling fluid is circulated in the data center by a cooling device having a fan. In addition, this system includes a plenum having a plurality of returns and an outlet. The outlet of the plenum is in fluid communication with the fan and the plurality of returns are configured for removing the cooling fluid from the data center. Furthermore, the returns and are operable to vary a characteristic of the removal of the cooling fluid.Type: GrantFiled: October 31, 2003Date of Patent: December 21, 2004Assignee: Hewlett-Packard Development Company, L.P.Inventors: Cullen E. Bash, Chandrakant D. Patel, Abdlmonem H. Beitelmal, Ratnesh K. Sharma
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Publication number: 20040243280Abstract: A method for operating a data center with a robotic device. In the method, a condition is detected in a location of the data center. The robotic device, which includes a camera and a manipulator, is maneuvered to travel to the location of the data center. The location of the data center is imaged with the camera of the robotic device and an object is manipulated with the manipulator of the robotic device.Type: ApplicationFiled: May 29, 2003Publication date: December 2, 2004Inventors: Cullen E. Bash, Abdlmonem H. Beitelmal, Keith Farkas, Chandrakant D. Patel, Parthasarathy Ranganathan
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Patent number: 6817204Abstract: A modular semiconductor chip cooling system having a readily openable enclosure defining a chamber configured to hold a printed circuit board carrying components to be cooled. The enclosure can include a reservoir, a condenser and a pump. Sprayers within the chamber are adjustably mounted on one or more brackets to allow each sprayer to be set for the individual height of its respective component. The enclosure can be readily removed from a computer system through a quick release connection. The computer system can include a condenser and pump to operate all its modular cooling systems, removing the condensing function from the individual modules.Type: GrantFiled: October 14, 2003Date of Patent: November 16, 2004Assignee: Hewlett-Packard Development Company, L.P.Inventors: Cullen E. Bash, Abdlmonem H. Beitelmal, Chandrakant D. Patel
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Publication number: 20040206101Abstract: In a cooling system for cooling racks in a data center, cooling fluid is circulated in the data center by a cooling device having a fan. In addition, this system includes a plenum having a plurality of returns and an outlet. The outlet of the plenum is in fluid communication with the fan and the plurality of returns are configured for removing the cooling fluid from the data center. Furthermore, the returns and are operable to vary a characteristic of the removal of the cooling fluid.Type: ApplicationFiled: May 14, 2004Publication date: October 21, 2004Inventors: Cullen E. Bash, Chandrakant D. Patel, Abdlmonem H. Beitelmal, Ratnesh K. Sharma
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Patent number: 6775997Abstract: In a cooling system for cooling racks in a data center, cooling fluid is circulated in the data center by a cooling device having a fan. In addition, this system includes a plenum having a plurality of returns and an outlet. The outlet of the plenum is in fluid communication with the fan and the plurality of returns are configured for removing the cooling fluid from the data center. Furthermore, the returns and are operable to vary a characteristic of the removal of the cooling fluid.Type: GrantFiled: October 3, 2002Date of Patent: August 17, 2004Assignee: Hewlett-Packard Development Company, L.P.Inventors: Cullen E. Bash, Chandrakant D. Patel, Abdlmonem H. Beitelmal, Ratnesh K. Sharma
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Patent number: 6772604Abstract: In a cooling system for cooling racks in a data center, cooling fluid is circulated in the data center by a cooling device having a fan. In addition, this system includes a plenum having a plurality of returns and an outlet. The outlet of the plenum is in fluid communication with the fan and the plurality of returns are configured for removing the cooling fluid from the data center. Furthermore, the returns and are operable to vary a characteristic of the removal of the cooling fluid.Type: GrantFiled: October 31, 2003Date of Patent: August 10, 2004Assignee: Hewlett-Packard Development Company, L.P.Inventors: Cullen E. Bash, Chandrakant D. Patel, Abdlmonem H. Beitelmal, Ratnesh K. Sharma
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Publication number: 20040118143Abstract: A modular semiconductor chip cooling system having a readily openable enclosure defining a chamber configured to hold a printed circuit board carrying components to be cooled. The enclosure can include a reservoir, a condenser and a pump. Sprayers within the chamber are adjustably mounted on one or more brackets to allow each sprayer to be set for the individual height of its respective component. The enclosure can be readily removed from a computer system through a quick release connection. The computer system can include a condenser and pump to operate all its modular cooling systems, removing the condensing function from the individual modules.Type: ApplicationFiled: October 14, 2003Publication date: June 24, 2004Inventors: Cullen E. Bash, Abdlmonem H. Beitelmal, Chandrakant D. Patel
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Publication number: 20040112582Abstract: A cooling system is configured to supply individually metered amounts of cooling fluid to heat generating components, e.g., processors, micro-controllers, high speed video cards, disk drives, semi-conductor devices, and the like, of an electronic system. The cooling system includes at least one variable speed fan, e.g., blower, configured to supply fluid through a centralized plenum and thereafter through a plurality of nozzles to the components of the electronic system. Each of the nozzles contains a valve to control the amount of fluid flow through the each of the nozzles. A controller is provided to control the operation of the variable speed fan and the operation of each of the valves is also controlled by a controller.Type: ApplicationFiled: October 31, 2003Publication date: June 17, 2004Inventors: Abdlmonem H. Beitelmal, Chandrakant D. Patel
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Publication number: 20040109288Abstract: In a data center, a plurality of racks are cooled by activating a cooling device and opening a controllable partition configured to vary a supply of cooling fluid within a zone of the data center. The zone includes at least one associated rack of the plurality of racks. In addition, the temperature of at least one associated rack is sensed and it is determined whether the sensed temperature is within a predetermined temperature range. Furthermore, the controllable partition is manipulated to vary the supply of the cooling fluid to the zone in response to the sensed temperature being outside the predetermined temperature range.Type: ApplicationFiled: November 26, 2002Publication date: June 10, 2004Inventors: Abdlmonem H. Beitelmal, Chandrakant D. Patel
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Publication number: 20040090729Abstract: A cooling system is configured to supply individually metered amounts of cooling fluid to heat generating components, e.g., processors, micro-controllers, high speed video cards, disk drives, semi-conductor devices, and the like, of an electronic system. The cooling system includes at least one variable speed fan, e.g., blower, configured to supply fluid through a centralized plenum and thereafter through a plurality of nozzles to the components of the electronic system. Each of the nozzles contains a valve to control the amount of fluid flow through the each of the nozzles. A controller is provided to control the operation of the variable speed fan and the operation of each of the valves is also controlled by a controller.Type: ApplicationFiled: October 31, 2003Publication date: May 13, 2004Inventors: Abdlmonem H. Beitelmal, Chandrakant D. Patel
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Publication number: 20040090744Abstract: A cooling system is configured to supply individually metered amounts of cooling fluid to heat generating components, e.g., processors, micro-controllers, high speed video cards, disk drives, semi-conductor devices, and the like, of an electronic system. The cooling system includes at least one variable speed fan, e.g., blower, configured to supply fluid through a centralized plenum and thereafter through a plurality of nozzles to the components of the electronic system. Each of the nozzles contains a valve to control the amount of fluid flow through the each of the nozzles. A controller is provided to control the operation of the variable speed fan and the operation of each of the valves is also controlled by a controller.Type: ApplicationFiled: October 31, 2003Publication date: May 13, 2004Inventors: Abdlmonem H. Beitelmal, Chandrakant D. Patel