Abstract: An air cooled electronic system within an enclosure simultaneously provides different levels of cooling in response to the individual cooling needs of the various electronic components. In one embodiment, electronic system includes a plenum that has an inlet and a plurality of outlets with the inlet receiving air from outside the enclosure. A rate of airflow at the respective plenum outlets varies as a function of a static air pressure behind the plenum outlets and a shape of the respective outlets, the static air pressure being a function of the shape of a cavity within the plenum. The system also includes a plurality of air ducts respectively coupled to the plurality of plenum outlets, with each air duct having a length and an outlet characterized by an outlet size. A first one of the air ducts has an outlet that is disposed proximate a first subset of the electronic components and a second one of the air ducts has an outlet that is disposed proximate a second subset of the electronic components.

Abstract: System and method for reducing temperature variation among components in a multi-component system. In this respect, component temperatures are controlled to remain relatively constant (approximately within 5° C.) with respect to other components, while allowing for multiple fluctuating heat loads between components. A refrigeration system possessing a variable capacity (speed) compressor and an electronic valve is utilized to control the flow of refrigerant through the refrigeration system. The temperature of the components is reduced by metering the mass flow rate of the refrigerant cooling the components to compensate for the heat load applied to the refrigeration system.

Abstract: System and method for reducing temperature variation among heat dissipating components in a multi-component computer system. In this respect, component temperatures are controlled to remain relatively constant (approximately within 5° C.) with respect to other components, while allowing for multiple fluctuating heat loads between components. A refrigeration system possessing a variable speed compressor or a constant speed compressor is utilized to control the flow of refrigerant through the refrigeration system. The temperature variation among components is reduced by independently metering the mass flow rate of the refrigerant flowing into each component to compensate for the amount of heat load on each component. In this respect, the mass flow rate of the refrigerant entering into each of the evaporators is metered by valves located upstream from each of the evaporators.

Abstract: A modular semiconductor chip cooling system having a readily openable enclosure defining a chamber configured to hold a printed circuit board carrying components to be cooled. The enclosure can include a reservoir, a condenser and a pump. Sprayers within the chamber are adjustably mounted on one or more brackets to allow each sprayer to be set for the individual height of its respective component. The enclosure can be readily removed from a computer system through a quick release connection. The computer system can include a condenser and pump to operate all its modular cooling systems, removing the condensing function from the individual modules.

Abstract: System and method for reducing temperature variation among heat dissipating components in a multi-component computer system. In this respect, component temperatures are controlled to remain relatively constant (approximately within 5° C.) with respect to other components, while allowing for multiple fluctuating heat loads between components. A refrigeration system possessing a variable speed compressor or a constant speed compressor is utilized to control the flow of refrigerant through the refrigeration system. The temperature variation among components is reduced by independently metering the mass flow rate of the refrigerant flowing into each component to compensate for the amount of heat load on each component. In this respect, the mass flow rate of the refrigerant entering into each of the evaporators is metered by valves located upstream from each of the evaporators.

Abstract: An improved cooling apparatus and related method are disclosed for air-cooling an array of electronic components mounted on a substrate. The cooling apparatus directs high-speed jets of cooling air directly at special heat sinks bonded to the particular electronic components that generate the most heat (e.g., microprocessors), with the air thereafter being directed to flow tangentially across the remaining components, to air-cool those components, as well. This configuration enables the requisite component cooling to be achieved with substantially reduced air flow rates and with heat sinks of substantially reduced size, as compared to prior cooling apparatus.