Patents by Inventor Akihiko Inoue

Akihiko Inoue has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6714420
    Abstract: The invention provides a surface mounting type electronic circuit unit that is suitable for miniaturization and is suitable for simple output adjustment. Circuit elements including capacitors, resistors, and inductance elements and a conducting pattern connected to the circuit elements are formed on an alumina substrate by means of thin film forming technique, and a diode D1 and a semiconductor chip of a transistor are fixed to a connection land of the conducting pattern by means of wire bonding, wherein only the emitter resistor out of the base bias voltage dividing resistors and the emitter resistor of the transistor is trimmed for output adjustment.
    Type: Grant
    Filed: May 29, 2001
    Date of Patent: March 30, 2004
    Assignee: Alps Electric Co., Ltd.
    Inventors: Akiyuki Yoshisato, Kazuhiko Ueda, Yasuhiro Ikarashi, Akihiko Inoue, Hiroshi Sakuma
  • Patent number: 6700177
    Abstract: In a surface-mounting-type electronic-circuit unit, circuit elements, including capacitors, resistors, and inductive devices, and electrically conductive patterns connected to the circuit elements are formed on an alumina board as thin films. Semiconductor bare chips for a diode and a transistor are wire-bonded to connection lands in electrically conductive patterns. And end-face electrodes connected to grounding electrodes, input electrodes, and output electrodes of electrically conductive patterns are formed at side faces of the alumina board.
    Type: Grant
    Filed: May 29, 2001
    Date of Patent: March 2, 2004
    Assignee: Alps Electric Co., Ltd.
    Inventors: Akiyuki Yoshisato, Kazuhiko Ueda, Hiroshi Sakuma, Akihiko Inoue
  • Patent number: 6606532
    Abstract: A method of manufacturing a system LSI is disclosed, in which the running cost such the power consumption is not increased even in the case where the hardware, and software are reused for reducing the manufacturing cost. The method for manufacturing a system LSI, having at least a processor and a memory in a single chip, comprises the steps of preparing a system LSI in the stage where a preset common process has been complete, determining the working area for activating an application program mounted on the system LSI based on the datapath width of the processor and the word length and the number of words of the memory used for activating the application program, and completing the manufacture of the system LSI in such a manner that no power is supplied to the area other than the working area. In this way, the hardware and software are reused without increasing the power consumption or other running costs.
    Type: Grant
    Filed: December 7, 1999
    Date of Patent: August 12, 2003
    Assignee: Semiconductor Technology Academic Research Center
    Inventors: Hiroto Yasuura, Akihiko Inoue
  • Patent number: 6603667
    Abstract: The invention provides an electronic circuit unit that is suitable for miniaturization and excellent in high frequency characteristic. Capacitors and a wiring pattern are formed on an alumina substrate by means of thin film forming technique, and a part of the wiring pattern is served as the connection land for mounting a bare chip of a transistor. Among the capacitors, the top electrode of the capacitor is served also as a part of the connection land, and the bottom side collector electrode of the bare chip is connected to the connection land by use of conductive adhesive. Top electrodes of the residual capacitors are served as the bonding pad, and the base electrode and the emitter electrode on the top side of the bare chip are connected to the top electrodes of the respective capacitors by a wire.
    Type: Grant
    Filed: May 29, 2001
    Date of Patent: August 5, 2003
    Assignee: Alps Electric Co., Ltd.
    Inventors: Akiyuki Yoshisato, Kazuhiko Ueda, Akihiko Inoue, Hiroshi Sakuma
  • Publication number: 20030132517
    Abstract: A surface acoustic wave (SAW) filter includes a SAW chip mounted in a recession of a multi-layer substrate, a sealing plate covering the recession, an end surface electrode that is provided on the outer surface of the substrate and is in conduction with the SAW chip, a metal conductor for radiating heat that is provided on the surface at the opposite side from the sealing plate of the multi-layer substrate, and a through hole provided in the substrate, one end thereof being connected to the metal conductor. The other end of the through hole is connected with the SAW chip through the intermediary of a metal constituent, such as an electrically conductive adhesive layer.
    Type: Application
    Filed: January 8, 2003
    Publication date: July 17, 2003
    Applicant: Alps Electric Co., Ltd.
    Inventors: Shigetoshi Matsuta, Shoji Kai, Hideki Kondo, Akihiko Inoue
  • Publication number: 20030125015
    Abstract: In a data-sending device, a data generation section provides input data itself or a bit-inverted version of the input data as intermediate data and generates an inversion signal that indicates whether or not the intermediate data is the bit-inverted version of the input data. An encrypting section generates scrambled data by inserting the inversion signal in the intermediate data at a bit position. A data-receiving device removes the inversion signal from the scrambled data, and restores the input data based on the inversion signal.
    Type: Application
    Filed: December 26, 2002
    Publication date: July 3, 2003
    Applicant: MASTSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
    Inventors: Akihiko Inoue, Koji Kai, Masayoshi Toujima, Takashi Hashimoto
  • Patent number: 6574102
    Abstract: To provide a docking station for a portable computer, which increases its heat radiation when the docking station is docked with the portable computer. A docking station is equipped with a fan unit at a back portion of a power supply unit within a station body, and a front surface of a connection portion with which a notebook PC is docked is provided with an air suction opening. Thereby, once the fan unit is driven, high temperature air is exhausted from a station body and the connection portion, then outside air is introduced from the suction opening to stimulate the cooling of the connection portion, and the heat which is transferred from a back side portion of the notebook PC to the connection portion is also dissipated there to stimulate the cooling of the notebook PC side.
    Type: Grant
    Filed: March 30, 2001
    Date of Patent: June 3, 2003
    Assignee: International Business Machines Corporation
    Inventors: Hideyuki Usui, Akihiko Inoue, Takashi Yanagisawa, Masayoshi Nakano
  • Patent number: 6518658
    Abstract: To provide a surface-mounting type electronic circuit unit suitable for miniaturization, circuit elements including capacitors, resistors and inductance elements and a conductive pattern connected to these circuit elements are thinly formed on an alumina substrate, semiconductor bare chips for a diode and a transistor are bonded on a connection land of the conductive pattern via wire, an inductance element composed of a pair of conductors opposite at a predetermined interval on the aluminum board is thinly formed and a unbalance/balance converter is formed by these conductors.
    Type: Grant
    Filed: May 29, 2001
    Date of Patent: February 11, 2003
    Assignee: Alps Electric Co., Ltd.
    Inventors: Akiyuki Yoshisato, Kazuhiko Ueda, Yasuhio Ikarashi, Akihiko Inoue, Hiroshi Sakuma
  • Publication number: 20020053039
    Abstract: A power management system for an integrated circuit has a signal line, a management data generating unit connected to the signal line, and a plurality of management data using units each connected to the signal line. The management data generating unit outputs, to the signal line, power management data for managing power consumption in each of the management data using units, the power management data corresponding to the state of the management data generating unit. Each of the management data using units reads the power management data for common use from the signal line and controls power consumed by the management data using unit based on the power management data.
    Type: Application
    Filed: October 23, 2001
    Publication date: May 2, 2002
    Applicant: Matsushita Electric Industrial Co., Ltd
    Inventors: Akihiko Inoue, Masao Hamada, Koji Kai
  • Publication number: 20020011596
    Abstract: The invention provides a surface mounting type electronic circuit unit that is suitable for miniaturization and is suitable for simple output adjustment. Circuit elements including capacitors, resistors, and inductance elements and a conducting pattern connected to the circuit elements are formed on an alumina substrate by means of thin film forming technique, and a diode D1 and a semiconductor chip of a transistor are fixed to a connection land of the conducting pattern by means of wire bonding, wherein only the emitter resistor out of the base bias voltage dividing resistors and the emitter resistor of the transistor is trimmed for output adjustment.
    Type: Application
    Filed: May 29, 2001
    Publication date: January 31, 2002
    Inventors: Akiyuki Yoshisato, Kazuhiko Ueda, Yasuhiro Ikarashi, Akihiko Inoue, Hiroshi Sakuma
  • Publication number: 20020011658
    Abstract: To provide a surface-mounting type electronic circuit unit suitable for miniaturization, circuit elements including capacitors, resistors and inductance elements and a conductive pattern connected to these circuit elements are thinly formed on an alumina substrate, semiconductor bare chips for a diode and a transistor are bonded on a connection land of the conductive pattern via wire, an inductance element composed of a pair of conductors opposite at a predetermined interval on the aluminum board is thinly formed and a unbalance/balance converter is formed by these conductors.
    Type: Application
    Filed: May 29, 2001
    Publication date: January 31, 2002
    Inventors: Akiyuki Yoshisato, Kazuhiko Ueda, Yasuhio Ikarashi, Akihiko Inoue, Hiroshi Sakuma
  • Publication number: 20020011996
    Abstract: An image display system includes: a host section for outputting first data which is image data and second data which is non-image data in a time-division manner; a display section for receiving the first data and the second data output from the host section in the time-division manner; and a single digital interface for transmitting the first data and the second data output from the host section to the display section in the time-division manner, wherein the host section includes: a graphics control circuit for outputting the first data; a data transmission circuit for outputting the second data; and a data output section for receiving the first data output from the graphics control circuit and the second data output from the data transmission circuit and outputting the first data and the second data in the time-division manner, and the display section includes: a data separation section for separating the first data and the second data output by the data output section in the time-division manner; a display
    Type: Application
    Filed: May 24, 2001
    Publication date: January 31, 2002
    Inventors: Akihiko Inoue, Toshihisa Nakano, Yuji Sato, Tomoyuki Ishihara
  • Publication number: 20020011985
    Abstract: A synchronization signal generation circuit includes: a synchronization signal generation section for generating a first vertical synchronization signal and a first horizontal synchronization signal based on an externally-supplied second vertical synchronization signal; and a detection section for detecting the second vertical synchronization signal, wherein when the second vertical synchronization signal is detected by the detection section for the first time, the first vertical synchronization signal is not output by the synchronization signal generation section, and when the second vertical synchronization signal is detected by the detection section for the next time at a predetermined timing, the first vertical synchronization signal is output by the synchronization signal generation section.
    Type: Application
    Filed: July 18, 2001
    Publication date: January 31, 2002
    Inventors: Toshihisa Nakano, Akihiko Inoue, Yuji Sato, Tomoyuki Ishihara
  • Publication number: 20020011352
    Abstract: The invention provides an electronic circuit unit that is suitable for miniaturization and excellent in high frequency characteristic. Capacitors and a wiring pattern are formed on an alumina substrate by means of thin film forming technique, and a part of the wiring pattern is served as the connection land for mounting a bare chip of a transistor. Among the capacitors, the top electrode of the capacitor is served also as a part of the connection land, and the bottom side collector electrode of the bare chip is connected to the connection land by use of conductive adhesive. Top electrodes of the residual capacitors are served as the bonding pad, and the base electrode and the emitter electrode on the top side of the bare chip are connected to the top electrodes of the respective capacitors by a wire.
    Type: Application
    Filed: May 29, 2001
    Publication date: January 31, 2002
    Inventors: Akiyuki Yoshisato, Kazuhiko Ueda, Akihiko Inoue, Hiroshi Sakuma
  • Publication number: 20010054754
    Abstract: To provide a surface-mounting type electronic circuit unit provided with a shield, suitable for miniaturization and easy to manufacture, a circuit element such as a resistor and a capacitor and a conductive pattern are thinly formed on a square and flat substrate made of alumina, a semiconductor bare chip such as a transistor is bonded via wire and a part of the conductive pattern is exposed at the edge of the substrate so as to form an earth pattern. An insulating passivation layer is formed in a region except the earth pattern of the substrate, the circuit element and the semiconductor bare chip are covered with the insulating passivation layer and the upper surface of the insulating passivation layer is flattened by pressing and others. A metallic shield is bonded on the upper surface of the insulating passivation layer using a conductive adhesive, and the shield and the earth pattern are electrically connected via the conductive adhesive by also applying the conductive adhesive on the earth pattern.
    Type: Application
    Filed: May 29, 2001
    Publication date: December 27, 2001
    Applicant: Alps Electric Co. Ltd.
    Inventor: Akihiko Inoue
  • Publication number: 20010056464
    Abstract: A server system of the present invention includes a server apparatus and one or more terminal apparatuses electrically connected to the server apparatus through a transmission line, in which each of the one or more terminal apparatuses include one or more input devices, the server apparatus implements an operating system and an application program, the server apparatus includes input information recognition means for recognizing an input information signal which is output from each of the one or more input devices and input to the server apparatus, and the server apparatus executes the operating system and the application program based on the input information signal.
    Type: Application
    Filed: May 22, 2001
    Publication date: December 27, 2001
    Inventors: Tomoyuki Ishihara, Akihiko Inoue, Yuji Sato, Toshihisa Nakano
  • Publication number: 20010050659
    Abstract: An image display system includes at least one display device connected to a host device. An image is displayed on the at least one display device in accordance with an image signal which is output from the host device. The at least one display device monitors a state of coupling with the host device.
    Type: Application
    Filed: June 12, 2001
    Publication date: December 13, 2001
    Inventors: Yuji Sato, Akihiko Inoue, Tomoyuki Ishihara, Toshihisa Nakano
  • Publication number: 20010048150
    Abstract: In a surface-mounting-type electronic-circuit unit, circuit elements, including capacitors, resistors, and inductive devices, and electrically conductive patterns connected to the circuit elements are formed on an alumina board as thin films. Semiconductor bare chips for a diode and a transistor are wire-bonded to connection lands in electrically conductive patterns. And end-face electrodes connected to grounding electrodes, input electrodes, and output electrodes of electrically conductive patterns are formed at side faces of the alumina board.
    Type: Application
    Filed: May 29, 2001
    Publication date: December 6, 2001
    Applicant: Alps Electric Co., Ltd.
    Inventors: Akiyuki Yoshisato, Kazuhiko Ueda, Hiroshi Sakuma, Akihiko Inoue
  • Publication number: 20010030851
    Abstract: To provide a docking station for a portable computer, which increases its heat radiation when the docking station is docked with the portable computer. A docking station is equipped with a fan unit at a back portion of a power supply unit within a station body, and a front surface of a connection portion with which a notebook PC is docked is provided with an air suction opening. Thereby, once the fan unit is driven, high temperature air is exhausted from a station body and the connection portion, then outside air is introduced from the suction opening to stimulate the cooling of the connection portion, and the heat which is transferred from a back side portion of the notebook PC to the connection portion is also dissipated there to stimulate the cooling of the notebook PC side.
    Type: Application
    Filed: March 30, 2001
    Publication date: October 18, 2001
    Applicant: International Business Machines Corporation
    Inventors: Hideyuki Usui, Akihiko Inoue, Takashi Yanagisawa, Masayoshi Nakano
  • Patent number: 5585914
    Abstract: An apparatus and method for measuring a temperature of a high temperature liquid contained in a furnace. An optical fiber covered with a metallic tube is inserted through a passageway inside a nozzle arranged on a furnace wall of the furnace. The nozzle communicates with an interior of the furnace containing the liquid, and gas is supplied into the passageway inside the nozzle to prevent the nozzle from clogging. The metal-covered optical fiber is fed through the passageway inside the nozzle into the liquid such that spectral light radiated from the liquid enters a tip of the metal-covered optical fiber and is propagated therealong. The temperature of the liquid is determined by a radiation thermometer, coupled to the metal-covered optical fiber, based on the spectral light propagated along the metal-covered optical fiber.
    Type: Grant
    Filed: October 4, 1994
    Date of Patent: December 17, 1996
    Assignee: NKK Corporation
    Inventors: Mitsuo Yamasaki, Shigeru Inoue, Ichiro Kikuchi, Masaki Komatani, Genji Kanatani, Masao Hiroko, Takafumi Yoshikawa, Masashi Edahiro, Yoshimi Komatsu, Akihiko Inoue, Hideaki Mizukami, Takeshi Murai, Hideo Nakamura, Yoshiro Yamada, Yuji Adachi, Hirofumi Nakamura, Keiichi Miyoshi, Kazusi Miyamoto, Masao Doi, Shirou Takene