Abstract: A semiconductor device manufacturing technique which allows reduction of semiconductor chip size. First, a pad and other wires are formed over an insulating film. A surface protective film is formed over the insulating film including the pad and wires, and an opening is made in the surface protective film. The opening lies over the pad and exposes a surface of the pad. A bump electrode is formed over the surface protective film including the opening. Here, the pad is smaller than the bump electrode. Consequently, the wires are arranged just beneath the bump electrode in the same layer as the pad 10. In other words, the wires are arranged in space which becomes available because the pad is small enough.

Abstract: A semiconductor device manufacturing technique which allows reduction of semiconductor chip size. First, a pad and other wires are formed over an insulating film. A surface protective film is formed over the insulating film including the pad and wires, and an opening is made in the surface protective film. The opening lies over the pad and exposes a surface of the pad. A bump electrode is formed over the surface protective film including the opening. Here, the pad is smaller than the bump electrode. Consequently, the wires are arranged just beneath the bump electrode in the same layer as the pad 10. In other words, the wires are arranged in space which becomes available because the pad is small enough.

Abstract: A semiconductor device manufacturing technique which allows reduction of semiconductor chip size. First, a pad and other wires are formed over an insulating film. A surface protective film is formed over the insulating film including the pad and wires, and an opening is made in the surface protective film. The opening lies over the pad and exposes a surface of the pad. A bump electrode is formed over the surface protective film including the opening. Here, the pad is smaller than the bump electrode. Consequently, the wires are arranged just beneath the bump electrode in the same layer as the pad 10. In other words, the wires are arranged in space which becomes available because the pad is small enough.

Abstract: There is provided a display driver device (liquid crystal driver) causing no degradation in display image quality even when a plurality of signal lines (source lines) of a display panel are divided into a plurality of groups as a countermeasure against EMI. With a liquid crystal display driver device (the liquid crystal driver) for generating image signals to be impressed to respective signal lines of a display panel upon receiving display image data, and outputting the image signals in a lump, corresponding to every one line, according to an output timing signal inputted from outside, output amplifiers, in the last stage of the liquid crystal driver, for outputting the image signals, respectively, are divided into a plurality of groups, and the output amplifiers of respective groups are caused to undergo a periodical change in output sequence while the respective image signals are slightly staggered in output timing by the group.

Abstract: A semiconductor device manufacturing technique which allows reduction of semiconductor chip size. First, a pad and other wires are formed over an insulating film. A surface protective film is formed over the insulating film including the pad and wires, and an opening is made in the surface protective film. The opening lies over the pad and exposes a surface of the pad. A bump electrode is formed over the surface protective film including the opening. Here, the pad is smaller than the bump electrode. Consequently, the wires are arranged just beneath the bump electrode in the same layer as the pad 10. In other words, the wires are arranged in space which becomes available because the pad is small enough.

Abstract: There is provided a display driver device (liquid crystal driver) causing no degradation in display image quality even when a plurality of signal lines (source lines) of a display panel are divided into a plurality of groups as a countermeasure against EMI. With a liquid crystal display driver device (the liquid crystal driver) for generating image signals to be impressed to respective signal lines of a display panel upon receiving display image data, and outputting the image signals in a lump, corresponding to every one line, according to an output timing signal inputted from outside, output amplifiers, in the last stage of the liquid crystal driver, for outputting the image signals, respectively, are divided into a plurality of groups, and the output amplifiers of respective groups are caused to undergo a periodical change in output sequence while the respective image signals are slightly staggered in output timing by the group.

Abstract: A semiconductor device manufacturing technique which allows reduction of semiconductor chip size. First, a pad and other wires are formed over an insulating film. A surface protective film is formed over the insulating film including the pad and wires, and an opening is made in the surface protective film. The opening lies over the pad and exposes a surface of the pad. A bump electrode is formed over the surface protective film including the opening. Here, the pad is smaller than the bump electrode. Consequently, the wires are arranged just beneath the bump electrode in the same layer as the pad 10. In other words, the wires are arranged in space which becomes available because the pad is small enough.

Abstract: A semiconductor device manufacturing technique which allows reduction of semiconductor chip size. First, a pad and other wires are formed over an insulating film. A surface protective film is formed over the insulating film including the pad and wires, and an opening is made in the surface protective film. The opening lies over the pad and exposes a surface of the pad. A bump electrode is formed over the surface protective film including the opening. Here, the pad is smaller than the bump electrode. Consequently, the wires are arranged just beneath the bump electrode in the same layer as the pad 10. In other words, the wires are arranged in space which becomes available because the pad is small enough.

Abstract: A semiconductor device manufacturing technique which allows reduction of semiconductor chip size. First, a pad and other wires are formed over an insulating film. A surface protective film is formed over the insulating film including the pad and wires, and an opening is made in the surface protective film. The opening lies over the pad and exposes a surface of the pad. A bump electrode is formed over the surface protective film including the opening. Here, the pad is smaller than the bump electrode. Consequently, the wires are arranged just beneath the bump electrode in the same layer as the pad 10. In other words, the wires are arranged in space which becomes available because the pad is small enough.

Abstract: A semiconductor device manufacturing technique which allows reduction of semiconductor chip size. First, a pad and other wires are formed over an insulating film. A surface protective film is formed over the insulating film including the pad and wires, and an opening is made in the surface protective film. The opening lies over the pad and exposes a surface of the pad. A bump electrode is formed over the surface protective film including the opening. Here, the pad is smaller than the bump electrode. Consequently, the wires are arranged just beneath the bump electrode in the same layer as the pad 10. In other words, the wires are arranged in space which becomes available because the pad is small enough.

Abstract: There is provided a display driver device (liquid crystal driver) causing no degradation in display image quality even when a plurality of signal lines (source lines) of a display panel are divided into a plurality of groups as a countermeasure against EMI. With a liquid crystal display driver device (the liquid crystal driver) for generating image signals to be impressed to respective signal lines of a display panel upon receiving display image data, and outputting the image signals in a lump, corresponding to every one line, according to an output timing signal inputted from outside, output amplifiers, in the last stage of the liquid crystal driver, for outputting the image signals, respectively, are divided into a plurality of groups, and the output amplifiers of respective groups are caused to undergo a periodical change in output sequence while the respective image signals are slightly staggered in output timing by the group.

Abstract: A business requirement handling apparatus is adapted to a data processing system which includes a central processing unit, a display unit and an input unit.