Abstract: A multi-display device displays a single image constituted by a plurality of projection images projected by a plurality of image projection units on a screen in which the device has a shifting unit for shifting a picture signal which is supplied to the image projecting unit toward a time-base direction in accordance with a width of an overlapped portion of images mutually adjacent in a vertical scanning direction.

Abstract: In a frame-by-frame color image pickup apparatus, images of light components transmitted through red, green, and blue filters of a rotating filter are introduced to an image pickup device arranged in an optical path with rotating filter. The cells in the image pickup device are grouped into cell blocks, each block made up of four cells arranged in one horizontal row and four vertical columns. The rotational speed of the rotating filter is increased, and the cells within each block selected by switches for reading are fixed when an image is dynamic, a quarter of all the cells are read at one cycle of revolution of the rotating filter, and the remaining cells are interpolated to form one frame image. Color breakup is thus precluded. When an image is still, the cells selected are switched at each cycle of revolution of the rotating filter, and all the cells are read over four cycles of revolution of the rotating filter. Thus, a high resolution color image is obtained.

Abstract: The present invention relates to a semiconductor device in which inner leads of a lead frame are electrically connected to a semiconductor chip, a method for producing thereof and a lead frame used therein. The object of the present invention is to improve a strength of the lead frame and a heat release efficiency in a small-size multi-pin type semiconductor device. In the inner lead of the lead frame, a thin plate portion is formed. The thin plate portions are secured on a heat spreader. A semiconductor chip is mounted on the heat spreader. The semiconductor chip is bonded to the thin plate portions of the inner leads through wires.

Abstract: A thin semiconductor device in which a strength of a lead frame and a heat dissipation efficiency can be improved. The semiconductor device has a semiconductor chip, a lead having an inner lead and an a outer lead continuing to the inner lead, said inner lead having a thin plate portion thinner than the other portion therof, said thin plate portion being electrically connected to said semiconductor chip through a wire and said outer lead serving as an outer connecting terminal, and a sealing resin sealing said semiconductor chip and at least a part of said lead, wherin said inner lead of said lead is positioned on said semiconductor chip.

Abstract: A process for producing a semiconductor device having a package with a semiconductor element molded therein, and a plurality of leads, each constituted by an inner lead located inside the package and an outer lead located outside the package, the leads being arranged in a line at a predetermined pitch, and the semiconductor element being electrically connected to the inner lead of each of the leads, wherein each side edge of each of the outer leads is flat.

Abstract: A wire-bonding method of an IC uses a capillary having a hole for guiding a bonding wire, the capillary moving vertically and horizontally with respect to the IC so as to bridge a loop between a first bonding and a subsequent second bonding of the wire on predetermined places. The method comprises the steps of heating a wire end extruding from a first opening of the hole to form a ball of the wire; performing the first bonding by a nail head bonding method; pulling the wire coming from the second opening. The tension imposed on the wire hardens a portion of the wire having been softened during the heating process, but is adequately low not break the wire; and moving the capillary so as to perform the second bonding.

Abstract: An electronic switch circuit generates an output signal which is alternatively brought either into a first condition or into a second condition dependent upon a voltage level of an input signal. The electronic switch circuit includes first and second transistors which are mutually connected to form a differential circuit. A first bias circuit applies a first bias voltage to the first transistor. A second bias circuit applies to the second transistor a second bias voltage of a constant level which is independent of the voltage level of the input signal. The second bias voltage is different from the first bias voltage, when the voltage level of the input signal is smaller than a predetermined voltage level. When the voltage level of the input signal is not smaller than the predetermined voltage level, a control circuit operates to change the bias voltage for the second transistor so as to invert the large-and-small relationship between the bias voltages of the first and second transistors.

Abstract: The present invention provides a resin tablet for plastic encapsulation molding by the transfer molding process. A tablet body is obtained by compressing powdered thermosetting resin and is covered by a covering membrane. A method of manufacturing a plastic encapsulation using such a resin tablet includes exposing the surface of tablet body by breaking the covering membrane in a pot and pressing the thermosetting resin of exposed tablet body with the plunger for encapsulated molding.

Abstract: In a plastic molded semiconductor device in which inner leads overlap a semiconductor chip in a molded plastic body, the width of the chip may be close to the width of the plastic body without a decrease in the high resistance of the inner leads to the pull out thereof from the plastic body, and the layout of the inner leads may be unrestricted since the inner leads may occupy the region above the chip.

Abstract: Lead frame for mounting a semiconductor chip and improving the packing density of devices such as a plastic chip carrier type IC is disclosed. A portion of inner leads, located parallel to the chip stage and the edge of a molded case is made as thin as possible and held by inner lead supporting bars to tie bars until the molding process is finished. After molding process is finished, these bars supporting the leads and stage are cut away. Packing density is improved an amount ranging from 20% to 30%.

Abstract: A resin-molded semiconductor package device includes a plurality of grooves which are spaced a predetermined distance from each other in the edge portions defined by the main surface and the side surfaces of the main body of a resin-molded package, which grooves correspond to a plurality of external leads. The external leads are folded, the tips of the external leads are positioned in the grooves, and the middle portions of the external leads are located above the main surface of the package so that a predetermined standoff distance is maintained between the middle portions of the external leads and the package.

Abstract: In a plastic molded semiconductor device in which inner leads overlap a semiconductor chip in a molded plastic body, the width of the chip may be close to the width of the plastic body without a decrease in the high resistance of the inner leads to the pull out thereof from the plastic body, and the layout of the inner leads may be unrestricted since the inner leads may occupy the region above the chip.