Abstract: A positive resists material for high energy-sensitive positive resists which can be developed in aqueous alkali solution, said material comprising (A) a polyhydroxystyrene resin wherein some hydroxyl groups are substituted by t-butoxycarbonyloxy groups, (B) a solution blocking agent, and (C) an onium salt, and being characterized in that said solution blocking agent contains at least one t-butoxycarbonyloxy group per molecule, said onium salt is bis(p-t-butylphenyl) iodinium trifluormethylsulfonate represented by the following formula (1): ##STR1## and the weight proportions of (A), (B), (C) are given by the relations: 0.07.ltoreq.B-.ltoreq.0.40, 0.005.ltoreq.C.ltoreq.0.15, 0.55.ltoreq.A, A+B+C=1. As the resist has low absorption at the exposure wavelength of a KrF exima laser, a fine pattern having vertical walls is easily formed.

Abstract: A silicon-containing polymer comprising repeating units of silicon-containing cyclic compound, represented by a general formula (I) ##STR1## (wherein m and n are zero or a positive integer, respectively, however m+n>0, and X is any of an alkyl group, alkoxy group, phenyl group, naphthyl group, substituted phenyl group and substituted naphthyl group or a mixture of these, and the substituent of said substituted phenyl group or substituted naphthyl group indicates any of halogen atom, halogenated alkyl group, amino group, aminoalkyl group and nitro group or a mixture of these), and a photosensitive material containing said silicon-containing polymer are disclosed.

Abstract: Present invention provides a photosensitive and high energy beam sensitive resin composition which may be used as a resist material for forming both of the positive and negative patterns. The resin composition comprises: a substituted polysiloxane having the main polysiloxane chain and a substituent hydrophilic group or groups; and a solvent for the substituted polysiloxane. The substituted polysiloxane used in preferred embodiments of the invention are produced by acylating polysiloxanes including polydiphenylsiloxane and polyphenylsilsesquioxane to introduce acyl groups, followed by oxidation of the thus introduced acyl groups to convert them into carboxyl groups or by reducing the thus introduced acyl groups to convert them into alpha-hydroxyalkyl groups. The acyl, carboxyl or alpha-hydroxyalkyl groups are further substituted to obtain substituted polysiloxanes which are soluble in an aqueous alkali.

Abstract: A silicon-containing polymer comprising repeating units of silicon-containing cyclic compound, represented by a general formula (I) ##STR1## (wehrein m and n are positive integers including 0, respectively, however m+n>0, and X is any of alkyl group, alkoxy group, phenyl group, naphthyl group, substituted phenyl group and substituted naphthyl group or a mixture of these, and the substituent of said substituted phenyl group or substituted naphthyl group indicates any of halogen atom, halogenated alkyl group, amino group, aminoalkyl group and nitro group or a mixture of these), and a photosensitive material containing said silicon-containing polymer are disclosed.

Abstract: The present invention provides a photosensitive resin composition used to form a top resist layer of a multilayer resist system, the composition comprising a photosensitive polyphenylsilsesquioxane represented by the following general formula (I) of: ##STR1## wherein X is selected from the group consisting of acryloyloxymethyl, methacryloyloxymethyl, and cinnamoyloxymethyl; and l, m and n are zero or positive integers but l and m do not take the value of zero simultaneously; and a bisazide compound added to act as a cross-linking agent.The photosensitive resin composition has high sensitivity to UV light and excellent resistance to reactive ion etching under oxygen gas (O.sub.2 RIE).

Abstract: A pattern forming material contains a siloxane polymer having the general formula: ##STR1## [wherein R, R' and R" are the same or different and are respectively one member selected from hydrogen, an alkyl group or a phenyl group; X is one member selected from fluorine, chlorine, bromine, iodine and a --CH.sub.2 Y group (wherein Y is one member selected from chlorine, fluorine, bromine, iodine, an acryloyloxy group, a methacryloyloxy group, and a cinnamoyloxy group); and l, m and n are respectively 0 or a positive integer, l and m not being simultaneously 0]. The material has a high sensitivity to high-energy radiation, a high contrast, and an excellent resistance to reactive ion etching under oxygen gas. The material is conveniently used as a negative resist for forming a submicron pattern having a high aspect ratio.

Abstract: A pattern forming material contains a siloxane polymer having the general formula: ##STR1## [wherein R, R' and R" are the same or different and are respectively one member selected from hydrogen, an alkyl group or a phenyl group; X is one member selected from fluorine, chlorine, bromine, iodine and a --CH.sub.2 Y group (wherein Y is one member selected from chlorine, fluorine, bromine, iodine, an acryloyloxy group, a methacryloyloxy group, and a cinnamoyloxy group); and l, m and n are respectively 0 or a positive integer, l and m not being simultaneously 0]. The material has a high sensitivity to high-energy radiation, a high contrast, and an excellent resistance to reactive ion etching under oxygen gas. The material is conveniently used as a negative resist for forming a submicron pattern having a high aspect ratio.

Abstract: This invention is directed to coating compositions for electrocoating electroconductive substrates for printed circuits comprising a pigment-containing finely divided synthetic resin powder in which the resin comprises an epoxy resin, and the pigment comprises pigments with 2-10 weight parts of finely divided silica, admixed with a water-dilutable cationic resin, and to methods of utilizing the composition for forming an insulating film on an electroconductive substrate.