Patents by Inventor Akira Tamura
Akira Tamura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 8911243Abstract: A connection member to be inserted into a through-hole of a socket module that is electrically connected between an electronic component and a substrate, the connection member includes: a first end portion that is connected to the electronic component; a second end portion that is connected to the substrate; a plurality of upper flexure portions that correspond to projections of a waveform arranged near the electronic component; and a plurality of lower flexure portions that correspond to projections of the waveform arranged near the substrate; wherein the connection member is a single conductor member with elasticity and is formed in the shape of the waveform.Type: GrantFiled: October 3, 2012Date of Patent: December 16, 2014Assignees: Fujitsu Component Limited, Fujitsu LimitedInventors: Junichi Akama, Toshihiro Kusagaya, Manabu Shimizu, Akira Tamura, Yoshihiro Morita, Yasushi Masuda
-
Publication number: 20140349495Abstract: A connector includes: a casing; a pair of signal terminals that have respective tip end portions, the pair of signal terminals projecting from the casing, the tip end portions being perpendicularly bent; a ground terminal arranged such that the ground terminal and the pair of signal terminals are arranged in a row, the ground terminal projecting at a position adjacent to the pair of signal terminals; and a shield disposed between the casing and the tip end portions of the pair of signal terminals.Type: ApplicationFiled: May 21, 2014Publication date: November 27, 2014Applicant: FUJITSU LIMITEDInventors: Yasushi Masuda, Akira Tamura, Satoshi Ohsawa
-
Patent number: 8870592Abstract: A socket for providing an electric connection between a package and an electronic circuit board, the socket includes a package mounting area in which the package is mounted and an isotropic elastic body provided on the package mounting area and having a continuous shape along four side walls of the package so as to press the four side walls of the package.Type: GrantFiled: September 12, 2011Date of Patent: October 28, 2014Assignee: Fujitsu LimitedInventors: Yasushi Masuda, Akira Tamura, Satoshi Osawa
-
Publication number: 20140154925Abstract: A socket includes a plurality of coupling members that each include a first end portion and a second end portion, the coupling members being made of electrically conductive material, wherein a terminal of an electronic component and a terminal of a board are electrically coupled with the first end portion and the second end portion, respectively, so to electrically connect the terminal of the electronic component and the terminal of the board, a holding member that holds the plurality of coupling members in such a manner that the plurality of coupling members are not in contact with each other, the holding member being made form an electrical insulating material, and a sheet member that is in contact with the electronic component and the board in parts between the plurality of coupling members, the sheet member being made from a material which is electrical insulating and thermal diffusive.Type: ApplicationFiled: November 25, 2013Publication date: June 5, 2014Applicant: FUJITSU LIMITEDInventors: Yasushi Masuda, Akira Tamura, Yoshihiro Morita, Satoshi Ohsawa
-
Patent number: 8741419Abstract: Disclosed is a nanocarbon material-composite substrate including a substrate, a three-dimensional structural pattern formed on the substrate, and a nanocarbon material formed on a surface of the substrate, wherein the nanocarbon material is disposed at least on side surfaces of the three-dimensional structural pattern.Type: GrantFiled: March 29, 2011Date of Patent: June 3, 2014Assignee: Toppan Printing Co., Ltd.Inventors: Hidenori Gamo, Yoshihiro Kodama, Akira Tamura
-
Patent number: 8696638Abstract: Relations between crystallinity and performance of a biodegradable resin, between weight-average molecular weight and strength thereof, and between weight-average molecular weight and performance thereof were clarified. As a result thereof, when a microneedle array was provided with microneedles containing noncrystalline polylactic acid which had a weight-average molecular weight of 40,000 to 100,000, it was possible to obtain a microneedle array which could maintain its functional performance.Type: GrantFiled: July 15, 2010Date of Patent: April 15, 2014Assignees: Hisamitsu Pharmaceutical Co., Inc., Toppan Printing Co., Ltd.Inventors: Takaaki Terahara, Seiji Tokumoto, Akira Tamura, Yumiko Yamada
-
Publication number: 20130344714Abstract: A contact device that electrically connects a first substrate and a second substrate. The contact device includes: a contact that has electrical conductivity and elasticity, the contact including a first terminal that is contactable with a first pad provided on the first substrate and a second terminal that is contactable with a second pad provided on the second substrate, the first terminal and the second terminal being biased in a direction spreading a distance therebetween; and a sheet that has flexibility and heat dissipation, and holds the contact so that the first terminal is arranged opposite to one surface of the sheet and the second terminal is arranged opposite to another surface of the sheet.Type: ApplicationFiled: June 19, 2013Publication date: December 26, 2013Applicants: FUJITSU LIMITED, FUJITSU COMPONENT LIMITEDInventors: Takahiro KONDO, Manabu SHIMIZU, Yasushi MASUDA, Satoshi OHSAWA, Yoshihiro MORITA, Akira TAMURA
-
Publication number: 20130256005Abstract: There is provided a mounting adapter to be disposed between a socket and an electronic component when the electronic component is mounted with the socket. The mounting adapter includes a base having insulating property, a first electrode provided on a first surface of the base, the first surface facing the electronic component, the first electrode being to be in contact with an electric pad of the electronic component, a second electrode provided on a second surface of the base, the second electrode facing the socket, the second electrode being to be in contact with a conductor of the socket, and a through via that penetrates through the base and electrically connects the first electrode and the second electrode.Type: ApplicationFiled: March 18, 2013Publication date: October 3, 2013Applicant: FUJITSU LIMITEDInventors: Satoshi OHSAWA, Akira TAMURA
-
Patent number: 8431830Abstract: An interposer for connecting a semiconductor and a circuit board includes an insulating material sheet, a through hole which is formed in the insulating material sheet and an elastic conductive contact which is formed from an elastic conductive sheet and provided in the through hole.Type: GrantFiled: September 17, 2010Date of Patent: April 30, 2013Assignee: Fujitsu LimitedInventor: Akira Tamura
-
Patent number: 8333597Abstract: A connector conducts electricity between external electrodes disposed above and below the connector while the connector is being compressed. An interposer includes a plurality of the connectors being inserted in corresponding mounting holes. The connector can include a main body made of an elastic dielectric, and a first contact terminal of an inelastic conductor. A first electrode section is provided on a top surface of the main body, and a second electrode section connects to the first electrode section inside the main body. A second contact terminal includes a fold electrode section provided on a bottom surface of the main body, and a contact section connects to the third electrode section and is always in contact with the second electrode section.Type: GrantFiled: January 9, 2012Date of Patent: December 18, 2012Assignee: Fujitsu LimitedInventor: Akira Tamura
-
Publication number: 20120236521Abstract: There is provided an electronic device that includes a housing including six sides at right angles to each other, a first side of the six sides including an opening, a first backplane arranged on a second side so as to oppose to the opening, a second backplane arranged on a third side adjacent to the second side, a circuit board which is inserted toward the first backplane through the opening to be coupled with both of the first backplane and the second backplane with use of a plurality of connectors, the circuit board including a specified corner, and a guide. The guide is configured to shift the circuit board toward the second backplane while the specified corner slides with contacting a portion of the guide which is arranged on a fourth side of the six sides opposed to the third side.Type: ApplicationFiled: March 13, 2012Publication date: September 20, 2012Applicant: FUJITSU LIMITEDInventor: Akira TAMURA
-
Publication number: 20120136312Abstract: Relations between crystallinity and performance of a biodegradable resin, between weight-average molecular weight and strength thereof, and between weight-average molecular weight and performance thereof were clarified. As a result thereof, when a microneedle array was provided with microneedles containing noncrystalline polylactic acid which had a weight-average molecular weight of 40,000 to 100,000, it was possible to obtain a microneedle array which could maintain its functional performance.Type: ApplicationFiled: July 15, 2010Publication date: May 31, 2012Applicants: TOPPAN PRINTING CO., LTD., HISAMITSU PHARMACEUTICAL CO., INC.Inventors: Takaaki Terahara, Seiji Tokumoto, Akira Tamura, Yumiko Yamada
-
Publication number: 20120129361Abstract: A socket for providing an electric connection between a package and an electronic circuit board, the socket includes a package mounting area in which the package is mounted and an isotropic elastic body provided on the package mounting area and having a continuous shape along four side walls of the package so as to press the four side walls of the package.Type: ApplicationFiled: September 12, 2011Publication date: May 24, 2012Applicant: FUJITSU LIMITEDInventors: Yasushi MASUDA, Akira TAMURA, Satoshi OSAWA
-
Publication number: 20120103676Abstract: A connector conducting electricity between external electrodes while the connector is being compressed, the connector including: a columnar main body made of an elastic dielectric; a first contact terminal made of an inelastic conductor including first and second electrode sections provided on a top surface and a side surface of the columnar main body and a coupling section interconnecting the first and second electrode sections; a second contact terminal made of an inelastic conductor including third and fourth electrode sections provided on a bottom surface and a side surface of the columnar main body and a coupling section interconnecting the third and fourth electrode sections, the fourth electrode section being disposed in a position in which the fourth electrode section does not contact the second electrode section; and a conductor provided outside the main body and conducting electricity between the second and fourth electrode sections.Type: ApplicationFiled: January 9, 2012Publication date: May 3, 2012Applicant: FUJITSU LIMITEDInventor: Akira TAMURA
-
Patent number: 8118600Abstract: An inserting connector includes a plurality of plug electrodes where plug connecting terminals are provided at first ends of the plug electrodes and plug terminals are provided at second ends of the plug electrodes, the plug connecting terminals being configured to be connected to a board, the plug terminals being configured to be connected to jack terminals; wherein the plug connecting terminals extend in a direction perpendicular to a surface of the board; the plug terminals extend in a movable direction where the plug terminals are attached to or detached from the jack terminals; the plug electrodes are bent at an angle ? in longitudinal directions of the plug electrodes, the angle ? being greater than 0 degrees and less than 90 degrees.Type: GrantFiled: September 17, 2010Date of Patent: February 21, 2012Assignees: Fujitsu Component Limited, Fujitsu LimitedInventors: Yasuyuki Miki, Mitsuru Kobayashi, Hiroshi Tajiri, Takahiro Kondou, Koji Ishikawa, Akira Tamura
-
Patent number: 8113852Abstract: A connector conducting electricity between external electrodes while the connector is being compressed, the connector including: a columnar main body made of an elastic dielectric; a first contact terminal made of an inelastic conductor including first and second electrode sections provided on a top surface and a side surface of the columnar main body and a coupling section interconnecting the first and second electrode sections; a second contact terminal made of an inelastic conductor including third and fourth electrode sections provided on a bottom surface and a side surface of the columnar main body and a coupling section interconnecting the third and fourth electrode sections, the fourth electrode section being disposed in a position in which the fourth electrode section does not contact the second electrode section; and a conductor provided outside the main body and conducting electricity between the second and fourth electrode sections.Type: GrantFiled: June 23, 2010Date of Patent: February 14, 2012Assignee: Fujitsu LimitedInventor: Akira Tamura
-
Patent number: 8113887Abstract: There is provided a card connector for electrically coupling a card with a motherboard. The card connector includes a housing to and from which a contact pad of the card is inserted and ejected, where the housing is mountable on the motherboard; a pair of contacts is configured to hold the card between the pair of the contacts and to be electrically coupled with the contact pads of the card inserted into the housing, and extend in a first direction, and a pair of urging members is configured in the housing to force the pair of the contacts toward the card and extend in a second direction opposite to the first direction.Type: GrantFiled: September 21, 2010Date of Patent: February 14, 2012Assignee: Fujitsu LimitedInventors: Satoshi Osawa, Akira Tamura
-
Publication number: 20110318969Abstract: A connector fixable on a board comprises a plurality of plug contacts and a plurality of receptacle contacts, wherein the plug contacts and the receptacle contacts are alternately arranged on a fit plane.Type: ApplicationFiled: March 25, 2011Publication date: December 29, 2011Applicant: FUJITSU LIMITEDInventors: Yoko MURATA, Akira TAMURA
-
Patent number: 8057241Abstract: A connector includes a movable conductive element and an elastic body. The connector electrically conducts between opposed external electrodes disposed vertically. The movable conductive element has a pair of rigid contact. And the elastic body deforms elastically to receive the load caused by the movement of the movable conductive element.Type: GrantFiled: August 20, 2010Date of Patent: November 15, 2011Assignee: Fujitsu LimitedInventor: Akira Tamura
-
Publication number: 20110183105Abstract: Disclosed is a nanocarbon material-composite substrate including a substrate, a three-dimensional structural pattern formed on the substrate, and a nanocarbon material formed on a surface of the substrate, wherein the nanocarbon material is disposed at least on side surfaces of the three-dimensional structural pattern.Type: ApplicationFiled: March 29, 2011Publication date: July 28, 2011Applicant: Toppan Printing Co., Ltd.Inventors: Hidenori Gamo, Yoshihiro Kodama, Akira Tamura