Abstract: An apparatus for cooling electronic components contained within a housing member is configured to be easily removed from the housing member. In one example embodiment, an apparatus for cooling an electronic component is coupled to a housing that contains an electronic component. The apparatus includes a heat conductive member having a first lateral edge shaped to slidably attach and retain the heat conductive member to a portion of the housing. A top surface of the housing includes a second edge shaped to slidably receive and retain the heat conductive member.

Abstract: A system and method for applying brine solution to food pieces, such as potato chips, allows application of brine solution to a continuous stream of food pieces in a brine bath, while maintaining a continuously refreshed supply of brine solution in the brine bath, but without requiring that the used brine be discharged as effluent. Food pieces are washed in a water bath and then deposited, with an amount of surface water carried on the washed slices, into a brine bath tank. The brine bath tank has a predetermined volume of brine solution at a predetermined concentration of brining substance in the solution. The food pieces are marinated in the brine bath so as to thoroughly wet the pieces and are then removed from the brine bath tank with an amount of surface solution carried on the slices. The amount of surface solution carried on the marinated slices is greater than the amount of surface water carried on the washed, pre-marinated slices.

Abstract: A multi-chip module (MCM) having a substrate including a first surface, a second surface and a multi-layer interconnection arrangement disposed between the two surfaces. A high-density thin-film circuit region is provided on the substrate first surface to interconnect a plurality of integrated circuit chips and the multi-layer interconnection arrangement. The integrated circuit chips are powered through the high-density thin-film circuit region, which receives power from the multi-layer interconnection arrangement. A plurality of discrete on-board voltage converter devices, mounted on at least one substrate surface, provide uniform power supply distribution to multi-layer interconnection arrangement power planes, converting an MCM input voltage and current to a relatively lower output voltage and a relatively higher output current.

Abstract: A support cushion for children's furniture defines a seat cushion area and a back cushion area and has a seating surface that extends over those areas and is contoured to provide positional support and comfort for a child seated on the cushion. The cushion preferably is a one-piece closed cell foam moulding which is flexible to permit variation in the relative angular orientation between the seat cushion and the back cushion area. The seat includes a raised transverse barrier that is spaced forwardly of the rear of the seat for controlling rotation of the pelvis of a child. The cushion further includes a pair of side support pads that extend forwardly from respectively opposite sides of the back to locate against the trunk of a child and cushion against side-to-side movement.

Abstract: A cooling arrangement facilitates the cooling of a plurality of integrated circuit elements disposed on a plurality of substrates that are substantially perpendicularly mounted on a main substrate. In an example embodiment, the cooling arrangement provides cooling for a plurality of integrated circuit elements disposed on a plurality of substrates that are substantially perpendicularly mounted on a main substrate. The cooling arrangement includes a plurality of U-shaped thermally conductive members, each having a set of leg portions connected with a top portion and an open end disposed over a respective one of the substrates. In addition, a first inner surface of at least one of the leg portions is in thermal contact with at least one of the integrated circuit elements. The cooling arrangement further includes a housing member containing therein the U-shaped members and includes a cooling plate arrangement in thermal contact with the housing and the top portions of the U-shaped members.

Abstract: A multi-chip module (MCM) having a substrate including a first surface, a second surface and a multi-layer interconnection arrangement disposed between the two surfaces. A high-density thin-film circuit region is provided on the substrate first surface to interconnect a plurality of integrated circuit chips and the multi-layer interconnection arrangement. The integrated circuit chips are powered through the high-density thin-film circuit region, which receives power from the multi-layer interconnection arrangement. A plurality of discrete on-board voltage converter devices, mounted on at least one substrate surface, provide uniform power supply distribution to multi-layer interconnection arrangement power planes, converting an MCM input voltage and current to a relatively lower output voltage and a relatively higher output current.

Abstract: An apparatus for cooling electronic components contained within a housing member is configured to be easily removed from the housing member. In one example embodiment, an apparatus for cooling an electronic component is coupled to a housing that contains an electronic component. The apparatus includes a heat conductive member having a first lateral edge shaped to slidably attach and retain the heat conductive member to a portion of the housing. A top surface of the housing includes a second edge shaped to slidably receive and retain the heat conductive member.

Abstract: A cooling arrangement facilitates the cooling of a plurality of integrated circuit elements disposed on a plurality of substrates that are substantially perpendicularly mounted on a main substrate. In an example embodiment, the cooling arrangement provides cooling for a plurality of integrated circuit elements disposed on a plurality of substrates that are substantially perpendicularly mounted on a main substrate. The cooling arrangement includes a plurality of U-shaped thermally conductive members, each having a set of leg portions connected with a top portion and an open end disposed over a respective one of the substrates. In addition, a first inner surface of at least one of the leg portions is in thermal contact with at least one of the integrated circuit elements. The cooling arrangement further includes a housing member containing therein the U-shaped members and includes a cooling plate arrangement in thermal contact with the housing and the top portions of the U-shaped members.

Abstract: A method of meniscal repair promotes the healing of avascular meniscal tears undergoing repair. At least one vascular channel is formed from the white zone to the periphery of the meniscus by removing a cylinder of the meniscus. The approximately 1.5-2 mm channel remains open to allow vascularity to the avascular meniscus.

Abstract: A seating system, for example a paediatric seating system for wheelchairs, provides appropriate support for a person using the chair by providing adjustable components to support specific anatomical areas of the back, pelvis and upper leg and, more specifically, three components that stabilize the pelvis of that person. These components comprise an elevation change in the seat, a pad at the back that provides resistance to the posterior superior iliac spine (PSIS) and a pair of anterior pelvic pads that stabilize below the anterior superior iliac spine (ASIS).

Abstract: A bone plug removal and emplacement tool includes a cylindrical cutting element having a proximal cutting edge and a cutting tooth. The outer surface of the cutting element can include an integral shoulder (e.g., in lieu of a replaceable outer sheath) that is spaced-apart from the proximal cutting edge and that engages the surface of the bone to define a depth stop for the cutting edge. An additional cylindrical element can be disposed within the cutting element. The proximal end of that additional element, which is referred to as a "harvester," is substantially aligned with the proximal end of the cutting element to receive a plug cut from the bone. The harvester can be slidably withdrawn from the cutting element to facilitate transplating the bone plug at another location. For this purpose, a stem or plunger can be slidably inserted and moved in the harvester to dislodge the plug.

Abstract: A bone plug removal tool is described. The tool includes a cylindrical cutting element having an external surface and having an internal surface defining an internal bore extending along a longitudinal axis of the cutting element from a proximal end to a distal end. A cutting tooth is located at the proximal end of the cutting element and extends into the internal bore. A replaceable outer cylindrical sheath is arranged concentrically around the external surface of the cylindrical cutting element.A bone plug emplacement tool to be used in conjunction the removal tool is also disclosed. The emplacement tool includes a cylindrical element having an internal surface defining an internal bore extending along a longitudinal axis of the element from a proximal end. The internal surface further defines an internal step adjacent a distal end of the element. A stem is disposed for co-axial movement within the element, the stem having a proximal end disposed within the internal bore.

Abstract: A computer interconnection backplane bus. The interconnection backplane bus is formed by bus transmission lines and component connection transmission line sections that interconnect components of the computer. The characteristic impedance of the bus transmission lines is stepped so that the number of impedance mismatches on the interconnection bus is minimized. The components of the computer are connected to the bus at the interconnections nodes of the bus transmission lines through terminated component connection transmission line sections. The impedance mismatches that exist on the interconnection backplane bus are strategically placed so that the distortion to a transitioning voltage level edge is in the form of overshoot rather than under shoot or ringing.