Patents by Inventor Aleksandr Semenuk
Aleksandr Semenuk has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11808803Abstract: A thermal chamber multiple sides that form an enclosed chamber. The thermal chamber includes a first side of the multiple sides, the first side configured to adjustably mount an electronic circuit board within the enclosed chamber. The thermal chamber includes a second side of the multiple sides, the second side located opposite the first side and including one or more ports that expose the enclosed chamber. Each of the one or more ports is configured to receive a temperature control component that transfers thermal energy locally to and from a plurality of electronic devices of an electronic system that is coupled to and positioned above the electronic circuit board.Type: GrantFiled: October 28, 2022Date of Patent: November 7, 2023Assignee: Micron Technology, Inc.Inventors: Daniel G. Scobee, Aleksandr Semenuk, Aswin Thiruvengadam
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Patent number: 11658175Abstract: A thermal chamber includes a cavity that is enclosed by sides and one or more ports that expose the cavity within the thermal chamber. Each of the one or more ports is configured to receive a temperature control component having a solid physical structure and configured to transfer thermal energy to and from an electrical device exposed via the cavity. The thermal chamber includes a bottom side open area of the thermal chamber located below the one or more ports. The bottom side open area is configured to allow the temperature control component to contact the electrical device that is exposed via the bottom side open area.Type: GrantFiled: August 27, 2021Date of Patent: May 23, 2023Assignee: Micron Technology, Inc.Inventors: Daniel G. Scobee, Aleksandr Semenuk, Aswin Thiruvengadam
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Publication number: 20230046331Abstract: A thermal chamber multiple sides that form an enclosed chamber. The thermal chamber includes a first side of the multiple sides, the first side configured to adjustably mount an electronic circuit board within the enclosed chamber. The thermal chamber includes a second side of the multiple sides, the second side located opposite the first side and including one or more ports that expose the enclosed chamber. Each of the one or more ports is configured to receive a temperature control component that transfers thermal energy locally to and from a plurality of electronic devices of an electronic system that is coupled to and positioned above the electronic circuit board.Type: ApplicationFiled: October 28, 2022Publication date: February 16, 2023Inventors: Daniel G. SCOBEE, Aleksandr SEMENUK, Aswin THIRUVENGADAM
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Patent number: 11493550Abstract: A thermal chamber includes multiple sides, such as a back side, a front side, a first end, a second end, a top side, and a bottom side. An electronic circuit board is adjustably mounted to the bottom side and positioned above the bottom side of the thermal chamber. In the closed position the multiple sides form an enclosed chamber. The top side includes one or more ports orientated along the horizontal axis. Each of the one or more ports includes a top side open area that exposes the enclosed chamber. Each of the one or more ports is configured to receive a temperature control component that transfers thermal energy locally to and from multiple electronic devices of an electronic system that is coupled to and positioned above the electronic circuit board.Type: GrantFiled: December 11, 2019Date of Patent: November 8, 2022Assignee: MICRON TECHNOLOGY, INC.Inventors: Daniel G. Scobee, Aleksandr Semenuk, Aswin Thiruvengadam
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Publication number: 20220244765Abstract: An apparatus includes a first thermoelectric component (TEC), a second TEC, a thermal transfer component disposed between the first TEC and the second TEC and a thermal conduction layer. The thermal conduction layer is coupled to the second TEC. The thermal conduction layer includes a planar area configured to be positioned above two or more electronic devices of multiple electronic devices of an electronic system to transfer thermal energy at the two or more electronic devices based on the first TEC, the second TEC and the thermal transfer component.Type: ApplicationFiled: April 20, 2022Publication date: August 4, 2022Inventors: Daniel G. SCOBEE, Aleksandr SEMENUK, Aswin THIRUVENGADAM
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Patent number: 11334129Abstract: A temperature control component includes a TEC that includes a top surface and a bottom surface. A thermal conduction layer includes a top surface and a bottom surface. The top surface of the thermal conduction layer is coupled to the bottom surface of the TEC. The bottom surface of the thermal conduction layer includes a planar area. The planar area of the thermal conduction layer is to be positioned above two or more electronic devices of multiple electronic devices of an electronic system to transfer the thermal energy at the two or more electronic devices.Type: GrantFiled: December 11, 2019Date of Patent: May 17, 2022Assignee: Micron Technology, Inc.Inventors: Daniel G. Scobee, Aleksandr Semenuk, Aswin Thiruvengadam
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Publication number: 20210391319Abstract: A thermal chamber includes a cavity that is enclosed by sides and one or more ports that expose the cavity within the thermal chamber. Each of the one or more ports is configured to receive a temperature control component having a solid physical structure and configured to transfer thermal energy to and from an electrical device exposed via the cavity. The thermal chamber includes a bottom side open area of the thermal chamber located below the one or more ports. The bottom side open area is configured to allow the temperature control component to contact the electrical device that is exposed via the bottom side open area.Type: ApplicationFiled: August 27, 2021Publication date: December 16, 2021Inventors: Daniel G. Scobee, Aleksandr Semenuk, Aswin Thiruvengadam
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Patent number: 11121125Abstract: A thermal chamber includes multiple sides, such as a back side, a front side, a first end, a second end, a top side, and a bottom side. The multiple sides form a cavity. The top side includes one or more ports. Each of the one or more ports includes a top side open area that exposes the cavity within the thermal chamber. Each of the one or more ports is configured to receive a temperature control component that transfers thermal energy to and from an electrical device exposed via the cavity. The top side open area of the one or more ports has a corresponding bottom side open area of the bottom side located below the top side open area. The bottom side open area is configured to allow the temperature control component to contact the electrical device that is exposed via the bottom side open area.Type: GrantFiled: December 12, 2018Date of Patent: September 14, 2021Assignee: Micron Technology, Inc.Inventors: Daniel G. Scobee, Aleksandr Semenuk, Aswin Thiruvengadam
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Publication number: 20210181249Abstract: A thermal chamber includes multiple sides, such as a back side, a front side, a first end, a second end, a top side, and a bottom side. An electronic circuit board is adjustably mounted to the bottom side and positioned above the bottom side of the thermal chamber. In the closed position the multiple sides form an enclosed chamber. The top side includes one or more ports orientated along the horizontal axis. Each of the one or more ports includes a top side open area that exposes the enclosed chamber. Each of the one or more ports is configured to receive a temperature control component that transfers thermal energy locally to and from multiple electronic devices of an electronic system that is coupled to and positioned above the electronic circuit board.Type: ApplicationFiled: December 11, 2019Publication date: June 17, 2021Inventors: Daniel G. SCOBEE, Aleksandr SEMENUK, Aswin THIRUVENGADAM
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Publication number: 20210181819Abstract: A temperature control component includes a TEC that includes a top surface and a bottom surface. A thermal conduction layer includes a top surface and a bottom surface. The top surface of the thermal conduction layer is coupled to the bottom surface of the TEC. The bottom surface of the thermal conduction layer includes a planar area. The planar area of the thermal conduction layer is to be positioned above two or more electronic devices of multiple electronic devices of an electronic system to transfer the thermal energy at the two or more electronic devices.Type: ApplicationFiled: December 11, 2019Publication date: June 17, 2021Inventors: Daniel G. SCOBEE, Aleksandr SEMENUK, Aswin THIRUVENGADAM
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Publication number: 20200194420Abstract: A thermal chamber includes multiple sides, such as a back side, a front side, a first end, a second end, a top side, and a bottom side. The multiple sides form a cavity. The top side includes one or more ports. Each of the one or more ports includes a top side open area that exposes the cavity within the thermal chamber. Each of the one or more ports is configured to receive a temperature control component that transfers thermal energy to and from an electrical device exposed via the cavity. The top side open area of the one or more ports has a corresponding bottom side open area of the bottom side located below the top side open area. The bottom side open area is configured to allow the temperature control component to contact the electrical device that is exposed via the bottom side open area.Type: ApplicationFiled: December 12, 2018Publication date: June 18, 2020Inventors: Daniel G. Scobee, Aleksandr Semenuk, Aswin Thiruvengadam
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Publication number: 20200194650Abstract: A first thermoelectric component (TEC) includes a top surface and a bottom surface. The first TEC is configured to concurrently increase temperature of the top surface and decrease temperature of the bottom surface or vice versa to transfer thermal energy between the top surface and the bottom surface based on a voltage potential applied to the first TEC. A thermal transfer component includes a top surface and a bottom surface. The bottom surface of the thermal transfer component is coupled to the top surface of the first TEC. The thermal transfer component is tapered such that the bottom surface is smaller than the top surface. A second TEC includes a top surface and a bottom surface. The bottom surface of the second TEC is coupled to the top surface of the thermal transfer component. The second TEC is larger than the first TEC.Type: ApplicationFiled: December 12, 2018Publication date: June 18, 2020Inventors: Daniel G. Scobee, Aleksandr Semenuk, Aswin Thiruvengadam
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Patent number: D893484Type: GrantFiled: December 12, 2018Date of Patent: August 18, 2020Assignee: MICRON TECHNOLOGY, INC.Inventors: Daniel G. Scobee, Aleksandr Semenuk, Aswin Thiruvengadam
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Patent number: D954712Type: GrantFiled: August 12, 2020Date of Patent: June 14, 2022Assignee: Micron Technology, Inc.Inventors: Daniel G. Scobee, Aleksandr Semenuk, Aswin Thiruvengadam
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Patent number: D995530Type: GrantFiled: May 13, 2022Date of Patent: August 15, 2023Assignee: Micron Technology, Inc.Inventors: Daniel G. Scobee, Aleksandr Semenuk, Aswin Thiruvengadam