Thermal control component
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Description
The broken lines in the figures show portions of the thermal control component that form no part of the claimed design.
Claims
The ornamental design for a thermal control component, as shown and described.
Referenced Cited
U.S. Patent Documents
Foreign Patent Documents
4796155 | January 3, 1989 | Saito et al. |
5390077 | February 14, 1995 | Paterson |
6064572 | May 16, 2000 | Remsburg |
6820684 | November 23, 2004 | Chu et al. |
8039726 | October 18, 2011 | Zhang et al. |
11223060 | January 11, 2022 | Inoue |
20010052234 | December 20, 2001 | Venkatasubramanian |
20020124573 | September 12, 2002 | Evans et al. |
20050045702 | March 3, 2005 | Freeman et al. |
20080178920 | July 31, 2008 | Ullo |
20090009204 | January 8, 2009 | Lee et al. |
20100053868 | March 4, 2010 | Yang et al. |
20110062312 | March 17, 2011 | Hosking et al. |
20120132242 | May 31, 2012 | Chu et al. |
20120192574 | August 2, 2012 | Ghoshal et al. |
20130003765 | January 3, 2013 | Connolly et al. |
20130027068 | January 31, 2013 | Li et al. |
20130133338 | May 30, 2013 | Ludwig |
20130133339 | May 30, 2013 | Kim |
20130285686 | October 31, 2013 | Malik et al. |
20140103947 | April 17, 2014 | Phan et al. |
20140240913 | August 28, 2014 | Vyshetsky |
20150372448 | December 24, 2015 | Connolly et al. |
20170023281 | January 26, 2017 | Fromm et al. |
20200194650 | June 18, 2020 | Scobee et al. |
1959262 | August 2008 | EP |
20000059576 | October 2000 | KR |
20090024413 | March 2009 | KR |
20120121676 | November 2012 | KR |
0063968 | October 2000 | WO |
2015001523 | January 2015 | WO |
Patent History
Patent number: D995530
Type: Grant
Filed: May 13, 2022
Date of Patent: Aug 15, 2023
Assignee: Micron Technology, Inc. (Boise, ID)
Inventors: Daniel G. Scobee (Ione, CA), Aleksandr Semenuk (Orangevale, CA), Aswin Thiruvengadam (Folsom, CA)
Primary Examiner: Antoine Duval Davis
Application Number: 29/838,660
Type: Grant
Filed: May 13, 2022
Date of Patent: Aug 15, 2023
Assignee: Micron Technology, Inc. (Boise, ID)
Inventors: Daniel G. Scobee (Ione, CA), Aleksandr Semenuk (Orangevale, CA), Aswin Thiruvengadam (Folsom, CA)
Primary Examiner: Antoine Duval Davis
Application Number: 29/838,660
Classifications
Current U.S. Class:
Element Or Attachment (D14/432)