Abstract: An apparatus and a method for baking and cooling silicon substrates are disclosed. Both baking and cooling of silicon substrates are done in a single integrated thermal process module. Each thermal process module includes two hot plate assemblies, a cool plate assembly, two local linear transfer arms and a micro-processor based module controller. Both transfer arms are capable of transferring substrates among the cool and hot plate assemblies. The module controller ensures that there are no conflicts in use of the transfer arms or in use of the hot and cool plate assemblies and so that a transfer arm is always available when a substrate is finished baking. A central substrate handling robot transports substrates only from and to the cool plate assembly of the thermal process module. Also, the vacuum tubing is routed via a unique pulley arrangement to achieve compact mounting and eliminate loose tubing.

Abstract: A substrate photolithography system includes a substrate handling robot which pivots about a fixed point and transfers substrates between photoresist coater, a developer, and a heating/cooling unit, all of which are clustered about the robot. The end effector of the robot is capable of both vertical and lateral movement so that individual modules of the heating/cooling unit may be stacked. An apparatus and a method for baking and cooling silicon substrates are disclosed. Both baking and cooling of silicon substrates are done in a single integrated thermal process module. Each thermal process module includes two hot plate assemblies, a cool plate assembly, two local linear transfer arms and a micro-processor based module controller. Both transfer arms are capable of transferring substrates among the cool and hot plate assemblies. A cassette input/output unit handles cassettes which contain semiconductor wafers or other substrates that are to be delivered to or withdrawn from a semiconductor processing system.

Abstract: In a photolithography system, baking and cooling of semiconductor substrates is done in a thermal process module that uses a unique mechanism including pulleys to route vacuum tubing to a transfer arm. Specifically, the mechanism includes a pair of pulleys and a vacuum tube wrapped around the pulleys. The vacuum tube has a movable portion connected to the transfer arm which is reciprocable between the pair of pulleys. The vacuum tube also has a stationary portion that is connected to the movable portion to form an endless loop. The stationary portion of the vacuum tube is rigidly connected to a vacuum supply line in the housing of the thermal process module.

Abstract: The invention relates to a mixture-compressing internal-combustion engine with secondary-air injection and with air-mass measurement as well as with an injection valve sequential fuel injection and air assistance, the air line provided for air assistance being equipped with a shut-off valve opening in the starting and the warmup phase of the internal-combustion engine.

Abstract: A light for lighting the bowl of a toilet includes a horseshoe shaped web to lie on top of the rim of the toilet. Flanges extend from the web outside of the bowl to hold the web in position. Flanges extend inside the bowl and carry lights. The flanges shield the lights for protection of the lights, and to provide indirect lighting for the bowl. A housing at the rear of the toilet carries a switch for engagement by the lid of the toilet, so the light is turned on when the lid is up. The housing also receives batteries for powering the lights.

Abstract: An improved method of constructing a semiconductor device of the encapsulated type wherein a stack of members including a semiconductor element is encapsulated along with spring means ensuring compressive contact to the element contact areas. Hitherto up to five spring washers were needed to keep total spring deflection to within a value giving a desired compressive force, due to accumulated thickness tolerances of the stack members. In the present invention, a plastically deformable member is included in the stack initially along with a thickness gauge member such that bringing together the encapsulation housing parts round the stack flattens a single included spring washer and deforms the deformable member by a certain extent. This certain extent is such that when the stack is re-assembled without the thickness gauge, the plastically deformable member is now of a thickness to cause the spring to deform by an amount giving a desired compression force in the finished stack.