Patents by Inventor Alexander N Lerner
Alexander N Lerner has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20150170955Abstract: Methods of and apparatuses for dicing semiconductor wafers, each wafer having a plurality of integrated circuits, are described. In an example, a shadow ring assembly for a plasma processing chamber includes a shadow ring having an annular body and an inner opening. The shadow ring assembly further includes a cooling channel disposed in the annular body for cooling fluid transport. The cooling channel is coupled to a pair of supply/return openings at a surface of the annular body.Type: ApplicationFiled: December 17, 2013Publication date: June 18, 2015Applicant: Applied Materials, Inc.Inventors: Alan Hiroshi Ouye, Alexander N. Lerner
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Publication number: 20150050118Abstract: Methods and apparatus for rapid thermal processing of a planar substrate including axially aligning the substrate with a substrate support or with an empirically determined position are described. The methods and apparatus include a sensor system that determines the relative orientations of the substrate and the substrate support.Type: ApplicationFiled: October 31, 2014Publication date: February 19, 2015Inventors: Khurshed Sorabji, Joseph M. Ranish, Wolfgang Aderhold, Aaron M. Hunter, Blake R. Koelmel, Alexander N. Lerner, Nir Merry
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Patent number: 8900889Abstract: Methods and apparatus for rapid thermal processing of a planar substrate including axially aligning the substrate with a substrate support or with an empirically determined position are described. The methods and apparatus include a sensor system that determines the relative orientations of the substrate and the substrate support.Type: GrantFiled: October 19, 2012Date of Patent: December 2, 2014Assignee: Applied Materials, Inc.Inventors: Khurshed Sorabji, Joseph M. Ranish, Wolfgang Aderhold, Aaron M. Hunter, Blake R. Koelmel, Alexander N. Lerner, Nir Merry
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Patent number: 8888916Abstract: Embodiments of the present invention provide apparatus and method for improving gas distribution during thermal processing. One embodiment of the present invention provides an apparatus for processing a substrate comprising a chamber body defining a processing volume, a substrate support disposed in the processing volume, wherein the substrate support is configured to support and rotate the substrate, a gas inlet assembly coupled to an inlet of the chamber body and configured to provide a first gas flow to the processing volume, and an exhaust assembly coupled to an outlet of the chamber body, wherein the gas inlet assembly and the exhaust assembly are disposed on opposite sides of the chamber body, and the exhaust assembly defines an exhaust volume configured to extend the processing volume.Type: GrantFiled: November 22, 2013Date of Patent: November 18, 2014Assignee: Applied Materials, Inc.Inventors: Ming-Kuei (Michael) Tseng, Norman L. Tam, Yoshitaka Yokota, Agus S. Tjandra, Robert Navasca, Mehran Behdjat, Sundar Ramamurthy, Kedarnath Sangam, Alexander N. Lerner
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Publication number: 20140199786Abstract: In one embodiment, a substrate processing apparatus includes a chamber having an interior volume with an upper portion and a lower portion, a cooling source disposed in the upper portion of the interior volume, a heating source opposing the cooling source, a magnetically movable substrate support that moves between the upper portion and the lower the portion, and a plurality of sensors coupled to the chamber to detect the position of the substrate support relative to the heating source and the cooling sourceType: ApplicationFiled: February 25, 2014Publication date: July 17, 2014Applicant: APPLIED MATERIALS, INC.Inventors: Khurshed SORABJI, Alexander N. LERNER
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Patent number: 8698048Abstract: A vacuum chuck and a process chamber equipped with the same are provided. The vacuum chuck assembly comprises a support body, a plurality of protrusions, a plurality of channels, at least one support member supporting the support body, at least one resilient member coupled with the support member, a hollow shaft supporting the support body, at least one electrical connector disposed through the hollow shaft, and an air-cooling apparatus. The support body has a support surface for holding a substrate (such as a wafer) thereon. The protrusions are formed on and project from the support surface for creating a gap between the substrate and the support surface. The channels are formed on the support surface for generating reduced pressure in the gap. The air-cooling apparatus is used for providing air cooling in the vicinity of the electrical connector.Type: GrantFiled: April 26, 2012Date of Patent: April 15, 2014Assignee: Applied Materials, Inc.Inventors: Alexander N. Lerner, Blake Koelmel, Mehran Behdjat
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Publication number: 20140079376Abstract: Embodiments of the present invention provide apparatus and method for improving gas distribution during thermal processing. One embodiment of the present invention provides an apparatus for processing a substrate comprising a chamber body defining a processing volume, a substrate support disposed in the processing volume, wherein the substrate support is configured to support and rotate the substrate, a gas inlet assembly coupled to an inlet of the chamber body and configured to provide a first gas flow to the processing volume, and an exhaust assembly coupled to an outlet of the chamber body, wherein the gas inlet assembly and the exhaust assembly are disposed on opposite sides of the chamber body, and the exhaust assembly defines an exhaust volume configured to extend the processing volume.Type: ApplicationFiled: November 22, 2013Publication date: March 20, 2014Applicant: APPLIED MATERIALS, INC.Inventors: Ming-Kuei (Michael) TSENG, Norman L. TAM, Yoshitaka YOKOTA, Agus S. TJANDRA, Robert NAVASCA, Mehran BEHDJAT, Sundar RAMAMURTHY, Kedarnath SANGAM, Alexander N. LERNER
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Patent number: 8658947Abstract: A method and apparatus for thermally processing a substrate is provided. In one embodiment, a method for thermally treating a substrate is provided. The method includes transferring a substrate at a first temperature to a substrate support in a chamber, the chamber having a heating source and a cooling source disposed in opposing portions of the chamber, heating the substrate to a second temperature during a first time period while the substrate is disposed on the substrate support, heating the substrate to a third temperature during a second time period while the substrate is disposed on the substrate support, and cooling the substrate in the chamber to a fourth temperature that is substantially equal to the second temperature during the second time period.Type: GrantFiled: June 29, 2012Date of Patent: February 25, 2014Assignee: Applied Materials, Inc.Inventors: Khurshed Sorabji, Alexander N. Lerner
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Patent number: 8608853Abstract: Embodiments of the present invention provide apparatus and method for improving gas distribution during thermal processing. One embodiment of the present invention provides an apparatus for processing a substrate comprising a chamber body defining a processing volume, a substrate support disposed in the processing volume, wherein the substrate support is configured to support and rotate the substrate, a gas inlet assembly coupled to an inlet of the chamber body and configured to provide a first gas flow to the processing volume, and an exhaust assembly coupled to an outlet of the chamber body, wherein the gas inlet assembly and the exhaust assembly are disposed on opposite sides of the chamber body, and the exhaust assembly defines an exhaust volume configured to extend the processing volume.Type: GrantFiled: November 15, 2011Date of Patent: December 17, 2013Assignee: Applied Materials, Inc.Inventors: Ming-Kuei (Michael) Tseng, Norman Tam, Yoshitaka Yokota, Agus Tjandra, Robert Navasca, Mehran Behdjat, Sundar Ramamurthy, Kedarnath Sangam, Alexander N. Lerner
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Patent number: 8490660Abstract: An apparatus and method for supporting, positioning and rotating a substrate are provided. In one embodiment, a support assembly for supporting a substrate includes an upper base plate and a lower base plate. The substrate is floated on a thin layer of air over the upper base plate. A positioning assembly includes a plurality of air bearing edge rollers or air flow pockets used to position the substrate in a desired orientation inside above the upper base plate. A plurality of slanted apertures or air flow pockets are configured in the upper base plate for flowing gas therethrough to rotate the substrate to ensure uniform heating during processing.Type: GrantFiled: November 11, 2011Date of Patent: July 23, 2013Assignee: Applied Materials, Inc.Inventors: Blake Koelmel, Alexander N. Lerner, Joseph M. Ranish, Kedarnath Sangam, Khurshed Sorabji
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Publication number: 20130043235Abstract: Methods and apparatus for rapid thermal processing of a planar substrate including axially aligning the substrate with a substrate support or with an empirically determined position are described. The methods and apparatus include a sensor system that determines the relative orientations of the substrate and the substrate support.Type: ApplicationFiled: October 19, 2012Publication date: February 21, 2013Inventors: Khurshed Sorabji, Joseph M. Ranish, Wolfgang Aderhold, Aaron M. Hunter, Blake R. Koelmel, Alexander N. Lerner, Nir Merry
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Patent number: 8314371Abstract: Methods and apparatus for rapid thermal processing of a planar substrate including axially aligning the substrate with a substrate support or with an empirically determined position are described. The methods and apparatus include a sensor system that determines the relative orientations of the substrate and the substrate support.Type: GrantFiled: November 4, 2009Date of Patent: November 20, 2012Assignee: Applied Materials, Inc.Inventors: Khurshed Sorabji, Joseph M. Ranish, Wolfgang Aderhold, Aaron M. Hunter, Blake R. Koelmel, Alexander N. Lerner, Nir Merry
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Patent number: 8309475Abstract: Embodiments of the invention contemplate a method, apparatus and system that are used to support and position a substrate on a surface that is at a different temperature than the initial, or incoming, substrate temperature. Embodiments of the invention may also include a method of controlling the transfer of heat between a substrate and substrate support positioned in a processing chamber. The apparatus and methods described herein generally may also provide an inexpensive and simple way of accurately positioning a substrate on a substrate support that is positioned in a semiconductor processing chamber. Substrate processing chambers that can benefit from the various embodiments described herein include, but are not limited to RTP, CVD, PVD, ALD, plasma etching, and/or laser annealing chambers.Type: GrantFiled: January 4, 2012Date of Patent: November 13, 2012Assignee: Applied Materials, Inc.Inventors: Blake Koelmel, Abhilash J. Mayur, Kai Ma, Alexander N. Lerner
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Publication number: 20120270166Abstract: A method and apparatus for thermally processing a substrate is provided. In one embodiment, a method for thermally treating a substrate is provided. The method includes transferring a substrate at a first temperature to a substrate support in a chamber, the chamber having a heating source and a cooling source disposed in opposing portions of the chamber, heating the substrate to a second temperature during a first time period while the substrate is disposed on the substrate support, heating the substrate to a third temperature during a second time period while the substrate is disposed on the substrate support, and cooling the substrate in the chamber to a fourth temperature that is substantially equal to the second temperature during the second time period.Type: ApplicationFiled: June 29, 2012Publication date: October 25, 2012Applicant: Applied Materials, Inc.Inventors: KHURSHED SORABJI, Alexander N. Lerner
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Patent number: 8256754Abstract: A lift pin is provided for manipulating a substrate above a support surface of a substrate support and uniformly transferring heat from the substrate support to the substrate. The lift pin includes a pin shaft. The pin shaft includes a cross-section having at least three equal edges and round corners configured alternatively. A pin head is an end portion of the pin shaft, wherein the pin head has a convex support surface larger than the cross-section of the pin shaft. A flat portion is disposed on a central area of the convex support surface for directly contacting the substrate.Type: GrantFiled: December 12, 2007Date of Patent: September 4, 2012Assignee: Applied Materials, Inc.Inventors: Alexander N. Lerner, Mehran Behdjat, Paula Valdivia
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Publication number: 20120205878Abstract: A vacuum chuck and a process chamber equipped with the same are provided. The vacuum chuck assembly comprises a support body, a plurality of protrusions, a plurality of channels, at least one support member supporting the support body, at least one resilient member coupled with the support member, a hollow shaft supporting the support body, at least one electrical connector disposed through the hollow shaft, and an air-cooling apparatus. The support body has a support surface for holding a substrate (such as a wafer) thereon. The protrusions are formed on and project from the support surface for creating a gap between the substrate and the support surface. The channels are formed on the support surface for generating reduced pressure in the gap. The air-cooling apparatus is used for providing air cooling in the vicinity of the electrical connector.Type: ApplicationFiled: April 26, 2012Publication date: August 16, 2012Inventors: Alexander N. Lerner, Blake Koelmel, Mehran Behdjat
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Patent number: 8227729Abstract: A method and apparatus for thermally processing a substrate is provided. In one embodiment, a method for thermally treating a substrate is provided. The method includes transferring a substrate to a chamber at a first temperature, the chamber having a heating source and a cooling source disposed in opposing portions of the chamber, heating the substrate in the chamber during a first time period to a second temperature, heating the substrate in the chamber to a third temperature during a second time period, and cooling the substrate in the chamber to a fourth temperature that is substantially equal to the second temperature during the second time period, wherein the second time period is about 2 seconds or less.Type: GrantFiled: September 21, 2010Date of Patent: July 24, 2012Assignee: Applied Materials, Inc.Inventors: Khurshed Sorabji, Alexander N. Lerner
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Patent number: 8198567Abstract: A vacuum chuck and a process chamber equipped with the same are provided. The vacuum chuck assembly comprises a support body, a plurality of protrusions, a plurality of channels, at least one support member supporting the support body, at least one resilient member coupled with the support member, a hollow shaft supporting the support body, at least one electrical connector disposed through the hollow shaft, and an air-cooling apparatus. The support body has a support surface for holding a substrate (such as a wafer) thereon. The protrusions are formed on and project from the support surface for creating a gap between the substrate and the support surface. The channels are formed on the support surface for generating reduced pressure in the gap. The air-cooling apparatus is used for providing air cooling in the vicinity of the electrical connector.Type: GrantFiled: January 15, 2008Date of Patent: June 12, 2012Assignee: Applied Materials, Inc.Inventors: Alexander N. Lerner, Blake Koelmel, Mehran Behdjat
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Publication number: 20120122253Abstract: Embodiments of the invention contemplate a method, apparatus and system that are used to support and position a substrate on a surface that is at a different temperature than the initial, or incoming, substrate temperature. Embodiments of the invention may also include a method of controlling the transfer of heat between a substrate and substrate support positioned in a processing chamber. The apparatus and methods described herein generally may also provide an inexpensive and simple way of accurately positioning a substrate on a substrate support that is positioned in a semiconductor processing chamber. Substrate processing chambers that can benefit from the various embodiments described herein include, but are not limited to RTP, CVD, PVD, ALD, plasma etching, and/or laser annealing chambers.Type: ApplicationFiled: January 4, 2012Publication date: May 17, 2012Applicant: APPLIED MATERIALS, INC.Inventors: Blake Koelmel, Abhilash J. Mayur, Kai Ma, Alexander N. Lerner
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Publication number: 20120070136Abstract: The present invention generally relates to methods and apparatus for processing substrates. Embodiments of the invention include apparatuses for processing a substrate comprising a ceramic reflector plate, which may be optically transparent. The reflector plate may include a reflective coating and be part of a reflector plate assembly in which the reflector plate is assembled to a baseplate.Type: ApplicationFiled: July 18, 2011Publication date: March 22, 2012Applicant: Applied Materials, Inc.Inventors: Blake R. Koelmel, Aaron M. Hunter, Alexander N. Lerner