Abstract: Cooling arrangement and method for cooling of a heat source. The cooling arrangement includes a closed loop, a semi-open loop and at least one fan. The closed loop includes a primary side of a liquid-to-liquid heat exchanger receiving a first cooling fluid heated by the heat source, a first air-to-liquid heat exchanger downstream the primary side, and a first pump returning the first cooling fluid to the heat source. The semi-open loop includes a tank storing a second cooling fluid, a second pump drawing the second cooling fluid from the tank, a secondary side of the liquid-to-liquid heat exchanger receiving the second cooling fluid from the second pump, an evaporating pad downstream said secondary side, and an inlet fluidly connected to a source of the second cooling fluid. The at least one fan causes an air flow through the evaporating pad and through the first air-to-liquid heat exchanger.

Abstract: A cooling arrangement for a rack hosting electronic equipment and at least one fan comprises first and second air-liquid heat exchangers. A first one is mounted to the rack so that heated air expelled from the rack by the fan flows therethrough. The second one is mounted to the first one so that air having flowed through the first heat exchanger flows through the second heat exchanger. Each heat exchanger comprises a frame, an inlet receiving liquid from a cold supply line, an outlet returning liquid to a hot return line, and a continuous internal conduit forming a plurality of interconnected parallel sections. The cooling arrangement is mounted to the rack so that the first and second frames are parallel and adjacent. One interconnected parallel section of the first heat exchanger nearest to its inlet is proximate one interconnected parallel section of the second heat exchanger nearest to its outlet.

Abstract: A cooling system comprises a container receiving a dielectric cooling liquid and electronic components immersed in the dielectric cooling liquid. A first pump causes a circulation of a first fraction of the dielectric cooling liquid in the container for convection cooling of the electronic components. A second pump withdraws a second fraction of the dielectric cooling liquid from the container and directs the second fraction of the dielectric cooling liquid toward the electronic components for direct cooling of the electronic components. A manifold fluidly connected to an outlet of the second pump receives the second fraction of the dielectric cooling liquid from the second pump. One or more outlet pipes fluidly connected to the manifold bring portions of the second fraction of the dielectric cooling liquid in thermal contact with the electronic components.

Abstract: A liquid cooling device for cooling at least one target component that includes: a base member to be in thermal contact with the at least one target component to be cooled by the liquid cooling device, the base member including a lower surface configured to be placed in contact with the at least one target component, the base member defining a plurality of pockets spaced apart from one another on an upper side thereof and defining a plurality of fluid conduits configured to internally circulate a cooling liquid therethrough. Each of the plurality of pockets arranged to accommodate a corresponding fluid conduit and an interconnecting channel defined by the base member and extending between two neighboring pockets of the plurality of pockets for distributing the cooling fluid from the fluid conduit of one pocket to the fluid conduit of a neighboring pocket.

Abstract: A cooling block assembly for cooling a heat-generating electronic component includes: an upper block portion defining at least one internal fluid conduit and having a lower surface configured to face toward the heat-generating electronic component; a boss spaced from the lower surface and having a thermal transfer surface configured to be in thermal contact with the heat-generating electronic component, the thermal transfer surface being offset from the lower surface, a periphery of the thermal transfer surface being smaller than a periphery of the upper block portion, the periphery of the thermal transfer surface being contained within the periphery of the upper block portion in a projection thereof on a plane parallel to the thermal transfer surface; and heat distributing devices for distributing heat through a phase change of a working substance contained therein, each heat distributing device being disposed partially between the boss and the lower surface.

Abstract: A method for assembling a liquid cooling assembly includes: providing liquid cooling blocks each defining an internal fluid conduit; providing a first heat spreading base defining at least one first pocket; and providing a second heat spreading base defining second pockets, a number of second pockets being greater than a number of the at least one first pocket. When assembling a first liquid cooling assembly: at least one liquid cooling block is selected to mate with the first heat spreading base; and the selected at least one liquid cooling block is inserted at least partly into a corresponding one of the at least one first pocket. When assembling a second liquid cooling assembly: at least two liquid cooling blocks are selected to mate with the second heat spreading base; and the selected at least two liquid cooling blocks are inserted at least partly into corresponding ones of the second pockets.

Abstract: A water block assembly includes first and second water block units having respective first and second fluid conduits. The second water block unit is stacked on the first water block unit. The second fluid conduit operates either in parallel with the first fluid conduit or fluidly independent therefrom, such that cooled fluid is fed to the first and second fluid conduits. The first water block unit includes a first base portion and a first cover portion disposed on and affixed to the first base portion. The first cover portion defines a first fluid inlet and a first fluid outlet of the first fluid conduit. The second water block unit includes a second base portion and a second cover portion disposed on and affixed to the second base portion. The second cover portion defines a second fluid inlet and a second fluid outlet of the second fluid conduit.

Abstract: A thermal transfer device has a body and a fluid conduit defined in the body. The body has a thermal transfer surface configured to be placed in contact with a target component. The fluid conduit is configured for conveying fluid through the body and is thermally coupled to the thermal transfer surface.

Abstract: An uninterruptible power supply (UPS) includes: a housing defining an interior space; a door operatively connected to the housing, the door being configured to be selectively opened and closed for accessing the interior space of the housing; san electrical system enclosed within the housing; at least one liquid cooling device mounted to a target component of the UPS disposed within the housing for cooling thereof, the at least one liquid cooling device defining a fluid conduit for circulating fluid therethrough; and a pumping module including at least one pump fluidly connected to the at least one liquid cooling device for circulating fluid therethrough, each of the at least one pump and the fluid conduit of the at least one liquid cooling device defining in part a liquid cooling circuit, the pumping module being mounted to the door and disposed on an exterior side thereof.

Abstract: A method for controlling a cooling system of a rack, the rack comprising a heat generating component. The method comprises receiving, by a controller, at least one first temperature indications indicative of temperature variations of at least one heat transfer fluid circulating in at least one respective liquid channel of the cooling system; receiving, by the controller, at least one second temperature indications indicative of a temperature of an air flow of ambient air within the rack, the air flow being generated by at least one fan of the cooling system; and adjusting, based on the at least one first and second temperature indications, a rotational speed of the at least one fan and a rotational speed of at least one pump configured for causing the at least one heat transfer fluid to flow in at least one respective liquid channel.

Abstract: A rack assembly for a data center includes: a rack frame housing at least one heat-generating component; a heat exchanger defining a first internal fluid conduit; at least one liquid cooling block connected to the at least one heat-generating component, each of the at least one liquid cooling block defining a second internal fluid conduit, the second internal fluid conduit being in thermal connection with the first internal fluid conduit; a cooling loop independent from any sources of cooling fluid external to the rack assembly and comprising the first and second internal fluid conduits, the cooling loop transferring heat from the second internal fluid conduit to the first internal fluid conduit; and a fluid compensation system comprising a reservoir fluidly connected to the cooling loop and an actuating device to force cooling fluid from the reservoir to the cooling loop to compensate for loss of cooling fluid in the cooling loop.

Abstract: A rack system for a data center includes: a plurality of racks configured to house electronic equipment therein, at least one rack column being formed by at least some of the racks being disposed above one another, each rack having a rack depth measured in a front-to-rear direction; and at least one supporting pedestal disposed below the at least one rack column in order to support the at least one rack column, the at least one supporting pedestal being configured to be positioned on a ground surface of the data center to distribute a load of the at least one rack column on the ground surface, each of the at least one supporting pedestal having a pedestal depth measured in the front-to-rear direction, the pedestal depth being greater than the rack depth, a ratio of the pedestal depth over the rack depth being between 1.2 and 2.5 inclusively.

Abstract: A cooling assembly for a data center rack includes: a chassis; a heat exchanger connected to the chassis, the heat exchanger being disposed vertically at least in part between upper and lower ends of the chassis, and at least one lower bracket connected to a lower end portion of the chassis. The heat exchanger includes: a cooling coil for circulating a cooling fluid therethrough; and a plurality of fins connected to the cooling coil, the fins being spaced from one another to allow air flow therebetween. Each of the at least one lower bracket is a single piece of sheet metal bent into shape and includes a supporting wall extending frontward from the lower end portion of the chassis, the supporting wall being configured to receive at least in part a lower end of the data center rack thereon.

Abstract: Cooling arrangement and method for cooling of a heat source. The cooling arrangement comprises a closed loop, a semi-open loop and at least one fan. The closed loop comprises a primary side of a liquid-to-liquid heat exchanger receiving a first cooling fluid heated by the heat source, a first air-to-liquid heat exchanger downstream said primary side, and a first pump returning the first cooling fluid to the heat source. The semi-open loop comprises a tank storing a second cooling fluid, a second pump drawing the second cooling fluid from the tank, a secondary side of the liquid-to-liquid heat exchanger receiving the second cooling fluid from the second pump, an evaporating pad downstream said secondary side, and an inlet fluidly connected to a source of the second cooling fluid. The at least one fan causes an air flow through the evaporating pad and through the first air-to-liquid heat exchanger.

Abstract: A liquid cooling device for cooling at least one target component includes a base member configured to be in thermal contact with the at least one target component to be cooled by the liquid cooling device. The base member defines a plurality of pockets spaced apart from one another. A plurality of cover members are connected to the base member and are at least partially received in a corresponding pocket. Each cover member has a fluid inlet and outlet. The cover and base members define together a plurality of fluid conduits that are independent from one another. Each fluid conduit is defined between a cover member and the base member such that a number of the fluid conduits is equal to a number of the cover members. Each fluid conduit respectively receives and discharges fluid through the fluid inlet and the fluid outlet of the corresponding cover member.

Abstract: A cooling system (50) including an immersion case, a bladder and a controller is disclosed. The immersion case (54) is configured to house an immersion cooling liquid, and an electronic component (80) configured to be submerged in the immersion cooling liquid. The bladder (56) is configurable between an expanded state and a contracted state and positioned such that the bladder (56) can be at least partially submerged in the immersion cooling liquid when in any one of the expanded state and the contracted state. The controller (58) is connected to the bladder (56) for modulating the bladder (56) between the expanded state and the contracted state to modulate a fluid level of the immersion cooling liquid in the immersion case (54).

Abstract: A rack system for use, e.g., in data centers is disclosed. The rack system includes a rack frame and a rack-mounted assembly, including an electronic device disposed within the rack-mounted assembly, the electronic device including a heat-generating component. The heat-generating component is in thermal contact with a liquid cooling block through which a channelized cooling fluid is conveyed. The electronic device is immersed in a dielectric immersion cooling liquid. The rack-mounted assembly includes a non-sealed immersion case in which the electronic device is immersed in the dielectric immersion cooling liquid, the non-sealed immersion case configured to permit the rack-mounted assembly to be individually inserted into or removed from the rack frame. Also disclosed are container-based data center modules based on the disclosed rack system, and a data center using numerous such container-based modules.

Abstract: A heat sink for collecting thermal energy from a heat generating component. The heat sink comprises a base comprising a thermal transfer surface configured to be placed in thermal contact with the heat-generating component, an external surface opposite from the thermal transfer surface and an inlet side of the base extending between an edge of the thermal transfer surface and an edge of the external surface and a plurality of fins extending from the external surface. The fins define a plurality of fin passages therebetween, at least one fin of the plurality of fins having non-straight longitudinal edges extending along the external surface and defining at least in part at least one non-straight fin passage.

Abstract: A method and an extraction system for extracting an electronic device from a container filled with an immersion cooling liquid are disclosed. The extraction system includes a lifting device for lifting the electronic device from an open end of the container, a liquid dispersing device for dispersing immersion cooling liquid from the electronic device by generating an air flow, and a nozzle configured to be positioned above the open end of the container to limit a spread of immersion cooling liquid caused by the liquid dispersing device.

Abstract: A cooling device mountable on an electronic component comprising: a body having an internal fluid conduit for allowing a heat-transfer fluid to flow therethrough. The body comprises a first surface configured for mounting on the electronic component and permitting thermal transfer therethrough; a second surface; at least one side wall extending between the first surface and the second surface; and a gasket extending along the at least one side wall or a perimeter of the first surface, the gasket configured to extend away from the body beyond the first surface in a direction transverse thereto, to fluidly insulate the first surface when the first surface is mounted on the electronic component and submerged in the immersion cooling liquid in use.