Abstract: A cooling system comprises a main cooling arrangement thermally coupled to the heat generating component, and configured for collecting thermal energy of the heat generating component via a main heat transfer fluid, and a backup cooling arrangement thermally coupled to the main cooling arrangement and comprising at least one fluid path configured for conducting a backup heat transfer fluid. The cooling system comprises a thermal fuse disposed within at least a portion of the at least one fluid path, the thermal fuse changing from a solid state to a melted state and selectively enabling a flow of the backup heat transfer fluid in the at least one fluid path of the backup cooling arrangement in response to its temperature being above a temperature threshold, the backup heat transfer fluid being configured to, upon flowing in the at least one fluid path, collect thermal energy from the main cooling arrangement.

Abstract: A cooling system comprises a container receiving a dielectric cooling liquid and electronic components immersed in the dielectric cooling liquid. A first pump causes a circulation of a first fraction of the dielectric cooling liquid in the container for convection cooling of the electronic components. A second pump withdraws a second fraction of the dielectric cooling liquid from the container and directs the second fraction of the dielectric cooling liquid toward the electronic components for direct cooling of the electronic components. A manifold fluidly connected to an outlet of the second pump receives the second fraction of the dielectric cooling liquid from the second pump. One or more outlet pipes fluidly connected to the manifold bring portions of the second fraction of the dielectric cooling liquid in thermal contact with the electronic components.

Abstract: A rack system which includes a rack frame and at least one reservoir for housing at least one rack-mounted immersion case is disclosed. The rack frame is configured to slidably accommodate racking and de-racking operations of the at least one rack-mounted immersion case. The at least one collapsible reservoir, which is configured to store a fluid therein, is fluidly connected to the at least one rack-mounted immersion case, has a first portion fixedly connected to the at least one rack-mounted immersion case, and a second portion fixedly connected to the rack frame. The at least one collapsible reservoir is configured to respectively collapse and expand along a racked space and a de-racked space, the racked and de-racked spaces being defined between a backplane of the at least one rack-mounted immersion case and a backplane of the rack frame, the de-racked space being larger than the racked space.

Abstract: A rack system for housing an electronic device comprising: an immersion case configured to provide housing to the electronic device, and to receive an immersion cooling liquid, wherein the immersion case includes a drainage opening, wherein the drainage opening is configured to remove at least a part of the immersion cooling liquid from the immersion case, based on a user actuated action, during a de-racking operation of the immersion case; and a rack frame configured to slidably accommodate racking and de-racking operations of the immersion case.

Abstract: A rack system for housing an electronic device comprises an immersion case configured to provide housing to the electronic device. The immersion case includes a first wall, and a second wall. The first wall and the second wall define means for controlling deformation of the immersion case, such that when an immersion cooling liquid is inserted in the immersion case, the means for controlling deformation limit the deformation of the immersion case.

Abstract: The disclosed systems and structures are directed to providing a hybrid liquid-cooling system for at least one rack-mounted immersion case containing at least one electronic assembly submerged in dielectric immersion cooling liquid. The hybrid liquid cooling system comprises a closed-loop fluid distribution arrangement configured to circulate channelized fluid, an external cooling module configured to thermally condition the channelized fluid circulated by the closed-loop fluid distribution arrangement, a serpentine convection coil structured to internally convey channelized fluid to operatively cool ambient temperatures of the dielectric immersion cooling liquid, and one or more fluid cooling blocks arranged to be in direct thermal contact with one or more heat-generating electronic processing components of the at least one electronic assembly.

Abstract: A system provides cooling to an infrastructure having heat-generating units. Internal cooling units are thermally connected to the heat-generating units. An external cooling unit dissipates thermal energy of a heat-transfer fluid circulating in the internal cooling units. A cooling circuit connects the internal and external cooling units. A pump maintains a flow of the heat-transfer fluid for transferring thermal energy from the heat generating units to the external cooling unit. A reservoir thermally connected to the cooling circuit contains a phase change material (PCM) changing between solid and liquid states according to a temperature of the heat-transfer fluid. Thermal energy is transferred between the cooling circuit and the PCM depending on whether a temperature of the heat-transfer fluid is above or below a phase-change temperature value of the PCM. A supplemental cooling device thermally connected to the reservoir dissipates heat from the reservoir to the atmosphere.

Abstract: A water block assembly comprising a water block unit and an insulating housing, and a method for insulating a water block unit are provided. The water block unit has an external thermal transfer surface configured to be in contact with a heat generating component to be cooled, and defines an internal fluid conduit for circulating fluid therein, a fluid inlet for feeding fluid into the internal fluid conduit, and a fluid outlet for discharging fluid from the internal fluid conduit. The insulating housing at least partly embeds the water block unit therein to limit heat transfer from the water block unit to a surrounding environment thereof, the insulating housing having an internal surface in contact with the water block unit.

Abstract: A water block for cooling a heat-generating component has a body defining an internal fluid conduit for circulating fluid within the water block. The body defines a fluid inlet and a fluid outlet for feeding fluid into and discharging fluid from the internal fluid conduit respectively. The body includes: an external thermal transfer surface configured to be in contact with the heat-generating component; an opposite external surface on an opposite side of the body from the external thermal transfer surface; and at least one hollow fin extending from the opposite external surface, the at least one hollow fin defining at least one external fin passage, each of the at least one hollow fin defining an internal fin recess that forms part of the internal fluid conduit of the water block.

Abstract: A method is provided for positioning a data center rack relative to a rack-supporting frame. The method includes connecting at least one front attachment member to the data center rack on a front side thereof such that part of one of the at least one front attachment member and part of one of the at least one front attachment member extend leftward from a left end and rightward from a right end respectively of the data center rack; lifting and inserting the data center rack between a left and a right vertical support units until the at least one front attachment member abuts the left and right vertical support units; and moving the data center rack leftward or rightward until a hook portion of the at least one front attachment member engages the left or right vertical support unit to set a lateral position of the data center rack.

Abstract: A mesh panel for a heat exchanger system is provided. The mesh panel comprises a mesh body extending from an upper end to a lower end, the mesh body having an inlet side and an outlet side opposite the inlet side. The mesh body comprises a plurality of mesh wires arranged to form a mesh pattern defining a plurality of mesh openings between the mesh wires, and at least one penetrating mesh portion extending at least partly along a depth direction of the mesh body, the depth direction being normal to a plane extending between the upper and lower ends of the mesh body, the at least one penetrating mesh portion at least partly defining an air flow opening, the air flow opening having greater dimensions than each of the mesh openings.

Abstract: A heat exchanger assembly includes: a frame; a heat exchanger panel mounted to the frame and configured to exchange heat with air flowing therethrough, the heat exchanger panel being disposed at an inclined orientation; a fan assembly disposed vertically above the heat exchanger panel; and a sound dampening device disposed within an interior space of the heat exchanger assembly such that air is pulled into the interior space through the heat exchanger panel and then flows through the sound dampening device before being discharged from the heat exchanger assembly via the fan assembly. The sound dampening device includes baffle members having sound absorbing material and spaced apart from one another for allowing air flow therebetween. Each baffle member extends at an angle relative to a plane extending through the upper and lower ends of the heat exchanger panel so as to direct air flow upwardly toward the fan assembly.

Abstract: A cooling device comprises a first casing for direct mounting on a heat-generating component and a second casing mounted on the first casing. One casing includes an internal channel connected to a cold inlet and to a hot outlet allowing a heat-transfer fluid to flow in the internal channel. The other casing includes a storage containing a phase change material (PCM) changing from a solid state to a liquid state to transfer thermal energy from the heat-generating unit to the PCM, the PCM changing from the liquid state to the solid state to transfer thermal energy from the PCM to the heat-transfer fluid. The cooling device may be integrated in a cooling circuit of a cooling system including an external cooling unit, or in a closed loop cooling circuit of a cooling arrangement that transfers heat from the closed loop to an open loop.

Abstract: A heat exchanger stack includes a rack structure and heat exchangers disposed above one another and supported thereby. Each heat exchanger includes: a frame; a tubing arrangement configured to circulate fluid therein; a plurality of fins; and a plurality of wheels mounted to the frame for guided mounting of the heat exchanger panel on the rack structure including first and second upper wheels spaced apart from one another and first and second lower wheels spaced apart from one another. Each upper wheel engages a corresponding upper wheel guiding member of the rack structure, and each lower wheel engages a horizontal portion of a corresponding lower wheel guiding member of the rack structure so that the heat exchanger panel is translatable horizontally. A method for mounting a heat exchanger panel to a rack structure is also provided.

Abstract: A heat exchanger assembly has a frame including first and second legs laterally spaced apart, a lower transversal member extending laterally and interconnecting the legs, first and second upstanding members laterally spaced apart and extending upwardly from the lower transversal member, an upper transversal member extending laterally and disposed above the lower transversal member and connected to the first and second upstanding members, and first and second upper retaining members laterally spaced apart and being connected to the upper transversal member and extending transversally to the upper transversal member. First and second heat exchanger panels are connected to the first and second upper retaining members. The heat exchanger panels are disposed in a V-configuration such that a distance between upper ends thereof is greater than a distance between lower ends thereof. A fan has a fan rotation axis extending generally parallel to the first and second upstanding members.

Abstract: A heat exchanger assembly includes a heat exchanger panel disposed at an inclined orientation. A fan assembly is disposed vertically above the heat exchanger panel and includes a fan impeller connected to a fan mount. The fan impeller is sized and positioned such that part of the fan impeller rotates vertically above the upper end of the heat exchanger panel. A casing has a plurality of inner walls for guiding air from the heat exchanger panel toward the fan assembly. The inner walls include a sloped wall. A distance between an upper end of the sloped wall and a fan rotation axis is greater than a distance between a lower end of the sloped wall and the fan rotation axis. The sloped wall is adjacent to the upper end of the heat exchanger panel such that the part of the fan impeller rotates vertically above the sloped wall.

Abstract: A rack arrangement for a data center includes an assembly frame including vertical beams, lateral beams connected to the vertical beams, and transverse beams connected to the vertical beams. The transverse beams extend at least partly in a depth direction of the assembly frame. A rack-supporting platform is connected between two of the lateral beams and extends horizontally between four of the vertical beams. Each rack of a plurality of racks is configured to support computer equipment or cooling equipment for servicing the data center. A first rack is supported at least in part by two of the lateral beams. A second rack is disposed above the first rack and disposed atop the rack-supporting platform. The rack-supporting platform is supported in part by a top portion of the first rack such that a load of the second rack is partly applied on the first rack through the rack-supporting platform.

Abstract: A rack arrangement for a data center includes at least one row of racks including a plurality of computer racks and an air handler rack. Each computer rack includes a computer rack frame including a housing unit for housing computer equipment. The air handler rack includes an air handler rack frame, a heat exchanger and at least one fan. The at least one fan is configured for pulling air into the air handler rack via an air inlet side and discharging air via an air outlet side of the air handler rack, directing air through the heat exchanger. An air inlet side of any one of the computer racks and the air outlet side of the air handler rack are on a cold aisle side of the at least one row of racks. At least one selected rack is stacked atop the air handler rack.

Abstract: A cooling arrangement for autonomous cooling of a rack hosting components and fans comprises a closed loop and an open loop. Liquid cooling is used in the closed loop to transfer heat from heat-generating units of the components to a primary side of a liquid-to-liquid heat exchanger. An air-to-liquid cooling unit is used in the open loop to absorb heat expelled from the rack by the fans. A liquid from a cold supply line is first heated to some degree in the air-to-liquid cooling unit before reaching a secondary side of the liquid-to-liquid heat exchanger. The primary side being hotter than the secondary side, heat is transferred from the primary side to the secondary side of the liquid-to-liquid heat exchanger. The liquid is expelled at a higher temperature from the secondary side to a hot return line.

Abstract: An uninterruptible power supply (UPS) includes: a housing defining an interior space; a door operatively connected to the housing, the door being configured to be selectively opened and closed for accessing the interior space of the housing; san electrical system enclosed within the housing; at least one liquid cooling device mounted to a target component of the UPS disposed within the housing for cooling thereof, the at least one liquid cooling device defining a fluid conduit for circulating fluid therethrough; and a pumping module including at least one pump fluidly connected to the at least one liquid cooling device for circulating fluid therethrough, each of the at least one pump and the fluid conduit of the at least one liquid cooling device defining in part a liquid cooling circuit, the pumping module being mounted to the door and disposed on an exterior side thereof.