Abstract: The present invention describes a restroom attendant system. The restroom attendant system utilizes a notification device placed in a restroom. A patron would select a request for service button when the patron recognizes that the restroom needs servicing. The notification device can include a cancel feature as well as indicators to indicate when a request for service is in process and if the restroom is considered cleaned. The notification device would communicate with either a main terminal or a service person. The main terminal can further monitor the time between cleanings and request that a restroom be serviced should the time since the previous servicing exceeds an acceptable time-span. The information can be stored, printed, and uploaded to a central receiving station.

Abstract: A mood patch is fabricated by applying a thermotropic crystal material onto a flexible backing material. An encapsulant is placed over the thermotropic crystal material. The mood patch is coupled to the skin of an individual using a non-allergenic adhesive. The adhesive is applied to the contact side of the backing material during the fabrication process or the application process. The mood patch changes color to indicate the emotional state of an individual. This change in state is used by a clinically trained person, a supervisor or other technically trained individual to monitor and react to a change in emotional state of an individual by monitoring and interpreting the presented color of the mood patch. The mood patch can be of any shape and further include artwork on the face to improve aesthetics. A plurality of thermotropic material deposits can be utilized, each with a different activation temperature allowing the user to calibrate to the wearer's current emotional state.

Abstract: A plumbing valve cover is disclosed for use in conjunction with under-sink plumbing to avoid interference with the operation of a flexible spray nozzle hose used in conjunction with a spray nozzle. The plumbing valve cover may be coupled to the under-sink plumbing or cabinet wall. The plumbing valve cover may partially cover the under-sink plumbing and include clearances for multiple plumbing lines which may exit a supply valve via either the top, bottom, or sides. The preferred embodiment would be a single piece, injection molded plastic apparatus comprising a horizontal member which covers the top of the valve and two vertical members. The vertical members would be angled or curved to redirect the flexible hose away from getting caught on the valve. The horizontal member can include a pitch to redirect the hose away from the cover or valve when the hose is being retracted into the cabinet.

Abstract: A plumbing valve cover is disclosed for use in conjunction with under-sink plumbing to avoid interference with the operation of a flexible spray nozzle hose used in conjunction with a spray nozzle. The plumbing valve cover may be coupled to the under-sink plumbing or cabinet wall. The plumbing valve cover may partially cover the under-sink plumbing and include clearances for multiple plumbing lines which may exit a supply valve. The plumbing valve cover may include markings to aid in sizing the cover to variations in the length of a supply line. The preferred embodiment would be a single piece, injection molded plastic apparatus which includes structural ribs and C-shaped mounting clips which mechanically couple the plumbing valve cover to the supply valve.

Abstract: A method is disclosed for applying solder mask to an area respective of a plurality of receiving pads on a Printed Circuit Board. The solder mask can be at least partially removed during the component removal process exposing the conductor, via and annular ring. The exposed conductor, via and annular ring can cause defects and unreliable solder joints should the solder flow along the conductor and into the via. A small stencil can be used to apply solder mask in a desirable pattern to a selective area of a PCB. Alternatively, an elastomeric transferring apparatus can be used. Various methods can be included to assist in aligning the applicator to the desired area such as an overlaid, dual imaging system.

Abstract: A method is disclosed for applying solder mask to an area respective of a plurality of receiving pads on a Printed Circuit Board. The solder mask can be at least partially removed during the component removal process exposing the conductor, via and annular ring. The exposed conductor, via and annular ring can cause defects and unreliable solder joints should the solder flow along the conductor and into the via. A small stencil can be used to apply solder mask in a desirable pattern to a selective area of a PCB. Alternatively, an elastomeric transferring apparatus can be used. Various methods can be included to assist in aligning the applicator to the desired area such as an overlaid, dual imaging system.

Abstract: A business card holder is manufactured from a foil using an etching process and formed into the desired shape. The business card holder has a front facia, a bottom structure, and a rear supporting member. The front facia and the rear supporting member can include images to depicts the likeness of any of various objects such as vehicles, buildings, logos. The business card holder would be formed such that the business cards would rest between the front facia, a bottom, and the rear support. The rear support area can be taller than the business card to provide an exposed section that can be used for advertising, promotion, or any other additional applications. The business card holder can be raised using tabs to form stand offs, which may be in the likeness of objects respective to the images such as wheels and tires for a vehicle. The likeness can be further enhanced by additional half etching, through etching, or painting of features onto the foil.

Abstract: A method and apparatus are disclosed for improving the release of molten solder from a module via the introduction of acoustic pressure waves to the module and/or molten solder wave. The acoustic pressure waves may be created by a transducer where the waves are transferred to the module and/or solder wave through the air or reduced oxygen atmosphere. The acoustic pressure waves impinge on the molten solder and the module to reduce solder skips, bridges and icicles. The acoustic pressure waves are directed at the module/molten solder boundary to apply pressure to the boundary causing a shearing action. The shearing action causes the excess molten solder to fall, with the aid of gravity, into the molten solder bath.

Abstract: A method and apparatus are disclosed for releasing solder spheres during the locating and/or placing of a pattern of conductive preforms 32 on a respective pattern of electronic pads 14 on a receiving substrate 12 for such uses as a Ball Grid Array component 24. The release mechanisms are of either compliant mechanical 11, vibratory 90, air pressure 100 or 120, or sound pressure waves 140. Additionally, a method and apparatus is disclosed for the electrical inspection for presence or absence of the complete pattern of conductive preforms.

Abstract: A disposable apparatus for propelling particulate matter against a surface of a target material includes, a mixing chamber having a chamber wall, a multi-conduit receiving port, a propellant-gas receiving conduit, a discharge conduit, and a flow through conduit. The gas delivery conduit extends from the propellant-gas receiving port into the chamber, a mixture discharge conduit extending from the mixture discharge port into the chamber, and a quantity of particulate matter inside the chamber. The flow through conduit(s) provide a means for transferring flow from the multi-conduit receiving port through the discharge wall to exit proximate the exit of the discharge port.

Abstract: A method and apparatus are disclosed for a flexible support system using elongated support members to support a face of a module. The flexible support member(s) are arranged through a primary member with apertures, where the elongated support members are automatically returned to a home position by a self restoring mechanism, the position of the elongated support members are adjusted by the contacting forces applied by bringing the module and the flexible support apparatus together, then applying a clamping force to secure the elongated support members where the elongated support members can sustain the loads applied onto a module during an assembly process.

Abstract: A method and apparatus are disclosed for releasing solder spheres during the locating and/or placing of a pattern of conductive preforms 32 on a respective pattern of electronic pads 14 on a receiving substrate 12 for such uses as a Ball Grid Array component 24. The release mechanisms are of either compliant mechanical 11, vibratory 90, air pressure 100 or 120, or sound pressure waves 140. Additionally, a method and apparatus is disclosed for the electrical inspection for presence or absence of the complete pattern of conductive preforms.

Abstract: Solder Paste, adhesives and other materials are screen printed onto Printed Circuit Boards (PCB's) during the assembly process for electronic circuit assemblies. Pressure forces may be applied to the material to aid in separating the material from the apertures within the stencil. The pressure forces are created from sound pressure waves generated from a vibrational energy source located some distance from the stencil. Examples of non-contacting vibrational energy sources include Ultrasonic transducers, horns, speakers, and tuning forks. Additional assistance to separate the material from the apertures may be applied by a vibrational source by contacting to the stencil. Examples of the contacting vibrational energy sources may be off-balanced motors, piezo-electric transducers, and mass-resonant vibrators.

Abstract: A method and apparatus are disclosed for a flexible support system using elongated support members to support a face of a workpiece. The flexible support members are arranged through at least one plane of perforated material, where the elongated support members are raised to the maximum designed position, the shafts of the elongated support members are subjected to a resistive force, the position of the elongated support members are adjusted by the contacting forces applied by bringing the workpiece and the flexible support assembly together, then applying a locking force to secure the elongated support members where the elongated support members can sustain the loads applied during the operation onto the workpiece. Additionally, methods are disclosed which allow the elongated support members to optionally drop upon reaching a designed position.

Abstract: An inertial acoustic pickup (300) for use with a string musical instrument (700) having a soundboard (702) for delivering acoustic energy, comprises a chassis (302) including a coil (304) coupled to the soundboard (702), an armature including upper and lower substantially parallel planar suspension members (310) having planar perimeter regions (308) coupled to the chassis (302), and comprising a plurality of independent planar circular non-linear spring members (312) arranged regularly about a central planar region (314) within the planar perimeter region (305), an inertial mass (316) suspended between the upper and lower planar suspension members (310) about the central planar region (314) and having an axis (342) extending therebetween and including a plurality of permanent magnets (320) arranged regularly about a perimeter of the inertial mass (316), whereby acoustic energy coupled to the chassis (302) from the soundboard (702) is transformed through the planar non-linear spring members (312) into motional

Abstract: An electronic device (100) comprises a first substrate (102) having a first circuit pattern disposed thereon which is selectively processed to provide pretinned connection pads (108, 116, 124, 132, 140) for connection to at least one electronic component (142) and a second circuit pattern disposed on a second substrate (104). The second circuit pattern disposed on the second substrate (104) is selectively processed to further provide pretinned connection pads (110, 118, 126) for connection to the first circuit pattern, and the second substrate (104) further has relief provided within a portion thereof to position the at least one electronic component (142) with respect to the pretinned connection pads (108, 116, 124, 132, 140) on the first circuit pattern.

Abstract: A mounting pad arrangement (FIG. 5) improves reliability of placement of a surface mount component. A first pad array is disposed throughout an area on the surface (308) of a substrate (202), the area having four outside corners. The first pad array includes contact pads (502) arranged in a first linear grid pattern, and eight aligning pads (504,506,510,514,518), larger than the contact pads (502). Two aligning pads (504,506,510,514,518) are near each of the four outside corners. Each aligning pad (504,506,510,514,518) is positioned off center with respect to the first linear grid pattern such that a tangential line (608,610,612,614) can be drawn between an innermost point of the aligning pad (504,506,510,514,518) and corresponding innermost points of the contact pads (502) that are collinear on the first linear grid pattern. A second pad array (406) is disposed on the surface mount component and arranged in a second linear grid pattern that aligns with the first linear grid pattern.

Abstract: An electronic device (100) comprises a housing (222), a circuit supporting substrate (454, 456) within the housing and mechanically coupled thereto, and electronic circuitry (744, 746, 748, 750, 752) mechanically coupled to the circuit supporting substrate (454, 456). The electronic device (100) further comprises a mechanical shock isolation member (760, 762, 1312) within the housing (222) and mechanically coupled to the circuit supporting substrate (454, 456) for substantially increasing the natural mechanical frequency of vibration of the circuit supporting substrate (454, 456). The mechanical shock isolation member (760, 762, 1312) comprises an element (1313) having a planar surface (1315). The mechanical shock isolation member (760, 762, 1312) further comprises protuberances (1314) mechanically coupled to and extending perpendicularly from the planar surface (1315) for absorbing a tolerance build-up.

Abstract: The method for dispensing liquid on a substrate includes providing a plate (108) having a plurality apertures (110). These apertures (110) conform to the pattern of a plurality of pads (104, 106) of at least one component of a substrate (102). The apertures (110) are filled with the liquid to be dispensed, and are then aligned with the plurality of pads (104, 106) on the substrate (102). The liquid is simultaneously transferred out of the apertures (110)and onto the plurality of pads (104, 106) using a blower (112 ).