Abstract: A connector (40) for insertion into a portable electronic device (30) provides testing, programming and power thereto. The portable electronic device (30) has a chassis (32) housed therein and further includes a battery cavity (35) with battery contacts (36) therein. The connector (40) has a distal end for contacting the chassis (32) through an access port (34) in the battery cavity (35). A proximal end of the connector (40) is adapted for connection to a cable. The connector (40) has a substrate (50) attached to a printed wire board (41), wherein the printed wire board (41) further comprises a first plurality of conductors (52) thereon for receiving data signals from the cable, and a second plurality of conductors (42) thereon for receiving power signals from the cable.

Abstract: An electronic device (100) includes a housing (222), a circuit supporting substrate (902) within the housing (222) and mechanically coupled thereto, and electronic circuitry (904) mechanically coupled to the circuit supporting substrate (902). A mechanical shock isolator (502) is located within the housing (222), and is mechanically coupled to the circuit supporting substrate (902) for substantially increasing the natural mechanical frequency of vibration of the circuit supporting substrate (902). The mechanical shock isolator (502) includes an electrically conductive structure (504) that is electrically coupled to the electronic circuitry (904). Additionally, a method is provided for sensing the integrity of an electrical loop formed between the electrically conductive structure (504) and the electronic circuitry (904).

Abstract: A method and an apparatus align and attach a leadless surface mount component (402) including a termination at each end of the component (402). The termination has bottom (704) and end (702) portions for attaching to a corresponding pad on a substrate (102) by a reflow solder process (1200). A pad arrangement (100) is formed including two opposite pads (108), each pad (108) occupying a tri-oval-shaped area. The tri-oval-shaped area includes an elliptical area (110) substantially centered under the bottom portion (704) of the corresponding termination of the component (402) when the component (402) is aligned with the pad arrangement (100), and an arcuate area (112) contiguous with the elliptical area (110) and extending towards the opposite pad (108) in a central lengthwise direction.

Abstract: A printed circuit board providing RF shielding. An electrically insulating material serves as a substrate (10) with two opposed sides. At least one side of the substrate (10) has an electrically conductive layer (12) formed in a pattern that defines a printed circuit. An insulating dielectric layer (14) covers at least a portion of the printed circuitry, leaving at least one portion (16) of the circuitry exposed. A radio frequency (RF) shielding layer (18) is formed by depositing an electrically conductive polymer on at least a portion of the insulating dielectric layer. The RF shielding layer (18) also lies over a portion of the exposed electrical circuitry (16), providing electrical connection to the electrically conductive layer (12). The RF shielding layer (18) is formed from a silverfilled polymer thick film ink and is applied by screen printing, stencilling, roller coating, spraying, or other equivalent methods.

Abstract: A method for solder deposition by the use of a laser (24), comprises the steps of applying a predetermined thickness of solder (6) to a substrate (2) including over a printed circuitry pattern (4) on the substrate, laser printing (24) to a reflow temperature the solder on the printed circuitry pattern, leaving an un-reflowed portion (9) and then removing (26) the un-reflowed portion of the substrate, leaving solidified solder (7) on the printed circuitry pattern of the substrate. Additionally, if desired, a part (12) having solder pads (14) can be placed on the solder (7) after tack media (13) is placed on the solder. Then the part (12) and substrate can be reflowed in an oven (34).