Abstract: A three-dimensional (3D) high density memory array includes multiple layers of segmented bit lines (i.e., sense lines) with segment switch devices within the memory array that connect the segments to global bit lines. The segment switch devices reside on one or more layers of the integrated circuit, preferably residing on each bit line layer. The global bit lines reside preferably on one layer below the memory array, but may reside on more than one layer. The bit line segments preferably share vertical connections to an associated global bit line. In certain EEPROM embodiments, the array includes multiple layers of segmented bit lines with segment connection switches on multiple layers and shared vertical connections to a global bit line layer. Such memory arrays may be realized with much less write-disturb effects for half selected memory cells, and may be realized with a much smaller block of cells to be erased.

Abstract: The preferred embodiments described herein relate to a redundant memory structure using bad bit pointers. In one preferred embodiment, data is written in a first plurality of memory cells, and an error is detected in writing data in one of the memory cells. In response to the detected error, a pointer is written in a second plurality of memory cells, the pointer identifying which memory cell in the first plurality of memory cells contains the error. During a read operation, the data is read from the first plurality of memory cells, and the pointer is read from the second plurality of memory cells. From the pointer, the memory cell containing the error is identified, and the error is corrected. Other preferred embodiments are provided, and each of the preferred embodiments can be used alone or in combination with one another.

Abstract: A semiconductor device comprises two transistors where a gate electrode of one transistor and source or drain of another transistor are located in the same rail. A monolithic three dimensional array contains a plurality of such devices. The transistors in different levels of the array preferably have a different orientation.

Abstract: An exemplary NAND string memory array provides for capacitive boosting of a half-selected memory cell channel to reduce program disturb effects of the half selected cell. To reduce the effect of leakage current degradation of the boosted level, multiple programming pulses of a shorter duration are employed to limit the time period during which such leakage currents may degrade the voltage within the unselected NAND strings. In addition, multiple series select devices at one or both ends of each NAND string further ensure reduced leakage through such select devices, for both unselected and selected NAND strings. In certain exemplary embodiments, a memory array includes series-connected NAND strings of memory cell transistors having a charge storage dielectric, and includes more than one plane of memory cells formed above a substrate.

Abstract: Support circuitry for a three-dimensional memory array is formed in a substrate at least partially under the three-dimensional memory array and defines open area in the substrate under the three-dimensional memory array. In one preferred embodiment, one or more memory arrays are formed at least partially in the open area under the three-dimensional memory array, while in another preferred embodiment, logic circuitry implementing one or more functions is formed at least partially in the open area under the three-dimensional memory array. In yet another preferred embodiment, both one or more memory arrays and logic circuitry are formed at least partially in the open area under the three-dimensional memory array. Other preferred embodiments are provided, and each of the preferred embodiments can be used alone or in combination with one another.

Abstract: A three-dimensional flash memory array incorporates thin film transistors having a charge storage dielectric arranged in series-connected NAND strings to achieve a 4F2 memory cell layout. The memory array may be programmed and erased using only tunneling currents, and no leakage paths are formed through non-selected memory cells. Each NAND string includes two block select devices for respectively coupling one end of the NAND string to a global bit line, and the other end to a shared bias node. Pairs of NAND strings within a block share the same global bit line. The memory cells are preferably depletion mode SONOS devices, as are the block select devices. The memory cells may be programmed to a near depletion threshold voltage, and the block select devices are maintained in a programmed state having a near depletion mode threshold voltage. NAND strings on more than one layer may be connected to global bit lines on a single layer.

Abstract: A three-dimensional flash memory array incorporates thin film transistors having a charge storage dielectric arranged in series-connected NAND strings to achieve a 4F2 memory cell layout. The memory array may be programmed and erased using only tunneling currents, and no leakage paths are formed through non-selected memory cells. Each NAND string includes two block select devices for respectively coupling one end of the NAND string to a global bit line, and the other end to a shared bias node. Pairs of NAND strings within a block share the same global bit line. The memory cells are preferably depletion mode SONOS devices, as are the block select devices. The memory cells may be programmed to a near depletion threshold voltage, and the block select devices are maintained in a programmed state having a near depletion mode threshold voltage. NAND strings on more than one layer may be connected to global bit lines on a single layer.

Abstract: An array of transistors includes a plurality of transistors, a plurality of word lines extending in a first direction and a plurality of bit lines extending in a second direction. Each transistor includes a source, a drain, a channel and a localized charge storage dielectric. A first transistor of the plurality of transistors and a second transistor of the plurality of transistors share a common source/drain. A first localized charge storage dielectric of the first transistor does not overlap the common source/drain and a second localized charge storage dielectric of the second transistor overlaps the common source/drain.

Abstract: An array of transistors includes a plurality of charge storage transistors and a plurality of dummy transistors interspersed with the plurality of charge storage transistors. Each of the plurality of the dummy transistors is made using the same photolithographic masking steps as each of the plurality of the charge storage transistors. A method of operating the array includes programming and/or erasing the array of transistors, and reading the plurality of charge storage transistors but not the plurality of dummy transistors.

Abstract: A semiconductor device comprises two transistors where a gate electrode of one transistor and source or drain of another transistor are located in the same rail. A monolithic three dimensional array contains a plurality of such devices. The transistors in different levels of the array preferably have a different orientation.

Abstract: A semiconductor device comprises two transistors where a gate electrode of one transistor and source or drain of another transistor are located in the same rail. A monolithic three dimensional array contains a plurality of such devices. The transistors in different levels of the array preferably have a different orientation.

Abstract: Arrangements (circuits, methods, systems) having self-measurement of input/output (I/O) timing.

Abstract: According to one embodiment, a method of conducting a switching state (AC) loop back test at a buffer circuit comprises varying the relationship between the generation of strobe signals at a strobe input/output (I/O) circuit of a first group of I/O circuits and the reception of data at the first group of I/O circuits receiving the strobe signals fails, and comparing the time at which the first I/O circuit fails with a predetermined timing performance for the first group of I/O circuits. Subsequently, it is determined whether the first group of I/O circuits satisfies the predetermined timing performance.

Abstract: A method and apparatus for a strobe glitch protection mechanism for a source synchronous I/O link. One method of the present invention comprises separating a transfer clock having a plurality of transfer clock edges into a pointer path and a timing path. Glitches are filtered from signals on said pointer path. The pointer path and the timing path are coupled to generate latch enable signals to latch data bits.

Abstract: The preferred embodiments described herein provide a memory device and method for redundancy/self-repair. In one preferred embodiment, a memory device is provided comprising a primary block of memory cells and a redundant block of memory cells. In response to an error in writing to the primary block, a flag is stored in a set of memory cells allocated to the primary block, and the redundant block is written into. In another preferred embodiment, an error in writing to a primary block is detected while an attempt is made to write to that block. In response to the error, the redundant block is written into. In yet another preferred embodiment, a memory device is provided comprising a three-dimensional memory array and redundancy circuitry. In still another preferred embodiment, a method for testing a memory array is provided. Other preferred embodiments are provided, and each of the preferred embodiments described herein can be used alone or in combination with one another.

Abstract: The preferred embodiments described herein provide a memory device and method for storing bits in non-adjacent storage locations in a memory array. In one preferred embodiment, a memory device is provided comprising a register and a memory array. A plurality of bits provided to the memory device are stored in the register in a first direction, read from the register in a second direction, and then stored in the memory array. Bits that are adjacent to one another when provided to the memory device are stored in non-adjacent storage locations in the memory array. When the plurality of bits takes the form of an ECC word, the storage of bits in non-adjacent storage locations in the memory array reduces the likelihood of an uncorrectable multi-bit error. In another preferred embodiment, a memory device is provided comprising a memory array and a register comprising a first set of wordlines and bitlines and a second set of wordlines and bitlines arranged orthogonal to the first set.

Abstract: A memory device and method for storing bits in a memory array is provided. In one preferred embodiment, a memory device is provided comprising a plurality of memory cells that are in a first digital state and can be switched to a second digital state. A plurality of bits to be stored in the memory array are provided, and if the plurality of bits comprise more bits in the second digital state than in the first digital state, the plurality of bits are inverted before being stored in the memory array. In another preferred embodiment, a memory device is provided comprising a memory array and bit inversion circuitry. In yet another preferred embodiment, a plurality of bits are inverted before being stored in a memory array if the plurality of bits comprise more bits in a non-preferred digital state than in a preferred digital state.

Abstract: A circuit includes an output driver, where the output driver includes a pull-up device and a pull-down device. The pull-up device has a first control terminal that is responsive to an RC-timer so as to bias the pull-up device on in response to an electrostatic discharge (ESD) event that activates a device coupled to an output of the RC-timer. The pull-down device has a second control terminal that, for one aspect, is in a substantially indeterminate state (i.e. the second control terminal may be a “1”, “0” or some other voltage, which may or may not be within the voltage range between “1” and “0”) during the ESD event.

Abstract: Controlling the slew rate of a driver circuit. According to one embodiment of the present invention an output buffer includes a driver circuit having an impedance and a pre-driver circuit to control a slew rate of the driver circuit based on the impedance of the driver circuit.

Abstract: An n-well resistor device and its method of fabrication. The n-well resistor device of the present invention comprises a first n-type region and a second n-type region formed in an n-type silicon region. A gate dielectric layer formed on said n-type silicon region. A polysilicon gate formed on said gate dielectric.