Abstract: An organic light emitting diode display is provided. The organic light emitting diode display comprises an organic light emitting diode panel, a quarter-wavelength retarder disposed on the organic light emitting diode panel, a polarizer disposed on the quarter-wavelength retarder, an adhesive layer disposed on the polarizer and a diffraction grating film adhered to the polarizer by the adhesive layer. The diffraction grating film comprises a substrate and a first diffraction grating layer comprising a plurality of first gratings aligned with a first direction disposed on the substrate.

Abstract: A semiconductor structure includes a substrate, a bit line, and a first isolation layer. A groove is set in the substrate. A bottom end of the bit line is set in the groove. The first isolation layer is at least partially set on a sidewall of the bit line, and the first isolation layer is in direct contact with the bit line.

Abstract: A closed-loop liquid cooling system includes a liquid coolant conduit, a cold plate, a pump and a heat exchanger. The liquid coolant conduit is in proximity to a heat-generating electrical component. The liquid coolant conduit allows circulation of a liquid coolant to extract heat therefrom. The liquid coolant conduit includes an inner portion that surrounds and contains the liquid coolant, and an outer portion configured to prevent or inhibit leakage of the liquid coolant from the inner portion and also detect any leakage from the inner portion. The cold plate is in thermal communication with the liquid coolant. The pump is configured to transport the liquid coolant in the liquid coolant conduit. The heat exchanger is coupled to the liquid coolant conduit to extract heat therefrom.

Abstract: A clip for securing one or more cables associated with a computing device includes a baseplate, a first wall, and a second wall. The first wall and the second wall extend from the baseplate. The first wall has a first inward projection at a distal end thereof. The second wall has a second inward projection at a distal end thereof. The first wall is generally parallel to the second wall. The first wall and the second wall are spaced apart from each other by an interior space configured to receive the one or more cables. The first inward projection and the second inward projection aid in preventing the one or more cables from moving outside of the interior space.

Abstract: A fluid cooling device includes a bottom plate, an adhesive layer and a spray cooling cover. The bottom plate includes a substrate and a chip, and the spray cooling cover is fixed on the bottom plate by an adhesive layer. In addition, the spray cooling cover includes a fluid inlet and a plurality of fluid outlets to utilize a working fluid to cool the chip directly.

Abstract: Disclosed in embodiments of the present disclosure are a flexible circuit board assembly, a display assembly and a display device. The flexible circuit board assembly includes: a first flexible circuit board, including a component part, the component part being provided with components; and a first wave absorbing layer, disposed on the component part and configured to cover the components. The display assembly includes a display module and the flexible circuit board assembly; the display module includes a module body and a second binding part, and the second binding part is configured to be bent to a back surface of the module body; and the first flexible circuit board is located on the back surface of the module body and includes a first binding part, and the first binding part is bound and connected to the second binding part of the display module.

Abstract: A wireless charging base is provided, and is mainly applied to electronic devices such as a mobile phone and a tablet computer. The wireless charging base includes a charging panel, configured to charge the electronic device. The charging panel includes a first air vent and a second air vent. A first base plate is disposed on an upper surface of the charging panel, is located at an end of the charging panel, and is configured to support the electronic device when the electronic device is being charged. The first base plate includes a third air vent. A second base plate is disposed on the lower surface of the charging panel, is located at the same end as the first base plate, and is configured to support the charging panel. The second base plate includes a fourth air vent.

Abstract: An electronic device is provided and includes a circuit board and a casing. The circuit board includes a plate body, a perforation and a ground wire. The perforation penetrates through the plate body, the ground wire is electrically coupled with the plate body and crosses over the perforation. The casing includes a bottom plate and a clamping structure. The clamping structure is disposed on the bottom plate and includes a first clamping part and a second clamping part. The circuit board is disposed in the casing, and the clamping structure penetrates through the plate body through the perforation, so that the circuit board is positioned on the casing, and the ground wire is clamped by the first clamping part and the second clamping part of the clamping structure. Consequently, the circuit board is grounded with the casing.

Abstract: A circuit board structure includes a first sub-circuit board, a second sub-circuit board, and a third sub-circuit board. The first sub-circuit board has an upper surface and a lower surface opposite to each other, and includes at least one first conductive through hole. The second sub-circuit board is disposed on the upper surface of the first sub-circuit board and includes at least one second conductive through hole. The third sub-circuit board is disposed on the lower surface of the first sub-circuit board and includes at least one third conductive through hole. At least two of the first conductive through hole, the second conductive through hole, and the third conductive through hole are alternately arranged in an axial direction perpendicular to an extending direction of the first sub-circuit board. The first, second and third sub-circuit boards are electrically connected to one another.

Abstract: Patterned dental positioning appliances including a shell including one or more cavities shaped to receive and exert repositioning forces on one or more teeth of a subject's dentition. An inner surface of at least a portion of the one or more cavities may include a raised mesh pattern arranged to contact one or more teeth within the at least a portion of the one or more cavities. The raised mesh pattern may be arranged to impart a contact force that affects one or more of a direction, a duration and a magnitude of the repositioning forces exerted on the one or more teeth. The raised mesh pattern may be is integrally formed with the shell and is made of the same polymer material as the shell.

Abstract: A hybrid image based on different tissue specimen images is generated to compensate for blood and other fluids that interfere with imaging. Specimen is deposited into tray with fluid. X-ray and camera imaging devices acquire images of specimen and fluid. X-ray and optical images are processed for generation of hybrid image. Transparency modifications allow for multiple and different images to contribute to depiction of specimen edges or boundaries that would otherwise appear less clear in x-ray image due to interfering fluid. Transparency modifications in hybrid image also provide for sufficiently high transparency in certain optical image portions that would otherwise be opaque so that objects of interest depicted in x-ray image but not optical image are visible.

Abstract: The present disclosure provides a dressing configured to cover a wound. The dressing includes a substrate layer, a contact layer and a readable pattern layer. The substrate layer is light-permeable. The contact layer is located at a side of the substrate layer, and the contact layer is configured to contact the wound or skin around the wound. The readable pattern layer is disposed on the contact layer. The readable pattern layer includes a plurality of positioning marks and a plurality of colored cells. The positioning marks are configured to define an information area. The colored cells are located in the information areas, wherein at least part of the colored cells includes a biological indicator, and the positioning marks and the colored cells are visible through the substrate layer.

Abstract: A real-time control system for industrial robots based on virtual reality (VR), including: a VR headset, a VR controller, a model construction module, a motion control module, a data communication system and a robot controller. Through the VR controller, a user can touch and drag an end of the gripper to move the robot in the Cyber environment. When the gripper moves into a bounding box of a control point, the data communication system is triggered, and a communication code corresponding to the control point is sent to the robot controller via a Unity engine script. After receiving the code, the robot controller sends the corresponding motion command such that the robot such that the robot moves in real time according to the control data.

Abstract: The present disclosure relates to an innovative leather and a manufacturing method thereof. The innovative leather includes a TPU substrate, a TPU adhering layer, and a TPU surface layer. The TPU adhering layer is disposed on the TPU substrate. The TPU surface layer is disposed on the TPU adhering layer. All materials of the innovative leather of the present disclosure are the same TPU materials, thus the innovative leather of the present disclosure can be recycled after the innovative leather of the present disclosure is used. The innovative leather of the present disclosure has recycling benefit.

Abstract: A method of forming a semiconductor device includes patterning a mask layer and a semiconductor material to form a first fin and a second fin with a trench interposing the first fin and the second fin. A first liner layer is formed over the first fin, the second fin, and the trench. An insulation material is formed over the first liner layer. A first anneal is performed, followed by a first planarization of the insulation material to form a first planarized insulation material. After which, a top surface of the first planarized insulation material is over a top surface of the mask layer. A second anneal is performed, followed by a second planarization of the first planarized insulation material to form a second planarized insulation material. The insulation material is etched to form shallow trench isolation (STI) regions, and a gate structure is formed over the semiconductor material.