Abstract: A method for fabricating a micro display device includes the steps of providing a wafer comprising a first area, a second area, and a third area, forming first bonding pads on the first area, forming second bonding pads on the second area, and forming third bonding pads on the third area. Preferably, the first bonding pads and the second bonding pads are made of different materials and the first bonding pads and the third bonding pads are made of different materials.

Abstract: Embodiments of the present disclosure provide a method, system, and storage medium for predicting an area of oil spill on sea surface, the method for predicting the area of oil spill on sea surface includes: S1, obtaining a training dataset; S2, constructing an oil spill numerical model, and determining a predictive model by performing a predetermined processing on an initial predictive model based on simulation result data and the training dataset; S3, initializing the predictive model, determining a count of nodes of an input layer, an output layer, and a hidden layer; and S4, obtaining input data and inputting the input data into the predictive model in S2 to obtain an oil spill area on sea surface to be measured. The method, when used, has a small error and high accuracy, can save a lot of material and financial resources, and can be more widely used in real life.

Abstract: Semiconductor package includes a pair of dies, a redistribution structure, and a conductive plate. Dies of the pair of dies are disposed side by side. Each die includes a contact pad. Redistribution structure is disposed on the pair of dies, and electrically connects the pair of dies. Redistribution structure includes an innermost dielectric layer, an outermost dielectric layer, and a redistribution conductive layer. Innermost dielectric layer is closer to the pair of dies. Redistribution conductive layer extends between the innermost dielectric layer and the outermost dielectric layer. Outermost dielectric layer is furthest from the pair of dies. Conductive plate is electrically connected to the contact pads of the pair of dies. Conductive plate extends over the outermost dielectric layer of the redistribution structure and over the pair of dies. Vertical projection of the conductive plate falls on spans of the dies of the pair of dies.

Abstract: The present disclosure relates to a method for forming a semiconductor device includes forming an opening between first and second sidewalls of respective first and second terminals. The first and second sidewalls oppose each other. The method further includes depositing a first dielectric material at a first deposition rate on top portions of the opening and depositing a second dielectric material at a second deposition rate on the first dielectric material and on the first and second sidewalls. The second dielectric material and the first and second sidewalls entrap a pocket of air. The method also includes performing a treatment process on the second dielectric material.

Abstract: The present invention provides a polyurethane nanofiber waterproof moisture-permeable film, a preparation method thereof and application thereof. The polyurethane nanofiber waterproof moisture-permeable film is prepared from two kinds of isothiocyanate and two kinds of polyethylene glycol as raw materials, and the polyurethane nanofiber waterproof moisture-permeable film has good water pressure resistance, tensile property, and moisture permeability. In addition, the polyurethane nanofiber waterproof moisture-permeable film is prepared by adopting an electrostatic spinning method, is low in cost, simple to operate and high in production efficiency, and has a good application prospect in the fields of clothing, medical treatment, electronic appliances, and the like.

Abstract: A method for facilitating analysis of causes of machining defects is provided. The method is carried out by a computer system. The method includes the step of obtaining motion data and vibration acceleration data about the tip of a cutter mounted on a machine tool. The method further includes the step of obtaining time-frequency information about the vibration acceleration data by performing a time-frequency analysis on the vibration acceleration data. The method further includes the step of obtaining vibration-displacement data by normalizing the time-frequency information. The method further includes the step of obtaining amplitude-distribution data about the tip by synchronizing the motion data and the vibration-displacement data.

Abstract: An optical element driving mechanism is provided and includes a fixed assembly, a movable assembly, a driving assembly and a stopping assembly. The fixed assembly has a main axis. The movable assembly is configured to connect an optical element, and the movable assembly is movable relative to the fixed assembly. The driving assembly is configured to drive the movable assembly to move relative to the fixed assembly. The stopping assembly is configured to limit the movement of the movable assembly relative to the fixed assembly within a range of motion.

Abstract: The present disclosure relates to a CMOS image sensor having a multiple deep trench isolation (MDTI) structure, and an associated method of formation. In some embodiments, the image sensor comprises a boundary deep trench isolation (BDTI) structure disposed at boundary regions of a pixel region surrounding a photodiode. The BDTI structure has a ring shape from a top view and two columns surrounding the photodiode with the first depth from a cross-sectional view. A multiple deep trench isolation (MDTI) structure is disposed at inner regions of the pixel region overlying the photodiode, the MDTI structure extending from the back-side of the substrate to a second depth within the substrate smaller than the first depth. The MDTI structure has three columns with the second depth between the two columns of the BDTI structure from the cross-sectional view. The MDTI structure is a continuous integral unit having a ring shape.

Abstract: Provided is an antenna module including a first planar inverted-F antenna radiator, a first ground plane, a second ground plane, and a conductor. The first planar inverted-F antenna radiator includes a first feeding terminal and a first ground terminal. The first ground terminal is connected to the first ground plane. The second ground plane is located on one side of the first ground plane. A gap exists between the first ground plane and the second ground plane. The conductor is located between the first ground plane and the second ground plane and connects the first ground plane with the second ground plane.

Abstract: A container for containing food or liquid is provided. The container includes a body portion, a lid and an attachment. The lid is detachably disposed on the body portion. The attachment is configured to be disposed on the lid or the body portion and includes a magnetic attraction member and a connecting structure. The magnetic attraction member is adapted to be magnetically connected to a mobile electronic device. The connecting structure is disposed between the magnetic attraction member and the container for selectively fixing the magnetic attraction member at a first position or a second position. The connecting structure includes a fastening member, and the fastening member is adapted to be detachably fastened to the body portion or the lid.

Abstract: A power system including a first battery pack, a second battery pack, and a power management circuit is disclosed. The first battery pack has a first end and a second end, and has a first battery capacity. The second battery pack has a third end and a fourth end. The third end is coupled to the second end of the first battery pack and provides a low battery voltage. The fourth end is grounded, the second battery pack has a second battery capacity, and the second battery capacity is greater than the first battery capacity. The power management circuit is coupled to the second battery pack to receive the low battery voltage, and provides a component operating voltage to an electronic components based on the low battery voltage.

Abstract: The present disclosure provides for splice-switching oligonucleotides (SSOs) targeted to a nucleic acid encoding a transposable element (TE)-driven isoform of LIN28B, such as AluJb-LIN28B. The SSOs may be targeted to an exon-intron or intron-exon junction to inhibit splicing and expression of the TE-driven isoform of LIN28B. Methods of treating cancer, particularly cancers expressing AluJb-LIN28B, comprising administering the SSOs are also provided.

Abstract: A container for containing food or liquid is provided. The container includes a body portion, a lid and an attachment. The lid is detachably disposed on the body portion. The attachment includes a magnetic attraction member and a connecting structure. The magnetic attraction member is independent from the lid and adapted to be magnetically connected to a mobile electronic device. The connecting structure is disposed between the magnetic attraction member and the container for selectively fixing the magnetic attraction member at a first position or a second position. At least a portion of the connecting structure is fixed to the container.

Abstract: A 24 GHz band-pass filter includes a step impedance resonator, a first U-shape feeding portion, a second U-shape feeding portion, short-circuit stubs and open-circuit stubs. The step impedance resonator includes a first main portion, a second main portion, and a connection portion for connecting the main portions to each other. The first main portion and the second main portion are electrically connected to a first signal input/output port and a second signal input/output port. The first U-shape feeding portion is electrically connected between the first main portion and the first signal input/output port. The second U-shape feeding portion is electrically connected between the second main portion and the second signal input/output port. The short-circuit stubs are electrically connected to coupling segments of the step impedance resonator. The open-circuit stubs are electrically connected to the first U-shape feeding portion and the second U-shape feeding portion.

Abstract: The present disclosure provides a forksheet structure in a semiconductor device and methods of manufacturing thereof. The forksheet structure according to the present disclosure includes a dielectric wall disposed between two channel regions inside a gate structure and without extending through the sidewall spacers to the source/drain regions. In some embodiments, a cut metal gate (CMG) dielectric structure is formed in the gate structure along with the dielectric walls. A gate dielectric layer is in contact with the dielectric wall. In some embodiments, the dielectric layer surrounds semiconductor channels in the channel region. In other embodiments, the gate dielectric layer surrounds a portion of the semiconductor channels in the channel region, for example forming a ?-shape cross sectional profile around the semiconductor channel.

Abstract: A method of categorizing text entries on a document can include determining, for each of a plurality of text bounding boxes in the document, respective text, respective coordinates, and respective input embeddings. The method may further include defining a graph of the plurality of bounding boxes, the graph comprising a plurality of connections among the plurality of bounding boxes, each connection comprising a first and second bounding box and zero or more respective intermediate bounding boxes. The method may further include determining a respective attention value for each connection according to a quantity of intermediate bounding boxes in the connection and, based on a the respective attention values and a transformer-based machine learning model applied to the respective input embeddings and respective coordinates, determining output embeddings for each bounding box and, based on the respective output embeddings, generating a bounding box label for each bounding box.

Abstract: A pressure relief apparatus may include a pressure relief portion and a plurality of stages of indented grooves. The pressure relief portion may be provided with a first surface and a second surface arranged opposite to each other in a thickness direction thereof. The plurality of stages of indented grooves may be formed in the pressure relief portion in sequence in a direction from the first surface to the second surface, and among two adjacent stages of indented grooves, the stage of indented groove away from the first surface may be formed in a bottom surface of the stage of indented groove close to the first surface. The pressure relief portion may be provided with an opening area, and the indented grooves may be formed along an edge of the opening area.

Abstract: Disclosed is a method of preparing black tea extract with high theaflavin content, which utilizes an enzyme solution prepared by extracting polyphenol oxidase and laccase from bergamot yam (Dioscorea opposita foshou) or Chinese yam (Dioscoreae Rhizoma). Also disclosed is a method of treating liver fibrosis or kidney injury or atherosclerosis in a subject.

Abstract: The present disclosure relates generally to terpene glycosides, such as certain such compounds extracted from Stevia rebaudiana Bertoni, Rubus suavissimus, or Siraitia grosvenorii. The disclosure also provides for the use of such compounds as food ingredients, flavors, and sweeteners, and related methods. The disclosure also provides ingestible compositions comprising such compounds, as well as processes for extracting such compounds selectively from certain plant sources.

Abstract: An integrated circuit includes a first and second active region, a first insulating region, and a first and second contact. The first and second active region extend in a first direction, and are on a first level. The first active region includes a first and second drain/source region. The second active region includes a third drain/source region. The first insulating region is over the first drain/source region. The first contact overlaps the third drain/source region, is electrically coupled to the third drain/source region and is located on a second level. The second contact includes a first and second portion. The first portion overlaps the first and second drain/source. The second portion overlaps the first contact, the first and third drain/source region, and the first insulating region, and is electrically coupled to the first portion, and electrically insulated from the first drain/source region.