Patents by Inventor An-Ting Wang

An-Ting Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240126275
    Abstract: The present invention is directed to an obstacle avoidance system for an unmanned vehicle, comprising: an obstacle sensing module provided at a vehicle body; a vehicle-mounted computer provided at the vehicle body and electrically connected to the obstacle sensing module; a control module provided at the vehicle body and electrically connected to the vehicle-mounted computer; and a power source provided at the vehicle body and electrically connected to the obstacle sensing module, the vehicle-mounted computer and the control module.
    Type: Application
    Filed: October 5, 2023
    Publication date: April 18, 2024
    Inventors: Tsung-Yuan Wang, Chih-Ting Li, Shou-Hsien Wang
  • Publication number: 20240125921
    Abstract: Provided are methods for generation of representations of radar data. Some methods described include: receiving ADC raw data of a radar sensor of a vehicle; performing range FFT, Doppler FFT, and azimuth FFT on the ADC raw data; generating a 1D range heat map tensor representing the range FFT, a 2D RD heat map tensor representing a combination of the range FFT and the Doppler FFT, a 2D RA heat map tensor representing a combination of the range FFT and the azimuth FFT, or a 3D RAD matrix tensor representing a combination of the range FFT, the Doppler FFT, and the azimuth FFT; and inputting at least one of the 1D range heat map tensor, the 2D RD heat map tensor, the 2D RA heat map tensor, or the 3D RAD matrix tensor, to a machine learning model for detecting objects on a road network around the vehicle.
    Type: Application
    Filed: February 2, 2023
    Publication date: April 18, 2024
    Inventors: Ting Wang, Yun Lin, Ken Power
  • Patent number: 11959186
    Abstract: Embodiments of the present application provide an electroplating method and an electroplating apparatus. The electroplating method includes: before putting wafers into an electroplating solution to undergo an electroplating process, adding particles into the electroplating solution, and applying ultrasonic waves to the electroplating solution, so as to remove bubbles in the electroplating solution by oscillation; removing the particles in the electroplating solution; and putting the wafers into the electroplating solution to undergo the electroplating process.
    Type: Grant
    Filed: November 22, 2021
    Date of Patent: April 16, 2024
    Assignee: Changxin Memory Technologies, Inc.
    Inventor: Ting Wang
  • Patent number: 11961763
    Abstract: Devices and methods that a first gate structure wrapping around a channel layer disposed over the substrate, a second gate structure wrapping around another channel layer disposed over the substrate and a dielectric fin structure formed over a shallow trench isolation (STI) feature and between the first and second gate structures. At least one metallization layer is formed on the first gate structure, the dielectric fin structure, and the second gate structure and contiguously extends from the first gate structure to the second gate structure.
    Type: Grant
    Filed: April 7, 2021
    Date of Patent: April 16, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Jia-Chuan You, Kuan-Ting Pan, Shi Ning Ju, Kuo-Cheng Chiang, Chih-Hao Wang
  • Patent number: 11962986
    Abstract: The present disclosure provides a speaker diaphragm and a speaker. The diaphragm includes a thermoplastic polyester elastomer film layer, a thermoplastic polyester elastomer being a copolymer composed of a hard segment A of polyester and a soft segment B of polyether or aliphatic polyester, wherein the thermoplastic polyester elastomer film layer has Young's modulus of 1-1000 MPa, with an elastic recovery rate after 10% strain being greater than or equal to 80%. The speaker diaphragm has a good stiffness, a good damping performance and a good resilience.
    Type: Grant
    Filed: October 13, 2018
    Date of Patent: April 16, 2024
    Assignee: Goertek Inc.
    Inventors: Ting Wang, Guodong Zhao, Jie Zhu, Chun Li, Chunfa Liu
  • Patent number: 11963347
    Abstract: A memory device includes a transistor, an anti-fuse element, a source/drain contact, a first gate via, and a second gate via. The transistor is over a substrate. The anti-fuse element is over the substrate and is connected to the transistor in series. The source/drain contact is connected to a source/drain region of the transistor. The first gate via is connected to a first gate structure of the transistor. The first gate structure of the transistor extends along a first direction in a top view. The second gate via is connected to a second gate structure of the anti-fuse element. The second gate via is between the first gate via and the source/drain contact along the first direction in the top view.
    Type: Grant
    Filed: April 21, 2023
    Date of Patent: April 16, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chiung-Ting Ou, Ming-Yih Wang, Jian-Hong Lin
  • Patent number: 11962526
    Abstract: A method for obtaining a quantity of resource elements in a communication process, comprising: determines a downlink control information format of downlink control information, obtains, based on the downlink control information format, a quantity of resource elements occupied by a demodulation reference signal (DMRS); and determines a size of transport block (TBS) based on the quantity of resource elements occupied by the DMRS.
    Type: Grant
    Filed: February 19, 2021
    Date of Patent: April 16, 2024
    Assignee: Huawei Technologies Co., Ltd.
    Inventors: Ting Wang, Yongzhao Cao, Yi Wang, Hao Tang, Zhenfei Tang
  • Patent number: 11961324
    Abstract: An optical fingerprint recognition device includes a light-emitting diode (LED) array and a fingerprint sensing device. The LED array includes a central LED area and an edge LED area, and configured to display a light source pattern in response to a fingerprint sensing request. The light source pattern includes a central portion and a surrounding portion. During displaying the light source pattern, a plurality of red display subpixels of the central LED area are not illuminating and a plurality of red display subpixels of the edge LED area are illuminating. The fingerprint sensing device generates a first fingerprint image according to a plurality of first sensing signals obtained from a plurality of first sensing pixel area, and the first fingerprint image is adapted to be used for examining whether a finger which triggers the fingerprint sensing request is real or fake.
    Type: Grant
    Filed: December 26, 2022
    Date of Patent: April 16, 2024
    Assignee: Novatek Microelectronics Corp.
    Inventors: Shu-Fang Wang, Wan-Ting Huang, Kuan-Ting Lee
  • Patent number: 11961915
    Abstract: A semiconductor transistor device includes a channel structure, a gate structure, a first source/drain epitaxial structure, a second source/drain epitaxial structure, a gate contact, and a back-side source/drain contact. The gate structure wraps around the channel structure. The first source/drain epitaxial structure and the second source/drain epitaxial structure are disposed on opposite endings of the channel structure. The gate contact is disposed on the gate structure. The back-side source/drain contact is disposed under the first source/drain epitaxial structure. The first source/drain epitaxial structure has a concave bottom surface contacting the back-side source/drain contact.
    Type: Grant
    Filed: March 24, 2022
    Date of Patent: April 16, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Shi Ning Ju, Chih-Hao Wang, Kuo-Cheng Chiang, Kuan-Lun Cheng, Wen-Ting Lan
  • Publication number: 20240115627
    Abstract: The present disclosure relates to use of a Clostridium ghonii spore combined with pembrolizumab in cancer treatment. It is found for the first time that the Clostridium ghonii spore combined with pembrolizumab can significantly improve a curative effect of colon cancer and reduce a dose of the pembrolizumab, and thus is efficient and low-toxic. Oncolysis by Clostridium ghonii can affect immunogenicity of a tumor microenvironment (TME) by various ways, converts an immunosuppressive state of the TME into an immune-activated state, adjusts the immunosuppressive TME, and breaks an immune tolerance. An optimal combination of the Clostridium ghonii spore and the pembrolizumab thoroughly removes about 20% of mouse tumor tissues. A benefit range of patients with tumors treated by a PD-1 antibody is expanded. The combination even has an obvious curative effect on patients failed the treatment by the PD-1 antibody.
    Type: Application
    Filed: October 9, 2022
    Publication date: April 11, 2024
    Inventors: Yong Wang, Hong Zhu, Wenhua Zhang, Yanqiu Xing, Dan Wang, Yuanyuan Liu, Shaopeng Wang, Jiahui Zheng, Rong Zhang, Xiaonan Li, Xinglu Xu, Shengbiao Jiang, Lichao Xing, Yuxia Gao, Shili Shao, Ting Han
  • Publication number: 20240118116
    Abstract: A flexible, rapid deployable perimeter monitoring system and method that employs distributed fiber optic sensing (DFOS) technologies and includes a deployment/operations field vehicle including an interrogator and analyzer/processor. The deployment/operations field vehicle is configured to field deploy a ruggedized fiber optic sensor cable in an arrangement that meets a specific application need, and subsequently interrogate/sense via DFOS any environmental conditions affecting the deployed fiber optic sensor cable. Such sensed conditions include mechanical vibration, acoustic, and temperature that may be advantageously sensed/evaluated/analyzed in the deployment/operations vehicle and subsequently communicated to a central location for further evaluation and/or coordination with other monitoring systems. Upon completion, the field vehicle and DFOS reconfigure a current location or redeployed to another location.
    Type: Application
    Filed: May 3, 2023
    Publication date: April 11, 2024
    Applicant: NEC LABORATORIES AMERICA, INC.
    Inventors: Philip JI, Christopher White, Ting WANG
  • Publication number: 20240116540
    Abstract: Provided are systems, methods, and computer program products for a distributed computing system for a vehicle. A vehicle (such as an autonomous vehicle) can have a hardware architecture including a master embedded system and multiple slave embedded systems. Each of the master and slave embedded systems can include, for example, a system on a chip (SoC). Each of the slave embedded systems can have multiple sensors of the vehicle assigned thereto, can process data generated by its assigned sensors, and can communicate an output of its processing to the master embedded system. The master embedded system can control timing of the slave embedded systems, such as by rotating sequentially through each of the slave embedded systems, such that timing of the sensors' data generating and processing can be controlled. Each of the slave embedded systems can communicate with the master embedded system via a high speed interface.
    Type: Application
    Filed: April 26, 2023
    Publication date: April 11, 2024
    Inventors: Ting Wang, Guillaume Binet, Alejandro Olivares, Sammy Omari
  • Publication number: 20240120932
    Abstract: Embodiments of the disclosure provide a circuit, chip, system, and method for eliminating random perturbation. The circuit includes a weight calculating module for receiving digital signals and random perturbation digital quantity, using least mean square error algorithm to calculate weight deviation iteration coefficient based on digital signal and digital quantity, and updating perturbation weight in real-time according to weight deviation iteration coefficient; and a perturbation eliminating module for eliminating perturbation signal in output digital signal of quantizer according to perturbation weight updated in real-time and updating perturbation weight in real-time according to weight deviation iteration coefficient, and then calculating current perturbation weight in real time to realize self-calibration of perturbation weight.
    Type: Application
    Filed: December 3, 2023
    Publication date: April 11, 2024
    Applicant: Chongqing GigaChip Technology Co., Ltd.
    Inventors: Yabo NI, Yong ZHANG, Xiaofeng SHEN, Ting LI, Lu LIU, Can ZHU, Jiahao PENG, Liang LI, Dongbing FU, Jianan WANG
  • Publication number: 20240117582
    Abstract: The embodiment of the present disclosure provides a recovery device for oil spilling on water, a control method thereof, and a recovery vessel. The recovery device includes a casing, a control center, a variable pressure airbag, an oil detector, an isolation layer, a water suction pump, and a drain pipe. The casing is of a hollow structure, the hollow structure is used to accommodate an oil-water mixture and used as a temporary oil collection tank, the upper part of the casing is provided with an oil-water mixture inlet, the bottom of the casing is provided with a drain port, and the side wall of the casting is provided with an oil suction port. The variable pressure airbag is arranged outside the casing, and the variable pressure airbag is configured to adjust buoyancy of the recovery device. The water suction pump is configured to pump out water in the casing and discharge water to a water environment outside the casing through the drain pipe.
    Type: Application
    Filed: June 9, 2023
    Publication date: April 11, 2024
    Applicant: CHANGZHOU UNIVERSITY
    Inventors: Hong JI, Jie GUO, Ke YANG, Juncheng JIANG, Zhixiang XING, Ting WANG
  • Publication number: 20240121939
    Abstract: A semiconductor device and a method of manufacturing the same are provided. The semiconductor device includes a substrate, a word line, a first capacitor, a second capacitor, a first bit line and a second bit line. The word line is disposed on the substrate and extends along a first direction. The first capacitor extends along a second direction different from the first direction and is located at a first level. The second capacitor extends along the second direction and is located at a second level different from the first level. The first bit line is electrically connected to the first capacitor and the word line. The second bit line is electrically connected to the second capacitor and the word line.
    Type: Application
    Filed: October 11, 2022
    Publication date: April 11, 2024
    Inventors: SHIH-FAN KUAN, HSU-CHENG FAN, JIANN-JONG WANG, CHUNG-HSIN LIN, YU-TING LIN
  • Publication number: 20240121940
    Abstract: A semiconductor device and a method of manufacturing the semiconductor device are provided. The semiconductor device includes a substrate, a word line, a first capacitor, a second capacitor, a first bit line and a second bit line. The word line is disposed on the substrate and extends along a first direction. The first capacitor extends along a second direction different from the first direction and is located at a first level. The second capacitor extends along the second direction and is located at a second level different from the first level. The first bit line is electrically connected to the first capacitor and the word line. The second bit line is electrically connected to the second capacitor and the word line.
    Type: Application
    Filed: July 13, 2023
    Publication date: April 11, 2024
    Inventors: SHIH-FAN KUAN, HSU-CHENG FAN, JIANN-JONG WANG, CHUNG-HSIN LIN, YU-TING LIN
  • Patent number: 11951120
    Abstract: This invention relates to the fields of mRNA vaccines, mRNA therapy, and gene therapy and specifically to the use of gene expression vectors or PCR amplicons containing various 5?UTR sequences followed by coding sequences for in vitro and in vivo production of mRNA or proteins of interest.
    Type: Grant
    Filed: December 7, 2022
    Date of Patent: April 9, 2024
    Inventors: Jaewoo Lee, Dehua Wang, Xiaoyao Hao, Yue Gao, Jie Liu, Shan He, Ting He, Dan Tse
  • Patent number: 11954097
    Abstract: The present disclosure provides a technical solution related to intelligent knowledge learning and question-answering. The technical solution involves extracting knowledge from corpus and providing a user with a question-answering service based on the extracted knowledge.
    Type: Grant
    Filed: February 27, 2019
    Date of Patent: April 9, 2024
    Assignee: Microsoft Technology Licensing, LLC
    Inventors: Yang Tian, Jianyong Wang, Peng Chen, Wei Wang, Ting Sun, Jie Zhang
  • Patent number: 11955370
    Abstract: A system and methods of forming a dielectric material within a trench are described herein. In an embodiment of the method, the method includes introducing a first precursor into a trench of a dielectric layer, such that portions of the first precursor react with the dielectric layer and attach on sidewalls of the trench. The method further includes partially etching portions of the first precursor on the sidewalls of the trench to expose upper portions of the sidewalls of the trench. The method further includes introducing a second precursor into the trench, such that portions of the second precursor react with the remaining portions of the first precursor to form the dielectric material at the bottom of the trench.
    Type: Grant
    Filed: September 18, 2020
    Date of Patent: April 9, 2024
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Bo-Cyuan Lu, Ting-Gang Chen, Sung-En Lin, Chunyao Wang, Yung-Cheng Lu, Chi On Chui, Tai-Chun Huang, Chieh-Ping Wang
  • Patent number: 11955154
    Abstract: A sense amplifier circuit includes a sense amplifier, a switch and a temperature compensation circuit. The temperature compensation circuit provides a control signal having a positive temperature coefficient, based on which the switch provides reference impedance for temperature compensation. The sense amplifier includes a first input end coupled to a target bit and a second input end coupled to the switch. The sense amplifier outputs a sense amplifier signal based on the reference impedance and the impedance of the target bit.
    Type: Grant
    Filed: May 16, 2022
    Date of Patent: April 9, 2024
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Cheng-Tung Huang, Jen-Yu Wang, Po-Chun Yang, Yi-Ting Wu, Yung-Ching Hsieh, Jian-Jhong Chen, Chia-Wei Lee