Abstract: Various arrangements for IC devices implementing memory with one access transistor for multiple capacitors are disclosed. An example IC device includes a memory array of M memory units, where each memory unit includes an access transistor and N capacitors coupled to the access transistor. A portion of the capacitors are formed in one or more layers above the access transistor, and a portion of the capacitors are formed in one or more layers below the access transistor. The capacitors in a particular memory unit may be coupled to a single via or to individual vias. In some embodiments, some of the vias are backside vias.

Abstract: IC devices with angled interconnects are disclosed herein. An interconnect, specifically a trench or line interconnect, is referred to as an “angled interconnect” if the interconnect is neither perpendicular nor parallel to any edges of front or back faces of the support structure, or if the interconnect is not parallel or perpendicular to interconnect in another region of an interconnect layer. Angled interconnects may be used to decrease the area of pitch transition regions. Angled interconnects may also be used to decrease the area of pitch offset regions.

Abstract: An example IC device formed using trim patterning as described herein may include a support structure, a first elongated structure (e.g., a first fin or nanoribbon) and a second elongated structure (e.g., a second fin or nanoribbon), proximate to an end of the first elongated structure. An angle between a projection of the first elongated structure on the support structure and an edge of the support structure may be between about 5 and 45 degrees, while an angle between a projection of the second elongated structure on the support structure and the edge of the support structure may be less than about 15 degrees.

Abstract: Hybrid manufacturing of access transistors for memory, presented herein, explores how IC components fabricated by different manufacturers may be combined in an IC device to achieve advantages in terms of, e.g., performance, density, number of active memory layers, fabrication approaches, and so on. In one aspect, an IC device may include a support, a first circuit over a first portion of the support, a second circuit over a second portion of the support, a scribe line between the first circuit and the second circuit, and one or more electrical traces extending over the scribe line. In another aspect, an IC device may include a support, a memory array, comprising a first circuit over a first portion of the support and one or more layers of capacitors over the first circuit, and a second circuit over a second portion of the support.

Abstract: Described herein are full wafer devices that include passive devices formed in one or more interconnect layers. Interconnect layers are formed over a front side of the full wafer device. A passive device is formed using an additive process that results in a seam running through the passive device. The seam may be, for example, an air gap, a change in material structure, or a region with a different chemical makeup from the surrounding passive device. In some embodiments, the passive devices are formed in global interconnect layers coupling multiple does of the full wafer device.

Abstract: Described herein are full wafer devices that include passive devices formed in a power delivery structure. Power is delivered to the full wafer device on a backside of the full wafer device. A passive device in a backside layer is formed using an additive process that results in a seam running through the passive device. The seam may be, for example, an air gap, a change in material structure, or a region with a different chemical makeup from the surrounding passive device.

Abstract: Described herein are full wafer devices that include interconnect layers on a back side of the device. The backside interconnect layers couple together different dies of the full wafer device. The backside interconnect layers include an active layer that includes active devices, such as transistors. The active devices may act as switches, e.g., to control routing of signals between different dies of the full wafer device.

Abstract: A nanoscale bolometer for infrared (IR) thermal imaging comprises a subwavelength antenna that provides a specific detectivity approaching a fundamental, thermodynamic limit. The uncooled nanobolometer achieves performance comparable to cooled, high-performance, semiconductor photodetectors, but with significantly reduced size, weight, power, and cost.

Abstract: A method for facilitating serialized data interchange and access via an application programming interface is provided. The method includes retrieving a data set from a networked repository, the data set including information in a multidimensional data structure; mapping the data set to a predetermined file format; generating a standardized data set based on a result of the mapping, the standardized data set corresponding to the predetermined file format; persisting the standardized data set in the networked repository; and exposing the standardized data set in the networked repository via the application programming interface.

Abstract: A method for facilitating automated enforcement of a data publication and usage contract is provided. The method includes capturing a data contract from data that is published by a data service provider, the data contract including a data contract element; converting the captured data contract into a predetermined file format; retrieving metadata that correspond to the data, the metadata including usage information that relates to a consumption of the data by a data consumer; validating the retrieved metadata based on the converted data contract; and automatically initiating an enforcement action based on a result of the validating.

Abstract: A computer implemented method includes turning off a sensor, receiving fall curve data from the sensor, and comparing the received fall curve data to a set of fall curve signatures to identify the sensor or a sensor fault.

Abstract: A method and a system for predicting traffic conditions of a geographical area are provided. Position information, received from devices of corresponding vehicles that are traversing between road segments of a road network including at least first and second road segments, is located on a directed graph of the road network. Further, first and second times are determined based on the located position information on the directed graph. A traffic time of the first road segment is determined based on an average of time differences of the first and second times of each of the one or more first vehicles after filtering out a time period between the first and second times. The traffic conditions of the road network are predicted based on the determined traffic time of each of the road segments.

Abstract: Systems, methods, and computer-executable instructions for scheduling neural network workloads on an edge device. A performance model for each neural network model is received. Parameters for each neural network workload is determined based on an associated performance model. Processing core assignments are determined from a plurality of processing cores for each neural network workload based on the corresponding performance model and processing core utilization. Image streams are received and associated with a neural network workload. Each neural network workload is scheduled to run on the processing cores based on the processing core assignments.

Abstract: An apparatus for making in-situ electrical measurements of a sample while the sample is subjected to a temperature gradient between a first side of the sample and a second side of the sample. The apparatus comprises a first heater and a second heater that are positioned in contact with the first side of the sample and the second side of the sample, respectively. The first heater and the second heater comprise respective faces that each have electrical contacts embedded therein. Electrical measurements pertaining to the sample can be made by way of the electrical contacts embedded in the faces. A temperature at either side of the sample can be monitored by way of thermocouples positioned inside the heaters in proximity to the faces of the heaters.

Abstract: A method and a system for predicting traffic conditions of a geographical area are provided. Position information, received from devices of corresponding vehicles that are traversing between road segments of a road network including at least first and second road segments, is located on a directed graph of the road network. Further, first and second times are determined based on the located position information on the directed graph. A traffic time of the first road segment is determined based on an average of time differences of the first and second times of each of the one or more first vehicles after filtering out a time period between the first and second times. The traffic conditions of the road network are predicted based on the determined traffic time of each of the road segments.

Abstract: A method and a system for location clustering for a transportation service are provided. A plurality of locations are clustered into a plurality of clusters, each having one or more locations of the plurality of locations. A graph is generated by connecting the plurality of clusters. A first cluster of the plurality of clusters is connected to one or more second clusters of the plurality of clusters that satisfy one or more threshold parameters. The graph is segmented into a plurality of fully-connected maximal sub-graphs based on one or more connections between the plurality of clusters. One or more fully-connected maximal sub-graphs of the plurality of fully-connected maximal sub-graphs have a set of common clusters. The plurality of fully-connected maximal sub-graphs are used for performing one or more transportation service operations of the transportation service.

Abstract: A method and a system for predicting traffic conditions of a geographical area are provided. A directed graph of a road network of the geographical area is generated. Position information, received from devices of corresponding vehicles that are traversing between road segments including at least first and second road segments, is located on the generated directed graph. Further, first and second times are determined based on the located position information on the generated directed graph. A traffic time of the first road segment is determined based on an average of time differences of the first and second times of each of the one or more first vehicles after filtering out a time period between the first and second times. The traffic conditions of the road network are predicted based on the determined traffic time of each of the road segments.

Abstract: A circuit or associated system or method comprises a first driver including a first transistor bank and a first resistor connected in series between a first predetermined voltage and an output pad, the first transistor bank including a first driver transistor and a plurality of first calibration transistors, wherein the plurality of first calibration transistors are respectively controlled based on a combination of bits of a first calibration code and on an output of at least one first logic gate.

Abstract: The present invention provides a forecasting engine with the ability to minimize prediction error in a preferred direction. It comprises of a receiver configured to receive training data samples. In addition, the forecasting engine includes a building module configured to build a base learner model from the training data samples. In addition, the forecasting engine includes a custom error function that emphasizes prediction error along a pre-configured direction. In addition, the forecasting engine includes an error determination module configured to determine the prediction error made by the base learner model. In addition, the forecasting engine includes an error minimization module configured to construct a new model that has lesser prediction error than the base learner model, where prediction error is as defined by the custom error function.

Abstract: A computer implemented method includes turning off a sensor, receiving fall curve data from the sensor, and comparing the received fall curve data to a set of fall curve signatures to identify the sensor or a sensor fault.