Abstract: A lighting system for an appliance is disclosed. In one embodiment, the lighting system includes a light shelf including a substantially planar light guide having a support member for releaseably coupling the light shelf to the appliance, a light injector coupled to a first end the light shelf, the light injector including a substrate having at least one light source disposed thereon and a housing for at least partially enclosing the at least one light source, wherein light emitted from the at least one light source is directed into the light guide, and an end piece coupled to a second end of the light shelf opposite the first end.

Abstract: A signature lighting system for an appliance includes a carrier, a light guide disposed adjacent the carrier, a light source disposed adjacent the light guide and in electrical communication with a source of electrical energy to selectively energize the light source, wherein the light source emits light into the light guide, and a light housing received in the carrier and substantially enclosing the light source, wherein at least one of the light housing and the carrier militates against a relative motion between the light guide and the carrier.

Abstract: A lighting system for an appliance is disclosed. In one embodiment, the lighting system includes a light shelf including a substantially planar light guide having a support member for releaseably coupling the light shelf to the appliance, a light injector coupled to a first end the light shelf, the light injector including a substrate having at least one light source disposed thereon and a housing for at least partially enclosing the at least one light source, wherein light emitted from the at least one light source is directed into the light guide, and an end piece coupled to a second end of the light shelf opposite the first end.

Abstract: Disclosed is an LED package holder for retaining and electrically connecting an LED package. The LED package holder includes a housing configured to hold an LED package and has at least one center opening defined therein. A connector shroud is integrally formed with the housing and has a cavity for receiving a connector operable to supply power to the LED package. Two contact features are retained by the housing, and each contact feature has an inner contact and an outer contact. Each inner contact engages an LED electric terminal of the LED package. Each outer contact extends into the connector shroud so as to engage connector terminals when a connector is inserted into the connector shroud.

Abstract: An LED package holder for holding and electrically connecting an LED package. The LED package holder includes a housing having an aperture defined therein and portions defining a recess. A plurality of contact features are retained by the housing and extend into the aperture. Each contact feature has an exposed portion configured to engage an LED electric terminal of an LED package that is received within the aperture. A heat sink, also retained by the housing, is at least partially located within the recess of the housing and configured to draw heat away from the LED package received within the aperture.

Abstract: An LED interconnect spring clip assembly includes a housing having a center cavity and a plurality of contact features. Each contact feature has a portion retained by the housing and another portion that is operable to contact a terminal of an LED package disposed within the center cavity of the housing. The LED interconnect spring clip assembly retains the LED package when mounted to a substrate.

Abstract: A substrate assembly for use in a lamp has a main printed wiring board and a standoff board. The main printed wiring board has a main surface with one or more LED packages disposed on the main surface and electrically connected thereto. The standoff board is disposed on the main surface of the main printed wiring board. The standoff board has an LED package disposed thereon and conductors to provide an electrical connection between the LED package disposed on the standoff board and the main printed wiring board.

Abstract: Disclosed is an LED package holder for retaining and electrically connecting an LED package. The LED package holder includes a housing configured to hold an LED package and has at least one center opening defined therein. A connector shroud is integrally formed with the housing and has a cavity for receiving a connector operable to supply power to the LED package. Two contact features are retained by the housing, and each contact feature has an inner contact and an outer contact. Each inner contact engages an LED electric terminal of the LED package. Each outer contact extends into the connector shroud so as to engage connector terminals when a connector is inserted into the connector shroud.

Abstract: An LED interconnect spring clip assembly includes a housing having a center cavity and a plurality of contact features. Each contact feature has a portion retained by the housing and another portion that is operable to contact a terminal of an LED package disposed within the center cavity of the housing. The LED interconnect spring clip assembly retains the LED package when mounted to a substrate.

Abstract: An assembly that includes two or more microelectronic modules in a self-sustaining structure that is adapted to be installed in a housing. The microelectronic modules are affixed to supports that are attached to ribs and arranged in parallel-spaced relationship. When the assembly is received in a housing, the ribs engage the inner wall of the housing to securely position the assembly. Also, the ribs space the microelectronic modules apart from the housing to facilitate coolant gas flow through the housing and thereby improve thermal dissipation during operation.

Abstract: A microelectronic package comprises microelectronic assemblies and a housing having a cylindrical outer wall. The microelectronic assemblies include electronic components mounted on a substrate and are affixed to support surfaces of the inner wall of the housing. The housing is preferably formed of semi-cylindrical sections that are joined along axial edges. The housing includes one or more axial channels interposed between the outer wall and the inner wall for conveying coolant gas. In this manner, the housing provides more uniform thermal dissipati9on of heat generated by the microelectronic assemblies during operation, despite variations in the thickness between the cylindrical outer wall and the support surfaces, which are preferably planar.

Abstract: An integrated vehicle structure includes an electronic site in a plastic support structure. The electronic site has a flexible substrate with electronic components mounted thereon. The plastic support structure defines a plastic mounting surface which includes a plurality of elongated ribs projecting from the plastic support structure. Each of the ribs have a side edge forming a portion of the plastic mounting surface. The flexible substrate is mounted to the plastic mounting surface, and a plurality of air flow passageways are defined by adjacent ribs in the flexible substrate. A method support structure may also be provided which defines a metal mounting surface. One or more electronic sides may be attached to the metal and plastic mounting surfaces.

Abstract: The present invention provides a system for conducting heat away from an electrical component wherein the system has an elastically deformable member providing thermal communication with an electrical component. The system for conducting heat energy in an electronic assembly includes an electrical component, an elastically deformable member, and a housing. The elastically deformable member is placed in a compressed position between the electrical component and the housing such that the elastically deformable member is fixed into an assembled location. The elastically deformable member conducts heat energy away from the electrical component into the housing where it is dissipated into the environment. Since the compressed position fixes the location of the elastically deformable member, the system does not require a mechanical fastening to the electrical component thereby reducing thermo-mechanical fatigue.

Abstract: The present invention provides a circuit board including a first conductor layer forming a plurality of conductive circuit traces for interconnecting electronic components. The circuit board includes a substrate for supporting the first conductor layer and a pedestal formed from the substrate for supporting at least one of the plurality of electronic components. The pedestal provides a heat conduction path for conducting heat away from the at least one of the plurality of electronic components and a aperture in the substrate adjacent the pedestal for allowing a fluid to pass through the substrate.

Abstract: An integrated manifold assembly (500) for routing electrical signals in an internal combustion engine is disclosed. The assembly includes an air-intake manifold (506) for drawing fresh air into the internal combustion engine, a main circuit portion (508) fixable to the air-intake manifold (506) of the internal combustion engine, a plurality of circuit runner portions (510) extending from the main circuit portion (508) for interconnecting the main circuit portion (508) with a plurality of engine components (512, 514), and a heat sink (517) affixed to the air-intake manifold (506) and in contact with at least one of the a main circuit portion (508) and the plurality of circuit runner portions (510) for dissipating heat generated in the circuit portions.

Abstract: An antenna system for receiving communication signals from satellites having plurality of subplates, a plurality of antenna nodes supported on the top surface of each subplate, and an electronic control unit to which the subplates are fixed and aligned and a collapsible support stand fixed to the bottom of the electronic control unit opposite the subplates in which the subplates, electronic control unit and stand interconnect to form an easily assembled lightweight antenna assembly that may be disassembled into easily portable components.

Abstract: A cockpit system for a motor vehicle integrates the electronics into the structure of the system. The cockpit system includes a cross car beam having a strip formed on the beam. The strip is defined by a planar surface structured to physically support a wiring system. Additional attachment features are provided to further support the wiring system.

Abstract: A microelectronic package comprises a tubular housing and a microelectronic assembly affixed to a support that is received in the housing. The support may be a cage-like structure that comprises axial ribs to which the microelectronic assembly is attached. Alternately, the support may comprise a solid surface for affixing a flexible substrate. The microelectronic assembly is arranged with a major surface facing and spaced apart from the inner wall of the housing. Thus, the microelectronic assembly is proximate to the wall to provide an optimum volume for packaging other components. Movement, the spacing between the microelectronic assembly and the tubular housing facilitates coolant gas flow during use to enhance thermal dissipation.

Abstract: A microelectronic package includes a flexible substrate and is adapted to be installed onto a support structure, which is preferably a nonplanar support structure. The package includes a frame that is affixed to a perimeter of a first portion of the flexible substrate and forms the substrate into a shape corresponding to the support structure. The package is installed so that the obverse surface of the flexible substrate is intimately against the support structure, so that the support structure not only reinforces the package to prevent damage, but also extracts heat generated during operation of the electronics.

Abstract: A flatwire assembly includes a pair of elongate flatwire segments that are interconnected with a thin, flexible patch that overlies the opposed longitudinal ends of the segments. Conductive traces on the bottom face of the patch are electrically connected to the respective conductive traces of the segments by solder layers that, upon reflow under heat and pressure, respectively extend past an edge of the patch, whereupon visual confirmation of the solder joints between the traces of the patch and the segment is readily obtained. A layer of a thermally-activated or pressure-sensitive adhesive is disposed between the patch and each segment to further mechanically couple the patch to each segment during solder reflow. Longitudinal extensions of the patch substrate are bonded by the adhesive layer to respective portions of the segments farther removed from the segment ends than the solder layer extensions provide enhanced strain relief.