Abstract: There is disclosed herein an electronic component 10 having an integral heat spreader 16 specially designed to assist in laser soldering of the heat spreader to a solder pad 22 on a substrate 20. The component 10 has a top surface 30, a bottom surface 32 generally parallel to the top surface, and at least one perimeter outer surface 34 generally orthogonal to and between the top and bottom surfaces. The component 10 comprises: a circuit portion 12; at least one termination 14 connected to the circuit portion 12 and extending outward therefrom; a heat spreader 16 portion situated generally beneath and in thermal contact with the circuit portion 12; and a body portion 18 enclosing at least a top surface of the circuit portion 12 and a part of each termination 14 proximate the circuit portion 12. The heat spreader 16 defines at least part of the bottom surface 32 of the electronic component 10 and at least part of the at least one perimeter outer surface 34 of the electronic component 10.

Abstract: There is disclosed herein a method for adhering metallizations to a substrate, comprising the steps of: (1) providing a substrate having a first surface; (2) applying a coating atop the first surface, such that the coating has a second surface bonded to the first surface, and a third surface generally conforming with the second surface; (3) etching away material from the third surface, so as to roughen and form pits in the third surface; and (4) attaching a metallization to the pits in the third surface by plating, sputtering, or similar means.

Abstract: A clip connector includes an elongated main body, attachment arms extending from the main body, and protrusions for applying pressure extending from the main body. The main body is substantially elongated and the attachment arms are at one at each end. Intermediate the attachment arms are a plurality of protrusions for creating pressure points having spaces there between and adapted to be aligned with electrical conductors so that pressure is applied to the electrical conductors and electrical connections can be made.

Abstract: A circuit-carrying automotive component and a method of manufacturing the same are provided. In a preferred embodiment of the invention, the component includes a substrate made from a polymer that is molten at a predetermined elevated temperature. The component further includes a circuit board which defines an aperture therethrough adapted to receive the molten polymer at the elevated temperature and a fastener formed from the molten polymer through the aperture. The fastener is integral with the substrate and mechanically secures the circuit board to the substrate. The circuit board is made from a material that is resistant to fusing with the molten polymer at the elevated temperature.

Abstract: A solder dispensing apparatus for depositing fluid solder into and around a pin-in-through-hole joining zone of an electronic circuit board which comprises:a valve assembly defining a valve chamber with an inlet and an outlet, and having the valve member actuated by the pin of said pin-in-through-hole joining zone when the valve is positioned at the zone against the board, the valve member moving from a first position closing off fluid flow from the outlet to a second position permitting fluid flow through the outlet; means for measuring a predetermined body of fluid solder that is released from the chamber when said valve member is in the second position with the assembly positioned at the zone against the board; and means to contain the released fluid solder in a predetermined shape and in and around the pin-in-through-hole joining zone while the solder solidifies.

Abstract: A three dimensional multi-layer circuit structure is formed by partially etching a foil having a coating. A pre-circuit is formed by providing a metal foil, applying a photodefinable photoresist to each side of the metal foil, selectively exposing and developing the photoresist leaving exposed areas and unexposed areas and, plating the unexposed areas with a second metal. The pre-circuit is placed in an etching solution and removed after the etching solution partially etches the metal foil to undercut the second metal. The partially etched pre-circuit is then bent into a predetermined shape. The partially etched pre-circuit is then inserted into a mold cavity so that at least one surface of the circuit structure is adjacent to the mold. The mold is filled with a polymer resin so that the polymer resin encapsulates at least a portion of the partially etched pre-circuit and substantially fills the undercut.

Abstract: A polymer substrate is plated with a metal, using metallic filler particles in the polymer as anchorage points for a layer of metal formed by an electroless plating operation. The polymer has a filler that includes non-metallic filler particles and metallic filler particles; the non-metallic filler particles contiguous to the polymer surface can be etched away, so as to expose metallic filler particles proximate to the etched surfaces. The exposed metallic filler particles serve as anchorage points for the electroless plate layer.

Abstract: An apparatus and method for soldering components to a circuit board. The apparatus includes a conveyor in a tunnel for transporting the board through a preheat zone, molten waves of solder including a turbulent wave and a laminar wave, and a cool down zone through which the board passes upon exit from the laminar flow wave of the solder wave. The improvement comprises at least one distributing manifold mounted in the tunnel having an inlet port for receiving a cold gas under pressure and at least one outlet nozzle for directing the cold gas to the circuit board, thereby rapidly cooling the circuit board and the components.

Abstract: An on-board chip package has a hermetically sealed connector mechanically secured to a printed wiring board and electrically connected to input/output pads on the board. Chip dies are mechanically bonded to the board and then individually encapsulated with a suitable potting material. The entire assembly is coated with an encapsulating polymer, which partially overlaps the inboard side of the hermetic connector housing and which provides a relatively smooth, crevice-free outer surface. The entire assembly is then covered, in the preferred embodiment, with a metal layer, to hermetically seal the entire chip-on-board assembly.

Abstract: Method of efficiently refiow soldering one or more devices to a printed circuit board with a convective heating oven, each device having a plurality of plate supported electronic connecting pins that are to be soldered within respective mating openings of the printed circuit board for electronic connection, the method comprising: (i) placing a solder paste in each of the openings; (ii) assembling the device to the circuit board by positioning the plate of the device along, but spaced in relation to, the printed circuit board to define a planar space therebetween, with the pins extending into such openings and into the soldered paste to thereby form an assembly; and (iii) passing the assembly through the convective heating oven for a time period to melt the solder paste and form a solid connection upon removal of the convective heat, said passing being carried out by use of convective heat focusing features that guide the convective heat flow between the plate and board to enhance convective heating of the sol

Abstract: A process of manufacturing a flexible metallized polymer film cover which provides environmental protection of electronic assemblies such as circuit card assemblies which are susceptible to external environmental factors which can impede functional performance and reduce reliability. The use of a metallized polymer film in the form of a two layer film, with two intimately bonded layers one being electrically insulative and the other metallic, provides environmental and electrical protection of the enclosed assembly.

Abstract: A flexible metallized polymer film cover provides environmental protection of electronic assemblies such as circuit card assemblies which are susceptible to external environmental factors which can impede functional performance and reduce reliability. The fully integrated cover provides this protection and also allows for circuit repair and rework in such a manner as to make cover removal and reseal economically attractive. The use of a metallized polymer film in the form of a two layer film, with two intimately bonded layers one being electrically insulative and the other metallic, provides environmental and electrical protection of the enclosed assembly. The variables of film materials and thicknesses allow for specific cover designs to be fabricated to meet various requirements for assembly protection. The flexible film nature of the cover allows for strict conformance to underlying devices and less dimension and weight for the assembly.

Abstract: A localized soldering station is described that uses the vapor phase reflow principle. A container has of a medium selected because of the temperature at which it changes to a vapor. A heated conduit maintains the vapor state while conveying the vapor to a work location where a module with a part to be removed or attached by solder connections is supported. A transparent, quartz nozzle confines the vapor to the part and its solder connections and is positioned accurately by a unit that includes a guide light. Vapor will lose its latent heat of vaporization upon contact with the part and its solder connections, causing the solder to reflow and change back to a liquid, which is collected for reuse. When in a standby or ready condition, vapor is conveyed up through a shutoff valve through cooling fins where it changes back to a liquid and returns to the container, avoiding loss.