Abstract: A method of making a circuitized substrate which may be utilized as a chip carrier structure. The method involves the steps of providing a dielectric member and routing out a preselected portion of the base member to form an aperture. Metallization of the dielectric member and the walls of the aperture then occurs, followed by circuitization of the surfaces of the dielectric member. Direct metallization of the aperture walls eliminates many manufacturing steps previously required to metallize the aperture walls.

Abstract: A method of making a circuitized substrate wherein a chip-accommodating cavity is formed along with a plurality of conductive elements (e.g., pads, lines, etc.) which form part of the substrate's circuitry. Metallization is provided over the elements and, significantly, on the internal surfaces of the formed cavity to thereby enhance the electrical properties of the finished product, e.g., by assuring a solid, continuous path between upper and lower surfaces of the product.

Abstract: A method provides for additive plating on a subcomposite having filled plated through holes. Fine-line circuitry is achieved via electroless deposition onto a dielectric substrate after the through hole is plated and filled. Fine-line circuitry may be routed over landless, plated through holes thereby increasing the aspect ratio and the available surface area for additional components and wiring.

Abstract: A method of recovering benzyl alcohol, gamma butyrolactone, or propylene carbonate from an impure effluent stream of an industrial process is provided. The effluent waste stream contains greater than about 10 percent by weight of monomeric units that are reacted to form larger oligomers and polymers. The first step in the recovery process involves polymerizing the monomeric units present in the effluent waste stream under conditions effective to reduce the concentration of monomeric units in the waste stream to less than about 10 weight percent. The waste stream then is fed to a first separation stage where it is separated into (i) a gaseous stream of water, soluble gases, and volatile contaminants and (ii) a suspension comprising the high boiling solvent, semi-volatile materials, and non-volatile contaminants and materials. Then the dewatered, low vapor pressure, high boiling solvent-containing suspension is either distilled or evaporated to separate the high boiling solvent from non-volatile materials.

Abstract: A method of recovering solvents from an impure effluent stream of an industrial process. The effluent waste stream contains less than about 10 percent by weight of monomeric units that are reacted to form larger oligomers and polymers. The waste stream contains dissolved polymers, polymeric particles, and the hydrolysis, oxidation and/or other decomposition products of one of the solvents. In one embodiment, the first step involves filtering particulate matter from the waste stream. In another embodiment, the filtering step is omitted. The filtered or unfiltered waste stream is fed to a first separation stage for separation into (i) a gaseous stream of water, soluble gases, and volatile contaminants and (ii) a suspension comprising the solvent, water, semi-volatile and non-volatile contaminants, and photoresist products.

Abstract: A method is disclosed for using the simple, environmentally friendly organic compounds gamma-butyrolactone and benzyl alcohol to develop and to strip free radical-initiated, addition polymerizable resists, cationically cured resists and solder masks and Vacrel photoresists. In all cases the developers and strippers include gamma butyrolactone or benzyl alcohol. The developers and strippers optionally also include a minor amount of methanol, ethanol, isopropyl alcohol, propylene glycol monomethylacetate, ethylene glycol monomethyl ether, formamide, nitromethane, propylene oxide, or methyl ethyl ketone, acetone and water. During development of the photopatterned resist or solder mask, the unpolymerized regions are dissolved in the disclosed developers. During stripping of the resist or solder mask, the polymerized regions are debonded from a circuit board in the disclosed strippers.

Abstract: A method is disclosed for using the simple, environmentally-friendly organic compounds gamma-butyrolactone and benzyl alcohol to develop and to strip free radical-initiated, addition polymerizable resists, cationically cured resists and solder masks and Vacrel photoresists. In all cases the developers and strippers include gamma butyrolactone or benzyl alcohol. The developers and strippers optionally also include a minor amount of methanol, ethanol, isopropyl alcohol, propylene glycol monomethylacetate, ethylene glycol monomethyl ether, formamide, nitromethane, propylene oxide, or methyl ethyl ketone, acetone and water. During development of the photopatterned resist or solder mask, the unpolymerized regions are dissolved in the disclosed developers. During stripping of the resist or solder mask, the polymerized regions are debonded from a circuit board in the disclosed strippers.

Abstract: Disclosed is a printed circuit board and a method of preparing the printed circuit board, The printed circuit board has two types of plated through holes. The first type of plated through holes extend to and through an exterior surface of the printed circuit board for receipt of a pin-in-through-hole module or component pin. The second type of plated through holes are for surface mount technology and terminate below the exterior surface of the printed circuit board. These plated through holes contain a fill composition.

Abstract: Disclosed is a printed circuit board and a method of preparing the printed circuit board. The printed circuit board has two types of plated through holes. The first type of plated through holes extend to and through an exterior surface of the printed circuit board for receipt of a pin-in-through-hole module or component pin. The second type of plated through holes are for surface mount technology and terminate below the exterior surface of the printed circuit board. These plated through holes contain a fill composition.

Abstract: Disclosed is a method of drilling, desmearing, and additively circuitizing a printed circuit board. The printed circuit board is drilled under conditions which produce glass and polymer smeared vias and through holes. The particulate debris is removed by vapor blasting the drilled printed circuit board. Next the printed circuit board is soaked in a solvent to swell the drill smear on the circuit interplanes of the printed circuit board. This solvent is then removed by entrainment in a gas, and a stream of an aqueous, acidic, oxidizing solution is passed through the printed circuit board holes to remove swollen smear in the thru holes and produce an etchback of conductors. After a water rinse an aqueous reducing solution is passed through the printed circuit board to reduce and remove aqueous acidic oxidizing solution, e.g., residual aqueous acid oxidizing solution. The printed circuit board is rinsed to remove the aqueous reducing solution.

Abstract: Disclosed is a method of thermally stabilizing an effluent stream from an industrial process, such as a photolithographic process, to allow thermally manageable recovery of the solvent. In the separation and recovery process the solvent is exposed to temperatures that can cause polymerization of the relatively small amounts of monomer still contained therein. This polymerization is an exothermic polymerization, which can accelerate the polymerization of the remaining monomer, potentially causing a thermally initiated, exothermic, run away polymerization. Run away, thermally initiated, exothermic polymerization can materially degrade the solvent. The thermally initiated, run away exothermic reaction is inhibited by the inclusion of a thermal stabilizer or polymerization inhibitor.

Abstract: Disclosed is a method of recovering a cyclic alkylene carbonate, such as propylene carbonate, from an effluent stream of a process in which the cyclic alkylene carbonate removes an organic photoresist material from a substrate. The effluent is a cyclic alkylene carbonate effluent, e.g., a propylene carbonate effluent, of the carbonate, water, and polymeric solids. In the recovery process the cyclic alkylene carbonate effluent is fed to a heat exchanger, and separated into (i) water and volatiles, and (ii) cyclic carbonate. This lowers the concentration of water in the cyclic alkylene carbonate to a level that is low enough to substantially avoid hydrolysis of cyclic alkylene carbonate to the corresponding glycol. The dewatered cyclic alkylene carbonate is evaporated to separate the cyclic alkylene carbonate from high boiling materials and polymeric solids. The dewatered cyclic alkylene carbonate is separated into (i) a cyclic alkylene carbonate fraction, and (ii) a photoresist solids fraction.

Abstract: Simple, environmentally friendly developers and strippers are disclosed for free radical-initiated, addition polymerizable resists, cationically cured resists and solder masks and Vacrel photoresists. In all cases both the developers and the strippers include gamma butyrolactone, propylene carbonate and benzyl alcohol, optionally also including a minor amount of methanol, ethanol, isopropyl alcohol, propylene glycol monomethylacetate, ethylene glycol monomethyl ether, formamide, nitromethane, propylene oxide, or methyl ethyl ketone, acetone and water.

Abstract: An electrode array containing individual electrode segments having means to electrically bias each of the segments individually and to control the quantity of current supplied to each of the electrode segments individually; and use of the array.

Abstract: A stripping composition containing O-dichlorobenzene, dodecylbenzene sulfonic acid, perchloroethylene, and optionally an aromatic hydrocarbon containing at least 8 carbon atoms, and use thereof for removing photoresist.

Abstract: A fibrous substrate is coated with a hydrolyzed aminosilane. The aminosilane is hydrolyzed in an aqueous solution having a pH of 3.4 to 3.7. The substrate is useful for preparing fiber reinforced plastics such as prepreg polyepoxide substrates. Improved adhesion between the fibrous substrate and the polymer is obtained.

Abstract: Woven glass cloth and method of its manufacture suitable for use as a resin-impregnated substrate for printed circuits in which the major dimension or transverse axis of the elliptical warp yarns exceeds a predetermined fraction of that dimension of the fill yarns of the woven cloth. Multi-filament warp yarns are typically subjected to tensile stress during weaving and firing such that the yarn compaction prevents the thorough impregnation by a resin. The result is that voids are maintained along the innermost filaments of the yarn. These voids, when filled with materials other than resin, such as plating solution, ultimately produce circuit failures.

Abstract: Woven glass fiber cloth for printed circuit substrates in which the warp is of plied yarn and the fill is of unplied or twisted yarn to facilitate more thorough polymeric resin impregnation and achieve improved dimensional stability.