Abstract: A method of manufacturing a part includes printing a layer of 3D printable material, positioning a layer of interlay material on the layer of 3D printable material, and printing another layer of 3D printable material on the layer of interlay material. A manufactured part includes a base layer of 3D printable material and a plurality of pairs of alternating layers disposed on the base layer of 3D printable material. Each pair of the plurality of pairs includes a layer of interlay material and another layer of 3D printable material printed on the layer of interlay material. The layers of interlay material provide at least one property to the manufactured part not provided by the layers of 3D printable material.

Abstract: A method of manufacturing a printed circuit board assembly includes providing a circuit board, positioning a plurality of components including at least one thermally-sensitive component having a maximum temperature threshold on the circuit board, positioning a customized protective heat shield on the thermally-sensitive component, exposing the circuit board (having the thermally-sensitive component disposed thereon and the customized protective heat shield disposed on the thermally-sensitive component) to a high-temperature environment wherein temperatures exceed the maximum temperature threshold of the thermally-sensitive component, and removing the customized protective heat shield from the thermally-sensitive component. Customized protective heat shields are also provided.

Abstract: A method of manufacturing a pallet for use during manufacture of a printed circuit board assembly includes determining optimal solder flow for establishing connections between lead pins of a plurality of pin-through-hole components arranged on a circuit board, designing a pallet to include geometries configured to provide the optimal solder flow when the pallet, supporting the circuit board thereon, is passed through a wave solder machine, and creating the pallet based on the design. Pallets configured for optimal solder flow and methods of manufacturing printed circuit board assemblies using such pallet are also provided.

Abstract: An electronic pressure sensor array has a plurality of conductive electrodes and interconnects selectively formed on a pressure sensor substrate to form a plurality of individual pressure sensor assemblies. The individual pressure sensor assemblies can be aligned in various configurations to form the electronic pressure sensor array. Each pressure sensor assembly is made of a plurality of layers including a pressure sensor substrate, insulating layers on either side of the pressure sensor substrate, and conductive ink layers on an outer surface of each insulating layer. A cavity is formed in each insulating layer, the cavity in one insulating layer being vertically aligned with the cavity in the other insulating layer, and conductive ink fills each cavity to form electrodes.

Abstract: A conductive fabric includes a fabric with one or more electrically conductive wire braids woven into the fabric. The one or more wire braids are woven into the fabric such that one or more portions of each wire braid are exposed at one or more surfaces of the fabric, the exposed portions of the wire braid forming connection pads. Each connection pad provides an electrical connection point for attachment to a complementary electrical connection point on an electronic component, such as a bond pad, solder bump, or connection lead. A single wire braid can be used to electrically interconnect multiple electronic components. Multiple wire braids can be arranged, with appropriate spacing and alignment of exposed portions, to electrically interconnect multiple electronic components with multiple electrical interconnects between one or more electronic components. Each electrically conductive wire braid includes a plurality of individual electrically conductive wires braided together.

Abstract: A method of manufacturing a part includes printing a layer of 3D printable material, positioning a layer of interlay material on the layer of 3D printable material, and printing another layer of 3D printable material on the layer of interlay material. A manufactured part includes a base layer of 3D printable material and a plurality of pairs of alternating layers disposed on the base layer of 3D printable material. Each pair of the plurality of pairs includes a layer of interlay material and another layer of 3D printable material printed on the layer of interlay material. The layers of interlay material provide at least one property to the manufactured part not provided by the layers of 3D printable material.

Abstract: A method of manufacturing a printed circuit board assembly includes providing a circuit board, positioning a plurality of components including at least one thermally-sensitive component having a maximum temperature threshold on the circuit board, positioning a customized protective heat shield on the thermally-sensitive component, exposing the circuit board (having the thermally-sensitive component disposed thereon and the customized protective heat shield disposed on the thermally-sensitive component) to a high-temperature environment wherein temperatures exceed the maximum temperature threshold of the thermally-sensitive component, and removing the customized protective heat shield from the thermally-sensitive component. Customized protective heat shields are also provided.

Abstract: A method of manufacturing a pallet for use during manufacture of a printed circuit board assembly includes determining optimal solder flow for establishing connections between lead pins of a plurality of pin-through-hole components arranged on a circuit board, designing a pallet to include geometries configured to provide the optimal solder flow when the pallet, supporting the circuit board thereon, is passed through a wave solder machine, and creating the pallet based on the design. Pallets configured for optimal solder flow and methods of manufacturing printed circuit board assemblies using such pallet are also provided.

Abstract: A method of manufacturing a pallet for use during manufacture of a printed circuit board assembly includes determining optimal solder flow for establishing connections between lead pins of a plurality of pin-through-hole components arranged on a circuit board, designing a pallet to include geometries configured to provide the optimal solder flow when the pallet, supporting the circuit board thereon, is passed through a wave solder machine, and creating the pallet based on the design. Pallets configured for optimal solder flow and methods of manufacturing printed circuit board assemblies using such pallet are also provided.

Abstract: Methods of and devices for coupling metal woven mesh or metal woven fabric with IC components to make flexible circuits are disclosed. The flexible circuits can be used to make wearable electronic devices, such as a garment with embedded IC chip.

Abstract: An electroluminescent display is flexible and stretchable, and therefore able to be attached to a textile. All interior layers of the electroluminescent display can be made using a screen printing process which can be scaled for volume production.

Abstract: A mechanism is described for facilitating stretchable and self-healing solders in microelectronics manufacturing environments. An apparatus of embodiments, as described herein, includes one or more solders associated with a microelectronics component, where the one or more solders contain a liquid metal and are wrapped in an encapsulation material. The apparatus further includes a substrate coupled to the one or more solders.

Abstract: A mechanism is described for facilitating controlled cavitation of medicines and cosmetics. A method of embodiments, as described herein, includes facilitating, by one or more processors of a controlled cavitation device, controlled cavitation dispersion for de-agglomeration of a compound that is agglomerated and represents a mixture of ingredients associated with a medical drug or a cosmetic item. The method may further include generating the medical drug or the cosmetic item based on the controlled cavitation dispersion of the compound.

Abstract: A flexible and stretchable chain battery includes multiple individual batteries connected in parallel and/or in series via stretchable conductive interconnects. The positive terminals of each battery are connected to a first stretchable conductive interconnect and the negative terminals of each battery are connected to a second stretchable conductive interconnect. The stretchable conductive interconnects and the batteries are coupled to a stretchable substrate. The stretchable conductive interconnects provide electrical interconnection between the multiple batteries while enabling stretchability between the batteries.

Abstract: An electronic module assembly and method of assembling an electronic module to a conductive fabric are provided. An electronic module assembly comprises a non-conductive fabric and a conductive fabric covering at least part of a first side of the non-conductive fabric. An electronics module is disposed on the conductive fabric, and a portion of the electronics module includes a wall defining a through hole. A fastener passing through the through hole and passing through the conductive fabric is configured to electronically couple the electronics module to the conductive fabric.

Abstract: A method and apparatus for forming a circuit on an uneven two-dimensional (2-D) or three-dimensional (3-D) surface of an object is described. An amount of electrically conductive material to form a circuit between two points on the object is determined. The determined amount of electrically conductive material is deposited on a first surface of a stretchable substrate. The stretchable substrate with the deposited electrically conductive material is applied to the object to form a circuit between two points on the object.

Abstract: Methods of making a copper interconnect plated through hole assembly are disclosed. Nano copper ink dispersed in an organic solvent is able to be filled in the plated through hole and forming the copper interconnect by sintering at a temperature below the melting of the copper.

Abstract: A structure for a core layer of a substrate and a method for fabricating a core layer of a substrate are disclosed. The core layer comprises a molding compound encapsulating a die or a plurality of dies, a dielectric layer on the surfaces of the molding compound, and a conductive layer on top of the dielectric layer. A through hole is formed through the dielectric layer and the molding compound, which may be filled with a metal plate. A laser via is formed similarly. Build-up layers may be assembled next to the core layer to form the substrate, which can be used to package dies.

Abstract: An electronic module assembly and method of assembling an electronic module to a conductive fabric are provided. An electronic module assembly comprises a non-conductive fabric and a conductive fabric covering at least part of a first side of the non-conductive fabric. An electronics module is disposed on the conductive fabric, and a portion of the electronics module includes a wall defining a through hole. A fastener passing through the through hole and passing through the conductive fabric is configured to electronically couple the electronics module to the conductive fabric.

Abstract: A structure for a core layer of a substrate and a method for fabricating a core layer of a substrate are disclosed. The core layer comprises a molding compound encapsulating a die or a plurality of dies, a dielectric layer on the surfaces of the molding compound, and a conductive layer on top of the dielectric layer. A through hole is formed through the dielectric layer and the molding compound, which may be filled with a metal plate. A laser via is formed similarly. Build-up layers may be assembled next to the core layer to form the substrate, which can be used to package dies.