Patents by Inventor Anwar A. Mohammed
Anwar A. Mohammed has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20140070406Abstract: Polyimide-based redistribution layers (RDLs) can be employed to reduce thermo-mechanical stress that is exerted on conductive interconnections bonded to interposers in 2.5 D semiconductor packaging configurations. The polyimide-based RDL is located on an upper or lower face of an interposer. Additionally, height differentials between laterally adjacent semiconductor dies in 2.5 D semiconductor packages can be reduced or eliminated by using different diameter micro-bumps, different height copper pillars, or a multi-tiered interposer to lower taller semiconductor dies in relation to shorter semiconductor dies.Type: ApplicationFiled: May 17, 2013Publication date: March 13, 2014Inventors: Anwar A. Mohammed, Weifeng Liu, Rui Niu
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Patent number: 8604609Abstract: A semiconductor package includes a curved body and a plurality of semiconductor die. The curved body includes first and second opposing end regions and an intermediate center region. The curved body has a first inflection point at the center region, a second inflection point at the first end region and a third inflection point at the second end region. The center region has a convex curvature with a minimal extremum at the first inflection point, the first end region has a concave curvature with a maximal extremum at the second inflection point and the second end region has a concave curvature with a maximal extremum at the third inflection point. The plurality of semiconductor die are attached to an upper surface of the curved body between the maximal extrema.Type: GrantFiled: October 18, 2012Date of Patent: December 10, 2013Assignee: Infineon Technologies AGInventors: Anwar A. Mohammed, Soon Ing Chew, Donald Fowlkes, Alexander Komposch, Benjamin Pain-Fong Law, Michael Opiz Real
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Patent number: 8537553Abstract: In accordance with an embodiment of the present invention, a device includes a circuit board with a thermally conductive core layer and a chip disposed over the circuit board. The device further includes a heat sink disposed over the chip. The thermal conductivity of the heat sink along a first direction is larger than a thermal conductivity along a second direction. The first direction is perpendicular to the second direction. The heat sink is thermally coupled to the thermally conductive core layer.Type: GrantFiled: March 24, 2011Date of Patent: September 17, 2013Assignee: Futurewei Technologies, Inc.Inventors: Anwar Mohammed, Renzhe Zhao
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Patent number: 8519543Abstract: A multi-die integrated circuit assembly includes an interposer substrate larger than the typical reticle size used in fabricating the “active area” in which the through-silicon vias (TSVs) and interconnect conductors are formed in the interposer. At the same time, each of the dies has its external power/ground and I/O signal line connections concentrated into a smaller area of the die. The dies are disposed or mounted on the interposer such that these smaller areas (with the power/ground/IO connections) overlap with the active area of the interposer. In this configuration, a plurality of dies having a combined area substantially greater than the active area of the interposer can be mounted on the interposer (and take advantage of the active area for interconnections).Type: GrantFiled: July 17, 2012Date of Patent: August 27, 2013Assignee: Futurewei Technologies, Inc.Inventors: Haoyu Song, Cao Wei, Rui Niu, Anwar A. Mohammed
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Publication number: 20130186676Abstract: A structure for a core layer of a substrate and a method for fabricating a core layer of a substrate are disclosed. The core layer comprises a molding compound encapsulating a die or a plurality of dies, a dielectric layer on the surfaces of the molding compound, and a conductive layer on top of the dielectric layer. A through hole is formed through the dielectric layer and the molding compound, which may be filled with a metal plate. A laser via is formed similarly. Build-up layers may be assembled next to the core layer to form the substrate, which can be used to package dies.Type: ApplicationFiled: January 20, 2012Publication date: July 25, 2013Applicant: FutureWei Technologies, Inc.Inventors: Fei Yu, Anwar A. Mohammed, Rui Niu
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Publication number: 20120299173Abstract: A package-on-package (PoP) device is provided. The device includes a first package with a first chip mounted on a first substrate, a heat spreader stacked on the first package, the heat spreader in thermal contact with the first chip, and a second package stacked on the heat spreader. In an embodiment, the heat spreader is formed using carbon fibers to provide good lateral thermal conductivity. In an embodiment, ends of the heat spreader project beyond a periphery of the first and second packages.Type: ApplicationFiled: April 13, 2012Publication date: November 29, 2012Applicant: FutureWei Technologies, Inc.Inventors: Anwar A. Mohammed, Weifeng Liu
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Patent number: 8314487Abstract: A semiconductor package includes a curved body and a plurality of semiconductor die. The curved body includes first and second opposing end regions and an intermediate center region. The curved body has a first inflection point at the center region, a second inflection point at the first end region and a third inflection point at the second end region. The center region has a convex curvature with a minimal extremum at the first inflection point, the first end region has a concave curvature with a maximal extremum at the second inflection point and the second end region has a concave curvature with a maximal extremum at the third inflection point. The plurality of semiconductor die are attached to an upper surface of the curved body between the maximal extrema.Type: GrantFiled: December 18, 2009Date of Patent: November 20, 2012Assignee: Infineon Technologies AGInventors: Anwar A. Mohammed, Soon Ing Chew, Donald Fowlkes, Alexander Komposch, Benjamin Pain-Fong Law, Michael Opiz Real
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Publication number: 20120206882Abstract: In accordance with an embodiment of the present invention, a device includes a circuit board with a thermally conductive core layer and a chip disposed over the circuit board. The device further includes a heat sink disposed over the chip. The thermal conductivity of the heat sink along a first direction is larger than a thermal conductivity along a second direction. The first direction is perpendicular to the second direction. The heat sink is thermally coupled to the thermally conductive core layer.Type: ApplicationFiled: March 24, 2011Publication date: August 16, 2012Applicant: FutureWei Technologies, Inc.Inventors: Anwar Mohammed, Renzhe Zhao
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Publication number: 20120104582Abstract: According to an embodiment of a high power package, the package includes a heat sink containing enough copper to have a thermal conductivity of at least 350 W/mK, an electrically insulating attached to the heat sink with an epoxy and a semiconductor chip attached to the heat sink on the same side as the lead frame with an electrically conductive material having a melting point of 280° C. or greater.Type: ApplicationFiled: January 5, 2012Publication date: May 3, 2012Applicant: INFINEON TECHNOLOGIES AGInventors: Anwar A. Mohammed, Julius Chew, Donald Fowlkes
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Patent number: 8110445Abstract: According to an embodiment of a high power package, the package includes a copper heat sink, a ceramic lead frame and a semiconductor chip. The copper heat sink has a thermal conductivity of at least 350 W/mK. The ceramic lead frame is attached to the copper heat sink with an epoxy. The semiconductor chip is attached to the copper heat sink on the same side as the lead frame with an electrically conductive material having a melting point of about 280° C. or greater.Type: GrantFiled: May 6, 2009Date of Patent: February 7, 2012Assignee: Infineon Technologies AGInventors: Anwar A. Mohammed, Soon Ing Chew, Donald Fowlkes
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Patent number: 8013429Abstract: An air cavity package is manufactured by attaching a die to a surface of a copper heat sink, dispensing a bead of epoxy around a periphery of the heat sink surface after the die is attached to the copper heat sink so that the bead of epoxy generally surrounds the die and placing a ceramic window frame on the bead of epoxy. The epoxy is cured to attach a bottom surface of the ceramic window frame to the copper heat sink.Type: GrantFiled: July 14, 2009Date of Patent: September 6, 2011Assignee: Infineon Technologies AGInventors: Anwar A. Mohammed, Soon Ing Chew, Alexander Komposch, Christian Andrada
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Publication number: 20110147921Abstract: A semiconductor package includes a curved body and a plurality of semiconductor die. The curved body includes first and second opposing end regions and an intermediate center region. The curved body has a first inflection point at the center region, a second inflection point at the first end region and a third inflection point at the second end region. The center region has a convex curvature with a minimal extremum at the first inflection point, the first end region has a concave curvature with a maximal extremum at the second inflection point and the second end region has a concave curvature with a maximal extremum at the third inflection point. The plurality of semiconductor die are attached to an upper surface of the curved body between the maximal extrema.Type: ApplicationFiled: December 18, 2009Publication date: June 23, 2011Applicant: INFINEON TECHNOLOGIES NORTH AMERICA CORP.Inventors: Anwar A. Mohammed, Soon Ing Chew, Donald Fowlkes, Alexander Komposch, Benjamin Pain-Fong Law, Michael Opiz Real
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Publication number: 20110012254Abstract: An air cavity package is manufactured by attaching a die to a surface of a copper heat sink, dispensing a bead of epoxy around a periphery of the heat sink surface after the die is attached to the copper heat sink so that the bead of epoxy generally surrounds the die and placing a ceramic window frame on the bead of epoxy. The epoxy is cured to attach a bottom surface of the ceramic window frame to the copper heat sink.Type: ApplicationFiled: July 14, 2009Publication date: January 20, 2011Applicant: INFINEON TECHNOLOGIES NORTH AMERICA CORP.Inventors: Anwar A. Mohammed, Julius Chew, Alexander Komposch, Christian Andrada
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Publication number: 20100283134Abstract: According to an embodiment of a high power package, the package includes a copper heat sink, a ceramic lead frame and a semiconductor chip. The copper heat sink has a thermal conductivity of at least 350 W/m K. The ceramic lead frame is attached to the copper heat sink with an epoxy. The semiconductor chip is attached to the copper heat sink on the same side as the lead frame with an electrically conductive material having a melting point of about 280° C. or greater.Type: ApplicationFiled: May 6, 2009Publication date: November 11, 2010Applicant: Infineon Technologies North America Corp.Inventors: Anwar A. Mohammed, Julius Chew, Donald Fowlkes
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Patent number: 7608860Abstract: Light emitting device die having a mesa configuration on a substrate and an electrode on the mesa are attached to a submount in a flip-chip configuration by forming predefined pattern of conductive die attach material on at least one of the electrode and the submount and mounting the light emitting device die to the submount. The predefined pattern of conductive die attach material is selected so as to prevent the conductive die attach material from contacting regions of having opposite conductivity types when the light emitting device die is mounted to the submount. The predefined pattern of conductive die attach material may provide a volume of die attach material that is less than a volume defined by an area of the electrode and a distance between the electrode and the submount. Light emitting device dies having predefined patterns of conductive die attach material are also provided.Type: GrantFiled: July 2, 2007Date of Patent: October 27, 2009Assignees: Cree, Inc., Cree Microwave, LLCInventors: David B. Slater, Jr., Jayesh Bharathan, John Edmond, Mark Raffetto, Anwar Mohammed, Peter S. Andrews, Gerald H. Negley
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Patent number: 7341175Abstract: Bonding of flip-chip mounted light emitting devices having an irregular configuration is provided. Light emitting diodes having a shaped substrate are bonded to a submount by applying forces to the substrate an a manner such that shear forces within the substrate do not exceed a failure threshold of the substrate. Bonding a light emitting diode to a submount may be provided by applying force to a surface of a substrate of the light emitting diode that is oblique to a direction of motion of the light emitting diode to thermosonically bond the light emitting diode to the submount. Collets for use in bonding shaped substrates to a submount and systems for bonding shaped substrates to a submount are also provided.Type: GrantFiled: April 27, 2004Date of Patent: March 11, 2008Assignee: Cree, Inc.Inventors: David B. Slater, Jr., Jayesh Bharathan, John Edmond, Mark Raffetto, Anwar Mohammed, Peter S. Andrews, Gerald H. Negley
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Publication number: 20070241360Abstract: Light emitting device die having a mesa configuration on a substrate and an electrode on the mesa are attached to a submount in a flip-chip configuration by forming predefined pattern of conductive die attach material on at least one of the electrode and the submount and mounting the light emitting device die to the submount. The predefined pattern of conductive die attach material is selected so as to prevent the conductive die attach material from contacting regions of having opposite conductivity types when the light emitting device die is mounted to the submount. The predefined pattern of conductive die attach material may provide a volume of die attach material that is less than a volume defined by an area of the electrode and a distance between the electrode and the submount. Light emitting device dies having predefined patterns of conductive die attach material are also provided.Type: ApplicationFiled: July 2, 2007Publication date: October 18, 2007Inventors: David Slater, Jr., Jayesh Bharathan, John Edmond, Mark Raffetto, Anwar Mohammed, Peter Andrews, Gerald Negley
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Patent number: 7259033Abstract: Light emitting device die having a mesa configuration on a substrate and an electrode on the mesa are attached to a submount in a flip-chip configuration by forming predefined pattern of conductive die attach material on at least one of the electrode and the submount and mounting the light emitting device die to the submount. The predefined pattern of conductive die attach material is selected so as to prevent the conductive die attach material from contacting regions of having opposite conductivity types when the light emitting device die is mounted to the submount. The predefined pattern of conductive die attach material may provide a volume of die attach material that is less than a volume defined by an area of the electrode and a distance between the electrode and the submount. Light emitting device dies having predefined patterns of conductive die attach material are also provided.Type: GrantFiled: August 17, 2004Date of Patent: August 21, 2007Assignees: Cree, Inc., Cree Microwave, LLCInventors: David B. Slater, Jr., Jayesh Bharathan, John Edmond, Mark Raffetto, Anwar Mohammed, Peter S. Andrews, Gerald H. Negley
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Publication number: 20070029664Abstract: Flexible, adhesive materials are used to secure integrated circuit package components together. The die is secured to the heat sink, the ringframe to the heat sink and the leadframe to the ringframe, using epoxy materials that flex over the operational temperature range of the circuit package. The flexibility of the adhesives accommodates large differences in expansion and contraction of CTE-mismatched materials. The heat sink and ringframe materials are neither restricted to CTE-compatible materials nor to materials that are compatible with high-temperature attachment processes. Adhesive mounting of the die avoids the use of lead-based solders used in typical assembly processes.Type: ApplicationFiled: August 5, 2005Publication date: February 8, 2007Inventors: Anwar Mohammed, Joseph Hornung
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Patent number: 6888167Abstract: Light emitting device die having a mesa configuration on a substrate and an electrode on the mesa are attached to a submount in a flip-chip configuration by forming predefined pattern of conductive die attach material on at least one of the electrode and the submount and mounting the light emitting device die to the submount. The predefined pattern of conductive die attach material is selected so as to prevent the conductive die attach material from contacting regions of having opposite conductivity types when the light emitting device die is mounted to the submount. The predefined pattern of conductive die attach material may provide a volume of die attach material that is less than a volume defined by an area of the electrode and a distance between the electrode and the submount. Light emitting device dies having predefined patterns of conductive die attach material are also provided.Type: GrantFiled: June 27, 2002Date of Patent: May 3, 2005Assignees: Cree, Inc., Cree Microwave, Inc.Inventors: David B. Slater, Jr., Jayesh Bharathan, John Edmond, Mark Raffetto, Anwar Mohammed, Peter S. Andrews, Gerald H. Negley