Abstract: Provided is a circuit assembly in which the mounting area of a substrate can be increased. A circuit assembly includes an electronic component having a plurality of terminals, a conductive member for supporting the electronic component (10), at least one of the terminals of the electronic component being electrically connected to the conductive member, and a substrate provided with a conductive pattern to which another terminal of the electronic component is electrically connected, in which the substrate is fixed to a surface of the conductive member that is opposite to a surface of the conductive member that supports the electronic component.

Abstract: A circuit assembly includes an electronic component including a plurality of terminals, a first board that is constituted by an insulating plate provided with a conductive path and an insertion hole into which the electronic component is inserted, a busbar that overlaps the first board, and a second board that is constituted by an insulating plate provided with a conductive path and overlapping the first board, at least a portion of the second board being arranged on the same level as the busbar. The plurality of terminals of the electronic component is connected to the busbar and the conductive path of the second board.

Abstract: Provided is a substrate unit configured to improve heat dissipation efficiency while preventing workability from degrading at the time of assembly. A substrate unit includes: a substrate that has one surface on having a conductive pattern, and includes an opening; a conductive member that includes a main portion is fixed to the other surface of the substrate, and at least one terminal of an electronic component is electrically connected via the opening; and a heat dissipation member is fixed to a surface of the conductive member opposite a substrate side surface thereof, wherein the conductive member is provided with an extension portion that extends from the main portion of the conductive member and to which an external device is to be electrically connected, the extension portion intersecting a plane that extends along the heat dissipation member.

Abstract: Provided is a circuit assembly that does not require e.g. bending of a terminal of an electronic component. A circuit assembly includes an electronic component that is to be mounted is connected to a conductive member through a first opening in a state in which its main body is disposed on one side of a substrate covering at least a part of the first opening formed in the substrate, and a first terminal is connected to a conductive pattern (a land) of the substrate, and a second terminal is connected to the conductive member through a second opening formed in the substrate.

Abstract: Provided is a circuit assembly having a new structure in which a busbar circuit unit overlapped with a printed circuit board can reliably be fixed regardless of the heating temperature during soldering of an electrical component. In a circuit assembly in which a busbar circuit unit is overlapped with and fixed to a printed circuit board, the busbar circuit unit is configured as one piece by busbars being buried between insulator layers, and a section of the busbars is exposed via a through-hole of the insulator layer. The insulator layer of the busbar circuit unit is overlapped with the printed circuit board and is fixed thereto via fixing means, and terminal sections of an electrical component are soldered to and mounted on the exposed section of the busbar circuit unit and a printed wiring of the printed circuit board.

Abstract: Provided is a substrate unit that has a simple structure and is able to prevent water that has entered the inside from reaching a mounting surface of the substrate. The substrate unit includes: a substrate, a first casing member that supports the substrate, and a second casing member that is integrated into one piece with the first casing member and is provided on a mounting surface side of the substrate, wherein the second casing member is provided with a protruding portion that protrudes into a housing space that is defined by the first casing member and the second casing member and houses the substrate, and intersects a plane that extends along the mounting surface of the substrate.

Abstract: Provided is a substrate unit configured to improve heat dissipation efficiency while preventing workability from degrading at the time of assembly. A substrate unit includes: a substrate that has one surface on having a conductive pattern, and includes an opening; a conductive member that includes a main portion is fixed to the other surface of the substrate, and at least one terminal of an electronic component is electrically connected via the opening; and a heat dissipation member is fixed to a surface of the conductive member opposite a substrate side surface thereof, wherein the conductive member is provided with an extension portion that extends from the main portion of the conductive member and to which an external device is to be electrically connected, the extension portion intersecting a plane that extends along the heat dissipation member.

Abstract: A case is provided with a drainage channel that smoothly drains water while also being able to suppress the intrusion of water into a housing space. The case includes a first case body in which a channel extending from a region serving as the housing space is formed. The channel includes a first channel portion having one end side connected to a first outlet and another end side connected to a second outlet, and a second channel portion connects the first channel portion and the housing space. Out of the opening edges of the second channel portion that face the first channel portion, a second-side opening edge, which is the edge on the second outlet side of the first channel portion, is located nearer to the housing space than a first-side opening edge, which is the edge on the first outlet side of the first channel portion, is.

Abstract: Provided is a substrate unit that has an excellent heat dissipation capability. A substrate unit includes: a substrate having a conductive pattern formed on one surface thereof, the substrate being provided with an opening; a conductive member that includes a main portion that is fixed to the other surface of the substrate, and to which at least one terminal of an electronic component is electrically connected via the opening that is formed in the substrate; and a heat dissipation member with which an extension portion that extends from the main portion of the conductive member is in contact.

Abstract: The present invention provides a case having a simple structure capable of suppressing the intrusion of water through a drainage channel. The case includes a first case body in which a channel that extends from a region serving as a first space is formed, and a second case body that is integrated with the first case body. A slit is formed in an outer wall portion of the second case body, and the channel formed in the first case body is continuous with at least a portion of the slit formed in the second case body. A lock piece portion for integration with the first case is formed on the outer wall portion of the second case body, and the lock piece portion has a cantilevered shape due to being defined by the slit.

Abstract: A circuit structure is provided to which an electronic component can be easily mounted (electrical connection of terminals). A circuit structure that includes a substrate provided with a conductive pattern on one face, a conductive member fixed to another face of the substrate, and an electronic component that has first terminals and, which are a portion of a plurality of terminals, electrically connected to the conductive member, and a terminal, which is a portion of the plurality of terminals, electrically connected to the conductive pattern provided on the substrate, wherein the conductive member has a shape in which at least a portion of the second terminal of the electronic component is not overlapped.

Abstract: A circuit structure is provided to which an electronic component can be easily mounted (electrical connection of terminals). A circuit structure that includes a substrate provided with a conductive pattern on one face thereof; a conductive member fixed to the other face of the substrate; an electronic component that has first terminals and of a plurality of terminals, that are electrically connected to the conductive member, and a second terminal of the plurality of terminals that is electrically connected to the conductive pattern provided on the substrate; and a relay member for electrically connecting the second terminal and the conductive pattern provided on the substrate, at least a portion of the relay member being fixed to the conductive member via an insulating material.

Abstract: A circuit assembly includes a circuit board, a heat dissipation member on which the circuit board is placed and that is configured to release heat of the circuit board, an insulating layer that is formed on a surface on the circuit board side of the heat dissipation member, a bonding portion made of a bonding agent that is arranged in a predetermined region between the circuit board and the heat dissipation member, and an adhesive portion that is arranged in a region other than the predetermined region between the circuit board and the heat dissipation member and that is made of an adhesive with which the circuit board and the heat dissipation member are bonded to each other with lower bonding force than with the bonding agent.

Abstract: Provided is a circuit assembly that can suppress deterioration of its heat releasing capability caused by a pit formed by the formation of a protruding portion that enters an opening formed in a substrate. Provided is a manufacturing method with which such a circuit assembly can be produced easily. A conductive member is provided with a protruding portion that enters an opening formed in a substrate and to which a terminal of an electronic component is connected, a pit formed by formation of the protruding portion is covered by a base member for supporting the conductive member, and an embedding member having a heat conductivity higher than that of air is provided inside the pit.

Abstract: Provided is a circuit assembly that does not require e.g. bending of a terminal of an electronic component. A circuit assembly includes an electronic component that is to be mounted is connected to a conductive member through a first opening in a state in which its main body is disposed on one side of a substrate covering at least a part of the first opening formed in the substrate, and a first terminal is connected to a conductive pattern (a land) of the substrate, and a second terminal is connected to the conductive member through a second opening formed in the substrate.

Abstract: Provided is a circuit assembly having a new structure in which a busbar circuit unit overlapped with a printed circuit board can reliably be fixed regardless of the heating temperature at the time of soldering of an electrical component. In a circuit assembly in which a busbar circuit unit constituted by a plurality of busbars is overlapped with a printed circuit board having a printed wiring and is fixed thereto via an adhesive sheet, the plurality of busbars are adhered to the surface of the adhesive sheet in a state in which the busbars are arranged adjacently and spaced apart by gaps, and the gaps between the busbars are filled with the adhesive agent. With the adhesive agent, press-cut surfaces of the busbars and at least one of the adhesive sheet and the printed circuit board that is exposed from the gaps between the busbars is adhered.

Abstract: Provided is a circuit assembly having a new structure in which a busbar circuit unit overlapped with a printed circuit board can reliably be fixed regardless of the heating temperature at the time of soldering of an electrical component. In a circuit assembly in which a busbar circuit unit constituted by a plurality of busbars is overlapped with a printed circuit board having a printed wiring and is fixed thereto via an adhesive sheet, the plurality of busbars are adhered to the surface of the adhesive sheet in a state in which the busbars are arranged adjacently and spaced apart by gaps, and the gaps between the busbars are filled with the adhesive agent. With the adhesive agent, press-cut surfaces of the busbars and at least one of the adhesive sheet and the printed circuit board that is exposed from the gaps between the busbars is adhered.

Abstract: Provided is a circuit assembly having a new structure in which a busbar circuit unit overlapped with a printed circuit board can reliably be fixed regardless of the heating temperature during soldering of an electrical component. In a circuit assembly in which a busbar circuit unit is overlapped with and fixed to a printed circuit board, the busbar circuit unit is configured as one piece by busbars being buried between insulator layers, and a section of the busbars is exposed via a through-hole of the insulator layer. The insulator layer of the busbar circuit unit is overlapped with the printed circuit board and is fixed thereto via fixing means, and terminal sections of an electrical component are soldered to and mounted on the exposed section of the busbar circuit unit and a printed wiring of the printed circuit board.