Patents by Inventor Arvind K. Sinha

Arvind K. Sinha has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9853375
    Abstract: A pin attach converter for coupling an electrical contact to a printed circuit board may include a compliant region having a first length adapted to traverse an aperture in a printed circuit board and provide mechanical and electrical registry with at least one wall of the aperture. The pin attach converter may also include an adapter region coupled to the compliant region, and having a cavity with a second length and adapted to receive the electrical contact, where the second length extends along a same longitudinal axis as the first length, and the cavity is adapted to provide mechanical and electrical registry with the electrical contact.
    Type: Grant
    Filed: December 16, 2016
    Date of Patent: December 26, 2017
    Assignee: International Business Machines Corporation
    Inventors: Phillip V. Mann, Mark D. Plucinski, Sandra J. Shirk/Heath, Arvind K. Sinha
  • Patent number: 9843152
    Abstract: A method and system for a dynamic keying system is disclosed. The method and system can include a male connector device having a first plurality of settings for one or more key features, and a female connector device having a second plurality of settings for one or more key features. The female connector device can be configured to operate in an initial mode in which it is configured to, in response to the introduction of the male connector device, correspond a first setting of the first plurality of settings to a second setting of the second plurality of settings. The female connector device can also be configured to operate in a subsequent mode, in which it can permit coupling with at least one male connector device having the first setting and consistently deny access to at least one male connector device having a third setting different than the first setting.
    Type: Grant
    Filed: January 24, 2014
    Date of Patent: December 12, 2017
    Assignee: International Business Machines Corporation
    Inventors: Phillip V. Mann, Mark D. Plucinski, Sandra J. Shirk/Heath, Arvind K. Sinha
  • Patent number: 9835384
    Abstract: A heat pipe includes one or more reservoirs of liquid that are closed at lower temperatures and open at higher temperatures. The opening of the reservoirs at higher temperatures caused by higher power levels dynamically increases the amount of liquid in the heat pipe, which increases performance of the heat pipe at higher power levels. As the heat pipe cools, the liquid condenses and flows back into the reservoirs. As the heat pipe continues to cool, the reservoirs close. The result is a heat pipe that is more efficient at lower power levels and still maintains high efficiency at higher power levels due to the demand-based charging of the liquid based on temperature.
    Type: Grant
    Filed: October 13, 2015
    Date of Patent: December 5, 2017
    Assignee: International Business Machines Corporation
    Inventors: William J. Anderl, Bret P. Elison, Phillip V. Mann, Arvind K. Sinha
  • Patent number: 9726837
    Abstract: Light can be transmitted between a light source and a light detector or target by using at least two mating connector sections of a light pipe connector. A protrusion of one of the connector sections is designed to be received within a receptacle of another of the connector sections, which can make the light pipe connector mechanically compliant. The two connector sections are fabricated from an optically transmissive material, and have optically reflective surfaces in orthogonal orientations to optically transmissive surfaces adjacent to the light source and the light detector. When the protrusion of one of the connector sections is engaged within the receptacle of another connector section, light can be transmitted through optically transmissive surfaces adjacent to a light source and a light detector, while the orthogonally oriented optically reflective surfaces direct light towards the light detector.
    Type: Grant
    Filed: October 22, 2015
    Date of Patent: August 8, 2017
    Assignee: International Business Machines Corporation
    Inventors: Phillip V. Mann, Kevin M. O'Connell, Arvind K. Sinha, Karl Stathakis, Kory W. Weckman
  • Patent number: 9721855
    Abstract: A method for aligning a chip onto a substrate is disclosed. The method includes, depositing a ferrofluid, onto a substrate that has one or more pads that electrically couple to a semiconductor layer. The method can include a chip with solder balls electrically coupled to the logic elements of the chip, which can be placed onto the deposited ferrofluid, where the chip is supported on the ferrofluid, in a substantially coplanar orientation to the substrate. The method can include determining if the chip is misaligned from a desired location on the substrate. The method can include adjusting the current location of the chip in response to determining that the solder balls of the chip are misaligned from the desired location on the pads of the substrate, until the chip is aligned in the desired location.
    Type: Grant
    Filed: December 12, 2014
    Date of Patent: August 1, 2017
    Assignee: International Business Machines Corporation
    Inventors: Joseph Kuczynski, Phillip V. Mann, Kevin M. O'Connell, Arvind K. Sinha, Karl Stathakis
  • Publication number: 20170102190
    Abstract: A heat pipe includes a reservoir of liquid that is connected to a horizontal portion of the heat pipe via a capillary connection. The heat pipe includes a temperature sensor in proximity to a heat interface in the horizontal portion and a controller that controls a heater for the reservoir. As power into the heat pipe increases, the controller turns on the heater, causing the temperature of the liquid in the reservoir to rise. Liquid then passes from the reservoir through the capillary connection into the horizontal portion, thereby dynamically increasing the amount of liquid in the heat pipe, which increases performance of the heat pipe at higher power levels. When the heater is off, as the heat pipe cools, the liquid condenses and flows back through the capillary connection into the reservoir. The result is a heat pipe that provides demand-based charging of the liquid based on power level.
    Type: Application
    Filed: February 16, 2016
    Publication date: April 13, 2017
    Inventors: William J. Anderl, Bret P. Elison, Phillip V. Mann, Arvind K. Sinha
  • Publication number: 20170104284
    Abstract: A pin attach converter for coupling an electrical contact to a printed circuit board may include a compliant region having a first length adapted to traverse an aperture in a printed circuit board and provide mechanical and electrical registry with at least one wall of the aperture. The pin attach converter may also include an adapter region coupled to the compliant region, and having a cavity with a second length and adapted to receive the electrical contact, where the second length extends along a same longitudinal axis as the first length, and the cavity is adapted to provide mechanical and electrical registry with the electrical contact.
    Type: Application
    Filed: December 16, 2016
    Publication date: April 13, 2017
    Inventors: Phillip V. Mann, Mark D. Plucinski, Sandra J. Shirk/Heath, Arvind K. Sinha
  • Publication number: 20170102189
    Abstract: A heat pipe includes one or more reservoirs of liquid that are closed at lower temperatures and open at higher temperatures. The opening of the reservoirs at higher temperatures caused by higher power levels dynamically increases the amount of liquid in the heat pipe, which increases performance of the heat pipe at higher power levels. As the heat pipe cools, the liquid condenses and flows back into the reservoirs. As the heat pipe continues to cool, the reservoirs close. The result is a heat pipe that is more efficient at lower power levels and still maintains high efficiency at higher power levels due to the demand-based charging of the liquid based on temperature.
    Type: Application
    Filed: February 16, 2016
    Publication date: April 13, 2017
    Inventors: William J. Anderl, Bret P. Elison, Phillip V. Mann, Arvind K. Sinha
  • Publication number: 20170102187
    Abstract: A heat pipe includes one or more reservoirs of liquid that are closed at lower temperatures and open at higher temperatures. The opening of the reservoirs at higher temperatures caused by higher power levels dynamically increases the amount of liquid in the heat pipe, which increases performance of the heat pipe at higher power levels. As the heat pipe cools, the liquid condenses and flows back into the reservoirs. As the heat pipe continues to cool, the reservoirs close. The result is a heat pipe that is more efficient at lower power levels and still maintains high efficiency at higher power levels due to the demand-based charging of the liquid based on temperature.
    Type: Application
    Filed: October 13, 2015
    Publication date: April 13, 2017
    Inventors: William J. Anderl, Bret P. Elison, Phillip V. Mann, Arvind K. Sinha
  • Publication number: 20170102188
    Abstract: A heat pipe includes a reservoir of liquid that is connected to a horizontal portion of the heat pipe via a capillary connection. The heat pipe includes a temperature sensor in proximity to a heat interface in the horizontal portion and a controller that controls a heater for the reservoir. As power into the heat pipe increases, the controller turns on the heater, causing the temperature of the liquid in the reservoir to rise. Liquid then passes from the reservoir through the capillary connection into the horizontal portion, thereby dynamically increasing the amount of liquid in the heat pipe, which increases performance of the heat pipe at higher power levels. When the heater is off, as the heat pipe cools, the liquid condenses and flows back through the capillary connection into the reservoir. The result is a heat pipe that provides demand-based charging of the liquid based on power level.
    Type: Application
    Filed: October 13, 2015
    Publication date: April 13, 2017
    Inventors: William J. Anderl, Bret P. Elison, Phillip V. Mann, Arvind K. Sinha
  • Publication number: 20170090129
    Abstract: Light can be transmitted between a light source and a light detector or target by using at least two mating connector sections of a light pipe connector. A protrusion of one of the connector sections is designed to be received within a receptacle of another of the connector sections, which can make the light pipe connector mechanically compliant. The two connector sections are fabricated from an optically transmissive material, and have optically reflective surfaces in orthogonal orientations to optically transmissive surfaces adjacent to the light source and the light detector. When the protrusion of one of the connector sections is engaged within the receptacle of another connector section, light can be transmitted through optically transmissive surfaces adjacent to a light source and a light detector, while the orthogonally oriented optically reflective surfaces direct light towards the light detector.
    Type: Application
    Filed: October 22, 2015
    Publication date: March 30, 2017
    Inventors: Phillip V. Mann, Kevin M. O'Connell, Arvind K. Sinha, Karl Stathakis, Kory W. Weckman
  • Patent number: 9609744
    Abstract: Printed circuit boards (PCBs) can be designed to have dynamic warp characteristics complimentary to those of an attached component. A PCB and an attached component can be designed to dynamically warp, during a thermal excursion, in the same direction and with approximately the same magnitude of warp. Warp characteristics of the PCB and the attached component can be determined by the vertical thickness of conductor and dielectric layers, by the wiring density and number of conductor layers. Warp characteristics can also be at least partially determined by the arrangement/ordering of conductor and dielectric layers, by dimensions of a sash structure surrounding a component outline and by dimensions of a prepreg layer applied to an existing design. Such a prepreg layer can cover a portion or an entirety of one of the PCBs planar surfaces.
    Type: Grant
    Filed: March 24, 2015
    Date of Patent: March 28, 2017
    Assignee: International Business Machines Corporation
    Inventors: Mark K. Hoffmeyer, Amanda E. Mikhail, Arvind K. Sinha
  • Patent number: 9590329
    Abstract: A pin attach converter for coupling an electrical contact to a printed circuit board may include a compliant region having a first length adapted to traverse an aperture in a printed circuit board and provide mechanical and electrical registry with at least one wall of the aperture. The pin attach converter may also include an adapter region coupled to the compliant region, and having a cavity with a second length and adapted to receive the electrical contact, where the second length extends along a same longitudinal axis as the first length, and the cavity is adapted to provide mechanical and electrical registry with the electrical contact.
    Type: Grant
    Filed: June 8, 2015
    Date of Patent: March 7, 2017
    Assignee: International Business Machines Corporation
    Inventors: Phillip V. Mann, Mark D. Plucinski, Sandra J. Shirk/Heath, Arvind K. Sinha
  • Publication number: 20170017733
    Abstract: In an example, a method includes storing thermoset resin rheology data associated with a thermoset resin at a memory. The thermoset resin rheology data includes a plurality of sets of dynamic fluid flow properties that are measured for the thermoset resin. The method includes receiving, at a computing device, information associated with a printed circuit board (PCB) laminate design. The method also includes receiving, at the computing device, a first set of PCB lamination parameters. The method further includes storing, at the computing device, a first thermoset resin flow model. The first thermoset resin flow model is generated based on the thermoset resin rheology data, the information associated with the PCB laminate design, and the first set of PCB lamination parameters.
    Type: Application
    Filed: July 14, 2015
    Publication date: January 19, 2017
    Inventors: Joseph Kuczynski, Arvind K. Sinha, Kevin A. Splittstoesser, Timothy J. Tofil
  • Patent number: 9523432
    Abstract: A method includes rotating a first elongated, inlet-side member of an air valve toward an open configuration when a fan blade is rotating and rotating the first inlet-side member to toward a closed configuration when the fan blade is not rotating. The air valve includes a frame and a sheet of thin material. The frame may have an outlet-side member configured to be mounted on a fan housing and the inlet-side member rotatably coupled to the outlet-side member. The material may have top and bottom edges, and a plurality of folds perpendicular to the top and bottom side edges that divide the sheet into a plurality of sections. The material may be attached to the outlet-side member and the inlet-side member, and configurable between folded and expanded positions.
    Type: Grant
    Filed: September 30, 2015
    Date of Patent: December 20, 2016
    Assignee: International Business Machines Corporation
    Inventors: William J. Anderl, Bret P. Elison, Phillip V. Mann, Arden L. Moore, Arvind K. Sinha
  • Publication number: 20160359246
    Abstract: A pin attach converter for coupling an electrical contact to a printed circuit board may include a compliant region having a first length adapted to traverse an aperture in a printed circuit board and provide mechanical and electrical registry with at least one wall of the aperture. The pin attach converter may also include an adapter region coupled to the compliant region, and having a cavity with a second length and adapted to receive the electrical contact, where the second length extends along a same longitudinal axis as the first length, and the cavity is adapted to provide mechanical and electrical registry with the electrical contact.
    Type: Application
    Filed: June 8, 2015
    Publication date: December 8, 2016
    Inventors: Phillip V. Mann, Mark D. Plucinski, Sandra J. Shirk/Heath, Arvind K. Sinha
  • Patent number: 9508614
    Abstract: A method for aligning a chip onto a substrate is disclosed. The method includes, depositing a ferrofluid, onto a substrate that has one or more pads that electrically couple to a semiconductor layer. The method can include a chip with solder balls electrically coupled to the logic elements of the chip, which can be placed onto the deposited ferrofluid, where the chip is supported on the ferrofluid, in a substantially coplanar orientation to the substrate. The method can include determining if the chip is misaligned from a desired location on the substrate. The method can include adjusting the current location of the chip in response to determining that the solder balls of the chip are misaligned from the desired location on the pads of the substrate, until the chip is aligned in the desired location.
    Type: Grant
    Filed: December 17, 2014
    Date of Patent: November 29, 2016
    Assignee: International Business Machines Corporation
    Inventors: Joseph Kuczynski, Phillip V. Mann, Kevin M. O'Connell, Arvind K. Sinha, Karl Stathakis
  • Patent number: 9494752
    Abstract: A method and structure are provided for implementing a dual optical and electrical land grid array (LGA) contact. A contact for electrical and optical connection between a module and a printed circuit board (PCB) includes material providing electrical connection and an integrated material providing an optical connection; and the contact is used in a land grid array (LGA) arrangement.
    Type: Grant
    Filed: April 28, 2015
    Date of Patent: November 15, 2016
    Assignee: International Business Machines Corporation
    Inventors: Phillip V. Mann, Kevin M. O'Connell, Arvind K. Sinha, Karl Stathakis
  • Patent number: 9482833
    Abstract: Light can be transmitted between a light source and a light detector or target by using at least two mating connector sections of a light pipe connector. A protrusion of one of the connector sections is designed to be received within a receptacle of another of the connector sections, which can make the light pipe connector mechanically compliant. The two connector sections are fabricated from an optically transmissive material, and have optically reflective surfaces in orthogonal orientations to optically transmissive surfaces adjacent to the light source and the light detector. When the protrusion of one of the connector sections is engaged within the receptacle of another connector section, light can be transmitted through optically transmissive surfaces adjacent to a light source and a light detector, while the orthogonally oriented optically reflective surfaces direct light towards the light detector.
    Type: Grant
    Filed: September 24, 2015
    Date of Patent: November 1, 2016
    Assignee: International Business Machines Corporation
    Inventors: Phillip V. Mann, Kevin M. O'Connell, Arvind K. Sinha, Karl Stathakis, Kory W. Weckman
  • Patent number: 9482349
    Abstract: An air valve includes a frame and a sheet of thin material. The frame may have an outlet-side member configured mounted on a fan housing and an inlet-side member rotatably coupled to the outlet-side member. The material may have top and bottom edges, and a plurality of folds perpendicular to the top and bottom side edges that divide the sheet into a plurality of sections. The material may be attached to the outlet-side member and the inlet-side member, and configurable between folded and expanded positions. An attraction between a magnetic component on the inlet-side member and a magnetic component on a rotating fan blade may cause the inlet-side member to rotate, moving the material into the folded configuration. When the fan blade is not rotating, a spring attached at a pivot point may cause the inlet-side member to rotate in an opposite direction, moving the material into the expanded position.
    Type: Grant
    Filed: January 9, 2014
    Date of Patent: November 1, 2016
    Assignee: International Business Machines Corporation
    Inventors: William J. Anderl, Bret P. Elison, Phillip V. Mann, Arden L. Moore, Arvind K. Sinha