Abstract: An electronic module is provided in which a chip is disposed over a substrate and electrically connected to the substrate by a plurality of electrical connect structures disposed between the chip and the substrate. A heat distributor, fabricated of a thermally conductive material, is disposed between the chip and the substrate and sized to extend beyond an edge of the chip to facilitate conduction of heat laterally out from between the chip and substrate. The heat distributor includes openings sized and positioned to allow the electrical connect structures to pass through the heat distributor without electrically contacting the heat distributor. The heat distributor is electrically isolated from the electrical connect structures, the chip and the substrate. In one implementation, the heat distributor physically contacts a thermally conductive enclosure of the electronic module to facilitate conduction of heat from between the chip and substrate to the enclosure.

Abstract: A continuous loop of thermally conductive material is provided with a first portion in frictional contact with a casing of an electronic device and a second portion located within a cooling region. The loop is advanced such that the first portion is located within the cooling region and the second portion is in frictional contact with the casing.

Abstract: A continuous loop of thermally conductive material is provided with a first portion in frictional contact with a casing of an electronic device and a second portion located within a cooling region. The loop is advanced such that the first portion is located within the cooling region and the second portion is in frictional contact with the casing.

Abstract: The chip stack of semiconductor chips with enhanced cooling apparatus includes a first chip with circuitry on a first side and a second chip electrically and mechanically coupled to the first chip by a grid of connectors. The apparatus further includes a thermal interface material pad placed between the first chip and the second chip, wherein the thermal interface material pad includes nanofibers aligned parallel to mating surfaces of the first chip and the second chip. The method includes creating a first chip with circuitry on a first side and creating a second chip electrically and mechanically coupled to the first chip by a grid of connectors. The method further includes placing a thermal interface material pad between the first chip and the second chip, wherein the thermal interface material pad includes nanofibers aligned parallel to mating surfaces of the first chip and the second chip.

Abstract: An electrical connector system for mitigating corrosion and maintaining an internal environment conducive for connectivity and the protection of internal electrical contacts is disclosed. The electrical system can include a female connector device designed to couple with a male connector device, and to enclose a chamber containing a corrosion deterring fluid. One or more electrical contacts can be located within the chamber, and be configured to interface with connecting members of a male connector device. The electrical connector system can also include one or more sealing gates configured to act as a sealing membrane that is designed to separate the corrosion deterring fluid in the chamber from fluid external to the chamber while allowing the connecting members of the male connector device to be inserted through the gates and into the chamber.

Abstract: A method for designing structures with complimentary dynamic warp characteristics for attachment of a component to a PC board is disclosed. The method may include determining characteristics of thermally induced dynamic warp of the PC board and of the first component, analyzing and comparing differences between the dynamic warp characteristics of the PC board and the first component and selecting design modifications to match PC board and the first component dynamic warp characteristics. Selecting design modifications may include determining if the first component dynamic warp characteristics can be changed, determining if matching the dynamic warp characteristics of the PC board and the first component can be achieved by modifying the design of at least one of the PC board and the first component. The result of the method may be modified dynamic warp characteristics of at least one of the PC board and the first component.

Abstract: The chip stack of semiconductor chips with enhanced cooling apparatus includes a first chip with circuitry on a first side and a second chip electrically and mechanically coupled to the first chip by a grid of connectors. The apparatus further includes a thermal interface material pad between the first chip and the second chip, wherein the thermal interface material pad includes nanofibers aligned parallel to mating surfaces of the first chip and the second chip, and a heat removal device thermally connected to the thermal interface material pad.

Abstract: A method includes rotating a first elongated, inlet-side member of an air valve toward an open configuration when a fan blade is rotating and rotating the first inlet-side member to toward a closed configuration when the fan blade is not rotating. The air valve includes a frame and a sheet of thin material. The frame may have an outlet-side member configured to be mounted on a fan housing and the inlet-side member rotatably coupled to the outlet-side member. The material may have top and bottom edges, and a plurality of folds perpendicular to the top and bottom side edges that divide the sheet into a plurality of sections. The material may be attached to the outlet-side member and the inlet-side member, and configurable between folded and expanded positions.

Abstract: Embodiments of the invention relates to a method for rework of a BGA package. Memory shape material is placed adjacent to a plurality of solder joints of the package. Stimulation is applied to the material, with the stimulation causing the material to change from a non-stimulated shape to a stimulated shape. This stimulation causes an expansion of the material. As the material expands, it exerts a tensile force on the BGA package and an adjacently positioned carrier, causing a separation of the two components, while mitigating collateral heat of adjacently positioned components.

Abstract: Embodiments of the invention relates to a method and apparatus for rework of a BGA package. Memory shape material is placed adjacent to a plurality of solder joints of the package. Stimulation is applied to the material, with the stimulation causing the material to change from a non-stimulated shape to a stimulated shape. This stimulation causes an expansion of the material. As the material expands, it exerts a tensile force on the BGA package and an adjacently positioned carrier, causing a separation of the two components, while mitigating collateral heat of adjacently positioned components.

Abstract: An apparatus for cooling an electrical heat source is disclosed. A heat exchanger has two principal sub-assemblies. A closed-loop fluid flow is provided through a second sub-assembly, disposed next to a heat source. An open-loop fluid flow is provided though a first sub-assembly in communication with a second sub-assembly. Each of the first and second sub-assemblies has a rotational element. The fluid flow entering the first sub-assembly rotates the first rotational element, and magnetic communication between the rotational elements causes movement of the second rotational element, thereby achieving fluid movement within the second sub-assembly. Operationally, the closed-loop sub-assembly removes heat from the heat source and transfers it to the open-loop sub-assembly for subsequent heat transfer in a downstream fluid flow.

Abstract: A method and apparatus are provided for implementing microscale thermoacoustic heat and power control for processors and three dimensional (3D) chip stacks. A thermoacoustic heat engine is integrated with a 3D chip-stack and high power processors. The thermoacoustic heat engine is used in cooperation with a heat sink associated with the 3D chip-stack. Predefined connecting layers connect the 3D chip-stack to a cooling end of a thermoacoustic stack of the thermoacoustic heat engine, allowing the cooled end of the resonator to maintain temperature within the 3D chip-stack and to increase the efficiency of the heat sink.

Abstract: A method and system for cooling an electrical heat source is disclosed. A heat exchanger has two principal sub-assemblies. A closed-loop fluid flow is provided through a second sub-assembly, disposed next to a heat source. An open-loop fluid flow is provided though a first sub-assembly in communication with a second sub-assembly. Each of the first and second sub-assemblies has a rotational element. The fluid flow entering the first sub-assembly rotates the first rotational element, and magnetic communication between the rotational elements causes movement of the second rotational element, thereby achieving fluid movement within the second sub-assembly. Operationally, the closed-loop sub-assembly removes heat from the heat source and transfers it to the open-loop sub-assembly for subsequent heat transfer in a downstream fluid flow.

Abstract: The chip stack of semiconductor chips with enhanced cooling apparatus includes a first chip with circuitry on a first side and a second chip electrically and mechanically coupled to the first chip by a grid of connectors. The apparatus further includes a thermal interface material pad placed between the first chip and the second chip, wherein the thermal interface material pad includes nanofibers aligned parallel to mating surfaces of the first chip and the second chip and nanofibers aligned perpendicular to mating surfaces of the first chip and the second chip.

Abstract: A method and system for a dynamic keying system is disclosed. The method and system can include a male connector device having a first plurality of settings for one or more key features, and a female connector device having a second plurality of settings for one or more key features. The female connector device can be configured to operate in an initial mode in which it is configured to, in response to the introduction of the male connector device, correspond a first setting of the first plurality of settings to a second setting of the second plurality of settings. The female connector device can also be configured to operate in a subsequent mode, in which it can permit coupling with at least one male connector device having the first setting and consistently deny access to at least one male connector device having a third setting different than the first setting.

Abstract: A method and system for a dynamic keying system is disclosed. The method and system can include a male connector device having a first plurality of settings for one or more key features, and a female connector device having a second plurality of settings for one or more key features. The female connector device can be configured to operate in an initial mode in which it is configured to, in response to the introduction of the male connector device, correspond a first setting of the first plurality of settings to a second setting of the second plurality of settings. The female connector device can also be configured to operate in a subsequent mode, in which it can permit coupling with at least one male connector device having the first setting and consistently deny access to at least one male connector device having a third setting different than the first setting.

Abstract: A method for designing structures with complimentary dynamic warp characteristics for attachment of a component to a PC board is disclosed. The method may include determining characteristics of thermally induced dynamic warp of the PC board and of the first component, analyzing and comparing differences between the dynamic warp characteristics of the PC board and the first component and selecting design modifications to match PC board and the first component dynamic warp characteristics. Selecting design modifications may include determining if the first component dynamic warp characteristics can be changed, determining if matching the dynamic warp characteristics of the PC board and the first component can be achieved by modifying the design of at least one of the PC board and the first component. The result of the method may be modified dynamic warp characteristics of at least one of the PC board and the first component.

Abstract: An air valve includes a frame and a sheet of thin material. The frame may have an outlet-side member configured mounted on a fan housing and an inlet-side member rotatably coupled to the outlet-side member. The material may have top and bottom edges, and a plurality of folds perpendicular to the top and bottom side edges that divide the sheet into a plurality of sections. The material may be attached to the outlet-side member and the inlet-side member, and configurable between folded and expanded positions. An attraction between a magnetic component on the inlet-side member and a magnetic component on a rotating fan blade may cause the inlet-side member to rotate, moving the material into the folded configuration. When the fan blade is not rotating, a spring attached at a pivot point may cause the inlet-side member to rotate in an opposite direction, moving the material into the expanded position.

Abstract: A continuous loop of thermally conductive material is provided with a first portion in frictional contact with a casing of an electronic device and a second portion located within a cooling region. The loop is advanced such that the first portion is located within the cooling region and the second portion is in frictional contact with the casing.

Abstract: A continuous loop of thermally conductive material is provided with a first portion in frictional contact with a casing of an electronic device and a second portion located within a cooling region. The loop is advanced such that the first portion is located within the cooling region and the second portion is in frictional contact with the casing.