Abstract: Embodiments of the present invention are directed to a wireless-enabled component (WEC) for enabling a wireless bus for intra-chip and inter-chip communication. A WEC encompasses a functional block of an IC (such as, for example, a processing core of a processing unit), an entire IC (such as, for example, a processing unit), or a device that includes a plurality of ICs (such as, for example, a handheld device). According to embodiments, a WEC may be associated with one or more sub-blocks of an IC, a single IC, or a plurality of ICs.

Abstract: Methods and apparatus are disclosed for wirelessly communicating among integrated circuits and/or functional modules within the integrated circuits. A semiconductor device fabrication operation uses a predetermined sequence of photographic and/or chemical processing steps to form one or more functional modules onto a semiconductor substrate. The functional modules are coupled to an integrated waveguide that is formed onto the semiconductor substrate and/or attached thereto to form an integrated circuit. The functional modules communicate with each other as well as to other integrated circuits using a multiple access transmission scheme via the integrated waveguide. One or more integrated circuits may be coupled to an integrated circuit carrier to form Multichip Module. The Multichip Module may be coupled to a semiconductor package to form a packaged integrated circuit.

Abstract: Disclosed herein are systems, apparatuses, and methods for creating a system of wireless-enabled components (WECs). Such a system includes a server and a plurality of wireless-enabled component (WECs). Each WEC includes a functional resource (e.g., a processing resource and/or a memory resource) and is configured for wireless communication with the server and one or more other WECs. A first WEC is configured to wirelessly upload, to the server, an availability of the functional resource of the first WEC. The first WEC is further configured to wirelessly download, from the server, a linking resource for linking with one or more of the plurality of WECs. The plurality of WECs may be located on a single chip, on multiple chips of a single device, or on multiple chips of multiple devices.

Abstract: Methods and apparatus are disclosed for wirelessly communicating among integrated circuits and/or functional modules within the integrated circuits. A semiconductor device fabrication operation uses a predetermined sequence of photographic and/or chemical processing steps to form one or more functional modules onto a semiconductor substrate. The functional modules are coupled to an integrated waveguide that is formed onto the semiconductor substrate and/or attached thereto to form an integrated circuit. The functional modules communicate with each other as well as to other integrated circuits using a multiple access transmission scheme via the integrated waveguide. One or more integrated circuits may be coupled to an integrated circuit carrier to form Multichip Module. The Multichip Module may be coupled to a semiconductor package to form a packaged integrated circuit.

Abstract: A radio transmitter front end for use in a radio frequency (RF) transceiver includes at least one amplifier stage operable to generate a transmit signal in response to an upconverted signal. A feedback generator is operable to generate a transmit feedback signal in response to the transmit signal. A control signal generator is operable to generate at least one filter control signal in response to the transmit feedback signal. A notch filter is operable to filter out of band noise while passing in-band frequencies to the at least one amplifier stage, under control of the at least one filter control signal.

Abstract: Embodiments of the present invention are directed to a scalable wireless bus for intra-chip and inter-chip communication. The scalable wireless bus includes a plurality of wireless-enabled components (WECs). In an embodiment, the scalable wireless bus may have at least one of the number of links among WECs and the capacity of said links adapted based on one or more factors. For example, the number of links and the capacity of the links may be adapted according to one or more of, among other factors, expected activity level over the wireless bus, desired power consumption, delay, and interference levels.

Abstract: Methods and apparatus are disclosed to simultaneously, wirelessly test semiconductor components formed on a semiconductor wafer. The semiconductor components transmit respective outcomes of a self-contained testing operation to wireless automatic test equipment via a common communication channel. Multiple receiving antennas observe the outcomes from multiple directions in three dimensional space. The wireless automatic test equipment determines whether one or more of the semiconductor components operate as expected and, optionally, may use properties of the three dimensional space to determine a location of one or more of the semiconductor components. The wireless testing equipment may additionally determine performance of the semiconductor components by detecting infrared energy emitted, transmitted, and/or reflected by the semiconductor wafer before, during, and/or after a self-contained testing operation.

Abstract: Disclosed herein are systems, apparatuses, and methods for wirelessly coupling functional resources. Such a system includes a plurality of co-located, wireless-enabled functional units of a first type and a plurality of co-located, wireless-enabled functional units of a second type. At least one of the wireless-enabled functional units of the first type is wirelessly coupled with one or more of the wireless-enabled functional units of the second type. The wireless-enabled functional units of the first type may be wireless-enabled processing units, and the wireless-enabled functional units of the second type may be wireless-enabled memory units. In an example, the plurality of wireless-enabled functional units of the first type are co-located on a first chip, and the plurality of wireless-enabled functional units of the second type are co-located on a second chip. The first chip and the second chip may be located in a single device or in separate devices.

Abstract: Embodiments of the present invention are directed to a wireless-enabled component (WEC) for enabling a wireless bus for intra-chip and inter-chip communication. A WEC encompasses a functional block of an IC (such as, for example, a processing core of a processing unit), an entire IC (such as, for example, a processing unit), or a device that includes a plurality of ICs (such as, for example, a handheld device). According to embodiments, a WEC may be associated with one or more sub-blocks of an IC, a single IC, or a plurality of ICs.

Abstract: A packaged integrated circuit includes an integrated circuit having a Radio Frequency (RF) passive element formed therein and a wafer level chip scale flip chip package that contains the integrated circuit. The wafer level chip scale flip chip package includes at least one dielectric layer isolating a top metal layer of the integrated circuit and a package signal connection upon the at least one dielectric layer, wherein the package signal connection partially overlays the RF passive element with respect to a surface of the integrated circuit. The RF passive element may be an inductor, a transformer, a capacitor, or another passive element. The package signal connection may be a conductive ball, a conductive bump, a conductive pad, or a conductive spring, for example. A conductive structure may reside upon the at least one dielectric layer to provide shielding to the RF passive element and may include a plurality of conductive elements or a mesh.

Abstract: Methods and apparatus are disclosed to simultaneously, wirelessly test semiconductor components formed on a semiconductor wafer. The semiconductor components transmit respective outcomes of a self-contained testing operation to wireless automatic test equipment via a common communication channel. Multiple receiving antennas observe the outcomes from multiple directions in three dimensional space. The wireless automatic test equipment determines whether one or more of the semiconductor components operate as expected and, optionally, may use properties of the three dimensional space to determine a location of one or more of the semiconductor components. The wireless testing equipment may additionally determine performance of the semiconductor components by detecting infrared energy emitted, transmitted, and/or reflected by the semiconductor wafer before, during, and/or after a self-contained testing operation.

Abstract: Disclosed herein are systems, apparatuses, and methods for creating a system of wireless-enabled components (WECs). Such a system includes a server and a plurality of wireless-enabled component (WECs). Each WEC includes a functional resource (e.g., a processing resource and/or a memory resource) and is configured for wireless communication with the server and one or more other WECs. A first WEC is configured to wirelessly upload, to the server, an availability of the functional resource of the first WEC. The first WEC is further configured to wirelessly download, from the server, a linking resource for linking with one or more of the plurality of WECs. The plurality of WECs may be located on a single chip, on multiple chips of a single device, or on multiple chips of multiple devices.

Abstract: Embodiments of the present invention are directed to a scalable wireless bus for intra-chip and inter-chip communication. The scalable wireless bus includes a plurality of wireless-enabled components (WECs). In an embodiment, the scalable wireless bus may have at least one of the number of links among WECs and the capacity of said links adapted based on one or more factors. For example, the number of links and the capacity of the links may be adapted according to one or more of, among other factors, expected activity level over the wireless bus, desired power consumption, delay, and interference levels.

Abstract: A management unit manages a plurality of multiservice communication devices capable of communicating via a plurality of networks. The management unit includes a device interface for facilitating a bidirectional data communication with the plurality of multiservice communication devices via a wireless control channel, the bidirectional data communication including outbound control data sent to at least one of the plurality of multiservice communication devices and inbound control data received from at least one of the plurality of multiservice communication devices via either a logical or physical control channel. A network interface receives network resource data from the plurality of networks. A management processing unit includes a local agent that gathers environmental data, wherein the management processing unit processes the inbound control data, the environmental data and the network resource data and that generates the outbound control data in response thereto.

Abstract: Methods and apparatus are disclosed to simultaneously, wirelessly test semiconductor components formed on a semiconductor wafer. The semiconductor components transmit respective outcomes of a self-contained testing operation to wireless automatic test equipment via a common communication channel. Multiple receiving antennas observe the outcomes from multiple directions in three dimensional space. The wireless automatic test equipment determines whether one or more of the semiconductor components operate as expected and, optionally, may use properties of the three dimensional space to determine a location of one or more of the semiconductor components. The wireless testing equipment may additionally determine performance of the semiconductor components by detecting infrared energy emitted, transmitted, and/or reflected by the semiconductor wafer before, during, and/or after a self-contained testing operation.

Abstract: A wireless device includes impedance determination and processing circuitry. The impedance determination circuitry determines load impedance at an output of at least one Radio Frequency (RF) power amplifier of the wireless device. The processing circuitry couples to the impedance determination circuitry and alters at least one operating parameter of the wireless device based upon the determined load impedance.

Abstract: Disclosed herein are systems, apparatuses, and methods for establishing wireless communications among a plurality of wireless-enabled components (WECs), and applications thereof. Such a system includes a plurality of WECs, each configured to transmit and receive over a wireless bus. The wireless bus includes (i) a first channel to identify proximally located WECs and (ii) a second channel to support communications among the proximally located WECs. The plurality of WECs may be located on a single chip, on multiple chips of a single device, or on multiple chips across multiple devices.

Abstract: A management unit manages a plurality of multiservice communication devices capable of communicating via a plurality of networks. The management unit includes a device interface for facilitating a bidirectional data communication with the plurality of multiservice communication devices via a wireless control channel, the bidirectional data communication including outbound control data sent to at least one of the plurality of multiservice communication devices and inbound control data received from at least one of the plurality of multiservice communication devices via either a logical or physical control channel. A network interface receives network resource data from the plurality of networks. A management processing unit includes a local agent that gathers environmental data, wherein the management processing unit processes the inbound control data, the environmental data and the network resource data and that generates the outbound control data in response thereto.

Abstract: A multiservice communication device includes a plurality of transceivers that wirelessly transceive network data with a corresponding plurality of networks in accordance with a corresponding plurality of network protocols, wherein at least one of the plurality of transceivers further transceives control channel data with a remote management unit contemporaneously with the network data via a logical control channel carried using the corresponding one of the plurality of network protocols, wherein the control channel data includes local control data sent to the management unit and remote control data received from the management unit. A processing module processes the remote control data and generates a least one control signal in response thereto, the at least one control signal for adapting at least one of the plurality of transceivers based on the remote control data.

Abstract: Methods and apparatus are disclosed for wirelessly communicating among integrated circuits and/or functional modules within the integrated circuits. A semiconductor device fabrication operation uses a predetermined sequence of photographic and/or chemical processing steps to form one or more functional modules onto a semiconductor substrate. The functional modules are coupled to an integrated waveguide that is formed onto the semiconductor substrate and/or attached thereto to form an integrated circuit. The functional modules communicate with each other as well as to other integrated circuits using a multiple access transmission scheme via the integrated waveguide. One or more integrated circuits may be coupled to an integrated circuit carrier to form Multichip Module. The Multichip Module may be coupled to a semiconductor package to form a packaged integrated circuit.