Abstract: A radio frequency (RF) section of an RF transceiver is coupled to an antenna structure that includes a plurality of antennas. The RF section includes a configuration controller operable to generate a control signal that selectively indicates a non-contiguous state in a non-contiguous mode of operation of the RF transceiver and a multi-input multi-output (MIMO) state in a MIMO mode of operation of the RF transceiver.

Abstract: A radio transmitter front end for use in a radio frequency (RF) transceiver includes at least one amplifier stage operable to generate a transmit signal in response to an upconverted signal. A feedback generator is operable to generate a transmit feedback signal in response to the transmit signal. A control signal generator is operable to generate at least one filter control signal in response to the transmit feedback signal. A notch filter is operable to filter out of band noise while passing in-band frequencies to the at least one amplifier stage, under control of the at least one filter control signal.

Abstract: An integrated circuit radio transceiver and method therefor includes an integrated circuit radio transceiver operable to provide specified gain levels and transmit path filter responses to correspond with a selected power spectral density mask. Changes in gain may be provided solely digital gain changes or may include analog gain module gain changes. A transmitter selects from one of at least three masks to reduce or eliminate spectral regrowth out of band to satisfy EVM requirements. Circuitry is provided to allow a transceiver to determine in advance what pre-distortion compensation settings are required for the various gain settings.

Abstract: Embodiments of the present invention are directed to a wire-free data center/server. The data center/server is wire-free in the sense that communication within a data unit of the data center/server (i.e., intra-data unit), between data units of the data center/server (inter-data unit), and between the data units and the backplane of the data center/server is performed wirelessly.

Abstract: Methods and apparatus are disclosed for wirelessly communicating among integrated circuits and/or functional modules within the integrated circuits. A semiconductor device fabrication operation uses a predetermined sequence of photographic and/or chemical processing steps to form one or more functional modules onto a semiconductor substrate. The functional modules are coupled to an integrated waveguide that is formed onto the semiconductor substrate and/or attached thereto to form an integrated circuit. The functional modules communicate with each other as well as to other integrated circuits using a multiple access transmission scheme via the integrated waveguide. One or more integrated circuits may be coupled to an integrated circuit carrier to form Multichip Module. The Multichip Module may be coupled to a semiconductor package to form a packaged integrated circuit.

Abstract: Methods and apparatus are disclosed for wirelessly communicating among integrated circuits and/or functional modules within the integrated circuits. A semiconductor device fabrication operation uses a predetermined sequence of photographic and/or chemical processing steps to form one or more functional modules onto a semiconductor substrate. The functional modules are coupled to an integrated waveguide that is formed onto the semiconductor substrate and/or attached thereto to form an integrated circuit. The functional modules communicate with each other as well as to other integrated circuits using a multiple access transmission scheme via the integrated waveguide. One or more integrated circuits may be coupled to an integrated circuit carrier to form Multichip Module. The Multichip Module may be coupled to a semiconductor package to form a packaged integrated circuit.

Abstract: Methods and apparatus are disclosed for wirelessly communicating among integrated circuits and/or functional modules within the integrated circuits. A semiconductor device fabrication operation uses a predetermined sequence of photographic and/or chemical processing steps to form one or more functional modules onto a semiconductor substrate. The functional modules are coupled to an integrated waveguide that is formed onto the semiconductor substrate and/or attached thereto to form an integrated circuit. The functional modules communicate with each other as well as to other integrated circuits using a multiple access transmission scheme via the integrated waveguide. One or more integrated circuits may be coupled to an integrated circuit carrier to form Multichip Module. The Multichip Module may be coupled to a semiconductor package to form a packaged integrated circuit.

Abstract: Methods and apparatus are disclosed for wirelessly communicating among integrated circuits and/or functional modules within the integrated circuits. A semiconductor device fabrication operation uses a predetermined sequence of photographic and/or chemical processing steps to form one or more functional modules onto a semiconductor substrate. The functional modules are coupled to an integrated waveguide that is formed onto the semiconductor substrate and/or attached thereto to form an integrated circuit. The functional modules communicate with each other as well as to other integrated circuits using a multiple access transmission scheme via the integrated waveguide. One or more integrated circuits may be coupled to an integrated circuit carrier to form Multichip Module. The Multichip Module may be coupled to a semiconductor package to form a packaged integrated circuit.

Abstract: Methods and apparatus are disclosed for wirelessly communicating among integrated circuits and/or functional modules within the integrated circuits. A semiconductor device fabrication operation uses a predetermined sequence of photographic and/or chemical processing steps to form one or more functional modules onto a semiconductor substrate. The functional modules are coupled to an integrated waveguide that is formed onto the semiconductor substrate and/or attached thereto to form an integrated circuit. The functional modules communicate with each other as well as to other integrated circuits using a multiple access transmission scheme via the integrated waveguide. One or more integrated circuits may be coupled to an integrated circuit carrier to form Multichip Module. The Multichip Module may be coupled to a semiconductor package to form a packaged integrated circuit.

Abstract: Methods and apparatus are disclosed for wirelessly communicating among integrated circuits and/or functional modules within the integrated circuits. A semiconductor device fabrication operation uses a predetermined sequence of photographic and/or chemical processing steps to form one or more functional modules onto a semiconductor substrate. The functional modules are coupled to an integrated waveguide that is formed onto the semiconductor substrate and/or attached thereto to form an integrated circuit. The functional modules communicate with each other as well as to other integrated circuits using a multiple access transmission scheme via the integrated waveguide. One or more integrated circuits may be coupled to an integrated circuit carrier to form Multichip Module. The Multichip Module may be coupled to a semiconductor package to form a packaged integrated circuit.

Abstract: An integrated circuit radio transceiver and method therefor comprises a receiver front end that further includes a plurality of in-phase and quadrature phase receive processing block operable at first and second frequency bands wherein each of the receive processing blocks defines an ingoing signal path and further includes a plurality of filtering and amplification blocks disposed within the corresponding ingoing signal path, a plurality of RSSI blocks coupled to receive an ingoing analog signal from a corresponding plurality of nodes disposed throughout the ingoing signal path, each of the plurality of received signal strength indicator blocks producing a signal strength indication, and wherein a baseband processor is operable to receive a selected signal strength indication and to produce at least one gain setting to at least one amplification block within the in-phase or quadrature phase receive processing blocks.

Abstract: A wireless device includes processing circuitry, a receiver section, a transmitter section, and an antenna. The processing circuitry determines a set of information signals of a RF Multiple Frequency Bands Multiple Standards (MFBMS) signal. The receiver section down-converts a portion of the RF MFBMS signal by one or more respective shift frequencies to produce a corresponding baseband/low Intermediate Frequency (BB/IF) information signal from which the processing circuitry extracts data. The transmitter section converts a respective BB/IF information signal received from the processing circuitry by a respective shift frequency to produce a corresponding RF information signal and a combiner that combines the RF information signals to form a RF MFBMS signal. The receiver section and the transmitter section include ADCs and/or DACs, respectively, that are adjustable based upon characteristics of the RF MFBMS signal, the BB/IF MFBMS signal, and/or based upon signals carried therein, e.g.

Abstract: A multiservice communication device includes a plurality of transceivers that wirelessly transceive network data with a corresponding plurality of networks in accordance with a corresponding plurality of network protocols, wherein at least one of the plurality of transceivers further transceives control channel data with a remote management unit contemporaneously with the network data via a logical control channel carried using the corresponding one of the plurality of network protocols, wherein the control channel data includes local control data sent to the management unit and remote control data received from the management unit. A processing module processes the remote control data and generates a least one control signal in response thereto, the at least one control signal for adapting at least one of the plurality of transceivers based on the remote control data.

Abstract: Embodiments of a wireless transceiver are provided. Embodiments can be used in multiple-input-multiple-output (MIMO) wireless transceivers. In an embodiment, radio control signal bundles are provided as direct parallel interconnects between digital signal processing modules and the radio module of the wireless transceiver to enable a precise low-latency control of radio functions. In another embodiment, a separate physical line is provided to control each radio setting of the radio module, thereby enabling simultaneous real-time control of any number of radio settings. In a further embodiment, the various digital and analog components of the wireless transceiver are integrated within a single chip of the same process technology.

Abstract: A multiple band direct conversion radio frequency (RF) transceiver integrated circuit (IC) includes a multiple band direct conversion transmitter section, a multiple band direct conversion receiver section, and a local oscillation module. The multiple band direct conversion transmitter section includes a transmit baseband module and a multiple frequency band transmission module. The multiple band direct conversion receiver section includes a multiple frequency band reception module and a receiver baseband module. The local oscillation generation module is coupled to generate a first frequency band local oscillation when the multiple band direct conversion RF transceiver IC is in the first mode and coupled to generate a second frequency band local oscillation when the multiple band direct conversion RF transceiver IC is in the second mode.

Abstract: A multiservice communication device includes a plurality of transceivers that wirelessly transceive network data with a corresponding plurality of networks in accordance with a corresponding plurality of network protocols, wherein the plurality of transceivers includes at least one cognitive radio transceiver that is configured based on cognitive transceiver configuration data received from a management unit in communication with the multiservice communication device via a control channel.

Abstract: Disclosed herein are systems, apparatuses, and methods for providing a proximity coupling without Ohmic contact. Such a system includes a plurality of wireless-enabled components (WECs) that are wirelessly coupled to each other. Each WEC includes a metal-based element, a substrate, and a semiconductor layer that separates the metal-based element from the substrate. A signal is configured to be transmitted via a proximity coupling (e.g., a magnetic coupling, an electric coupling, and/or an electromagnetic coupling) between the metal-based element and the substrate without an Ohmic contact between the metal-based element and the substrate. In an example, a first subset of the plurality of the WECs is co-located on a first chip, and a second subset of the plurality of the WECs is co-located on a second chip. The first chip and the second chip may be located in a single device or in separate devices.

Abstract: Analog signal paths are utilized between a baseband processor and a radio front end to support high throughput communications for a multiple in multiple out radio transceiver that support communications over two or more antennas. Specifically, analog differential I and Q path communication signals are exchanged between a radio front end core and a baseband processor to maximize throughput capacity for high data rate signals. Along the same lines, the impedances of traces and the interface are matched to reduce I/Q imbalance.

Abstract: An integrated circuit radio transceiver and method therefor includes an integrated circuit radio transceiver operable to provide specified gain levels and transmit path filter responses to correspond with a selected power spectral density mask. Changes in gain may be provided solely digital gain changes or may include analog gain module gain changes. A transmitter selects from one of at least three masks to reduce or eliminate spectral regrowth out of band to satisfy EVM requirements. Non-symmetric masks may also be selected for special circumstances to prevent out of band spectral regrowth. Additionally, pre-distortion settings are applied to in-band frequencies to correspond to the selected PSD mask.

Abstract: A configurable radio frequency (RF) transceiver integrated circuit (IC) includes an RF input/output (IO) module, a plurality of switching modules, and a plurality of components. The RF IO module and selected components of the plurality of components are inter-connected via the at least some of the plurality of switching modules based on a configuration instruction to produce at least one of: at least a portion of a receiver and at least a portion of transmitter.