Abstract: A test socket for electrically connecting a device under test (DUT) to an electrical signal source comprises a plurality of pogo pins spaced apart from each other, a stabilizing plate supporting the plurality of pogo pins, a plurality of conductive lines passing through the stabilizing plate and configured to electrically connect the electrical signal source to the pogo pins, and at least one inner stabilizer disposed in the stabilizing plate between the conductive lines and configured to apply an elastic force toward the DUT where the DUT is brought into contact with the pogo pins.

Abstract: In a training mode, per-bit de-skew (PBDS) values for a datamask signal in a synchronous dynamic random access memory are iteratively adjusted in conjunction with writing test patterns to the memory and reading back test patterns from the memory until optimum datamask PBDS values are determined.

Abstract: A package for a light source and methods of manufacturing the same are disclosed. In particular, a light source package is disclosed with an outer component and an interchangeable inner component. The inner component can be modular and replaceable with other inner components having different properties, thereby enabling a flexible design of a light source package to accommodate different lighting conditions and desired lighting effects.

Abstract: An optical sensing device to measure displacement in a parallel direction perpendicular to a proximate surface is disclosed. The optical sensing device may comprise a tracking light source, a displacement light source, a displacement optical element, and a sensor. The tracking light source may generate a first beam spot on the proximate surface and the displacement light source may generate a second beam spot. The second beam spot may be smaller than the first beam spot. The displacement light source may be optically coupled with the displacement optical element to generate the second beam spot at an incident angle ? that may generate a shift in the second beam spot position when the optical sensing device is displaced relative to the proximate surface. The shift in the second beam spot position to a new position may correspond to a displacement of the optical sensing device in a direction perpendicular to the proximate surface.

Abstract: A multipath power amplifier device, configured to operate in a high power mode and a low power mode, includes a high power path, a low power path and an output switch. The high power path includes a high power mode (HPM) amplifying circuit for amplifying an input signal in the high power mode. The low power path includes a low power mode (LPM) amplifying circuit for amplifying the input signal in the low power mode. The output switch is configured to isolate the low power path from the high power path in the high power mode.

Abstract: An optical communications module is provided with an EMI shielding system that comprises a resistive coating disposed on one or more inner surfaces of the module housing. The resistive coating has a thickness that is greater than or equal to one skin depth and has a resistivity that is low enough to support electrical current flow, but high enough to absorb EMI radiation of a particular wavelength or wavelength range. The combination of these features causes EMI radiation to propagate in the resistive coating due to skin effect. The resistive coating absorbs at least a portion of the EMI radiation propagating therein.

Abstract: A device for controlling operation of a power amplifier includes a detector, a reference signal generator and a controller. The detector is configured to detect a voltage level of an output signal of the power amplifier with respect to a predetermined boost threshold and to generate a corresponding detection signal and a reference signal. The controller is configured to provide a supply voltage to an output transistor of the power amplifier based on a comparison of the detection signal and the reference signal, the supply voltage being a no boost voltage, which is substantially the same as a supply voltage, when the comparison indicates that the voltage level is within the predetermined boost threshold, and the supply voltage being one of multiple boost voltages when the detection signal indicates that the voltage level is beyond the predetermined boost threshold. The controller generates the boost voltages by boosting the supply voltage.

Abstract: A TIA circuit and method are provided that merge the automatic gain control function with the bandwidth adjustment function to allow the TIA circuit to operate over a wide dynamic range at multiple data rates. The TIA circuit has an effective resistance that is adjustable for adjusting the gain and the bandwidth of the TIA circuit. The mechanism of the TIA circuit that is used to adjust the effective resistance, and hence the gain and bandwidth of the TIA circuit, is temperature independent, and as such, the performance of the TIA circuit is not affected by temperature variations.

Abstract: A heat dissipation system and method are embodied in an optical subassembly (OSA) that mechanically couples with an electrical subassembly (ESA) of an optical communications module. When the OSA is coupled with the ESA, a heat dissipation block that is embedded in the OSA is spaced apart from components of the ESA by a small air gap. At least a portion of the heat that is generated by one or more of these components passes into the heat dissipation block, which extends through top and bottom surfaces of the OSA. Because the heat dissipation block never makes physical contact with the ESA or with components of the ESA, there is no risk of the block damaging the ESA or detrimentally affecting the electrical performance of the module.

Abstract: An edge-emitting etched-facet optical semiconductor structure has a substrate, an active multiple quantum well (MQW) region formed on the substrate, and a ridge waveguide formed over the MQW region extending in substantially a longitudinal direction between a waveguide first etched end facet and a waveguide second etched end facet. A mask layer used to form windows in which the etched end facets are disposed consists of a single dielectric material disposed directly on the ridge waveguide. An optical coating consisting of no more than one layer of the same dielectric material of which the second mask is made is disposed directly on the second mask and disposed directly on the windows to coat the etched end facets.

Abstract: An edge-emitting etched-facet optical semiconductor structure includes a substrate, an active multiple quantum well (MQW) region formed on the substrate, a ridge waveguide formed over the MQW region extending in substantially a longitudinal direction between a waveguide first etched end facet disposed in a first window and a waveguide second etched end facet disposed in a second window, and first and second trenches having non-uniform widths extending in substantially the longitudinal direction between the first and second windows.

Abstract: An optical fiber connector includes a connector body and a submodule having a user-selectable configuration, such as a splitter or coupler. The connector body has a submodule mounting region. A first end of the connector body has a pluggable optical fiber port. A second end of the connector body has at least one body fiber guide. The submodule is releasably mounted in the submodule mounting region. The submodule has at least one submodule fiber guide aligned with at least one body fiber guide and at least one submodule fiber guide aligned with the pluggable optical fiber port. One or more optical fibers are routed through the connector body in accordance with the submodule configuration.

Abstract: A bidirectional optical communication system includes first and second transceivers arranged at opposed ends of an optical medium. Opto-electronic devices within the transceivers are arranged on respective mounting surfaces of planar substrates. First and second optical assemblies couple the respective transceivers to the optical medium. The optical assemblies include first and second optical elements arranged along an axis normal to the substrates. The first optical element is transparent to the optical signal transmitted from the respective transceiver and redirects the received optical signal from the other transceiver. The optical assemblies enable a single alignment of the opto-electronic devices and the optical medium.

Abstract: An edge-emitting optical semiconductor structure has a substrate, an active multiple quantum well (MQW) region formed on the substrate, and a ridge waveguide extending between first and second etched end facets. The first etched end facet is disposed in a first window, while the second etched end facet is disposed in a second window. The first etched end facet extends between a pair of alcoves in the first window, and the second etched end facet extends between a pair of alcoves in the second window. An integrated device in which two such structures are provided has an H-shaped window where the two structures adjoin each other. The structure can be fabricated using a process that involves a first mask to form the ridge waveguide and then a second mask and an etching process to form the windows.

Abstract: An optical encoder is disclosed. Specifically, a three-channel encoder is disclosed which utilizes a single track for all three channels. An index channel is provided on the same optical track as the first and second channels which are used to determine incremental angular position. Thus, a more compact and simple three-channel encoder is provided.

Abstract: A thermally-insulative insert device and method of use of same is disclosed. Specifically, the thermally-insulative insert device, comprising internal and external threads, allows attachment of an assembled part to a heat source while reducing heat transfer between the assembled part and the heat source. It is also an aspect of the present disclosure to provide easy-to-implement and cost-effective methods of using and assembling the thermally-insulative insert device.

Abstract: A downlight auxiliary ring device and method of control and use of same is disclosed. Specifically, the downlight auxiliary ring device, comprising light-emitting diodes, allows a dimmable and reduced-glare reflected downlight. It is also an aspect of the present disclosure to provide easy-to-implement and cost-effective methods of control and use of the downlight auxiliary ring device system.

Abstract: A heat dissipation solution is provided that is suitable for use in, but not limited to use in, CXP modules. The heat dissipation solution allows the performance of a CXP module to be significantly improved without having to increase the size of the heat dissipation device that is currently used with known CXP modules. The heat dissipation solution thermally decouples the heat dissipation path associated with the laser diodes from the heat dissipation path associated with other heat-generating components of the module, such as the laser diode driver IC and the receiver IC. Decoupling these heat dissipation paths allows the temperature of the laser diodes to be kept cooler as they are operated at higher speeds while allowing the temperatures of the other components to run hotter, if desired or necessary.

Abstract: An acoustic resonator structure comprises a first electrode disposed on a substrate, a piezoelectric layer disposed on the first electrode, a second electrode disposed on the piezoelectric layer, a frame disposed within a main membrane region defined by an overlap between the first electrode, the piezoelectric layer, and the second electrode, and having an outer edge substantially aligned with a boundary of the main membrane region, and a collar formed separate from the frame, disposed outside the main membrane region, and having an inner edge substantially aligned with the boundary of or overlapping the main membrane region.

Abstract: An opto-electronic system includes a substrate, an opto-electronic chip mounted on the substrate, a frame, and a lens device retained in the frame. A frame mounting portion of the frame is in contact with an upper surface of the opto-electronic chip. A lens mounting portion of the frame is spaced above the frame mounting portion. A lower surface of the lens device is in contact with the lens mounting portion. The spacing of the lens mounting portion and frame mounting portion determines the spacing between the upper surface of the opto-electronic chip and the lower surface of the lens device.