Abstract: Optical device packages and systems are disclosed. In one embodiment, a system may comprise first and second optical device packages. A respective first and second optical path length may be associated with the first and second optical device packages. The first and second optical path lengths may be adjusted differently. However, respective first and second sets of external dimensions of the first and second optical device packages may be the same or substantially the same. In one embodiment, one or more Quad Flat No Lead (QFN) packages may be employed.

Abstract: A controller and methods for adaptively adjusting a dispersion compensation circuit in a receiver of a communication link are disclosed. The controller receives a signal from an error detector coupled to the receiver. The controller includes a logic engine that provides configuration information to the dispersion compensation circuit. The configuration information defines a digital filter in response to at least one tap constraint and at least one coefficient constraint. In an example embodiment, the logic engine generates a measure of residual inter-symbol interference and a measure of a noise enhancement penalty and iteratively provides a set of adjusted coefficient values that when applied in the digital filter will result in an equalized receiver output signal that minimizes a mathematical combination of the measure of the residual inter-symbol interference and the measure of the noise enhancement penalty.

Abstract: A strain relief device and method are provided for use with an optical fiber cable of an optical communications system. The strain relief device comprises a plurality of metal wires, or rods, grouped into a bundle of parallel metal wires and a clamping mechanism for clamping first and second ends of the metal wires to an optical fiber cable. The clamped bundle of metal wires forms a spring having a spring constant that provides it with a desired stiffness and a desired flexibility.

Abstract: An electromagnetic interference (EMI) shielding device and method are provided for use with an optical communications module (OCM) that is configured to be plugged into a front panel of a box or housing of an optical communications system. The EMI shielding device is mechanically coupled to an end of a housing of the OCM such that when the OCM is fully inserted through an opening formed in the front panel, the EMI shielding device comes into abutment with the front panel to form an EMI seal around the opening that prevents, or at least helps prevent, EMI from escaping from the system housing through the opening formed in the front panel.

Abstract: A method of forming a double bulk acoustic resonator structure comprises forming a first electrode on a substrate, forming a first piezoelectric layer on the first electrode, forming a second electrode on the first piezoelectric layer, forming a second piezoelectric layer on the second electrode, and forming a third electrode on the second piezoelectric layer. The first and second piezoelectric layers are formed by a sputter deposition process using at least one sputter target comprising a combination of scandium and aluminum.

Abstract: A hybrid bulk acoustic wave (BAW) resonator comprises a first electrode, a second. electrode, a piezoelectric layer disposed between the first and second electrodes, and a single mirror pair disposed adjacent the second electrode. In one example, the hybrid bulk acoustic wave resonator further comprises a substrate, and the first electrode is disposed adjacent the substrate. A method of fabricating a hybrid BAW resonator is also disclosed.

Abstract: A three-terminal VCSEL is provided that has a reduced fall time that allows the VCSEL to be operated at higher speeds. Methods of operating the three-terminal VCSEL are also provided. The VCSEL can be operated at higher speeds without decreasing the optical output of the VCSEL when its in the logical HIGH state.

Abstract: In a connector system, a first connector is mechanically and optically mateable with a second connector to form one or more optical signal communication links. A wiping cleaner is included on at least one of the first and second connectors for cleaning an optical port of the other of the first and second connectors when the connectors are plugged together. The first and second connectors can further be electrically mateable to provide both optical and electrical signal communication links.

Abstract: A parallel optical transceiver module is provided that uses a folded flex circuit arrangement that reduces the footprint of the transceiver module while also providing the module with improved heat dissipation characteristics. In addition, the manner in which components are mounted on the flex circuit facilitates assembly of the module, reducing the overall cost of the module while improving manufacturing yield.

Abstract: Electronic devices and microphone devices are described.

Abstract: A bulk acoustic wave (BAW) resonator device includes an acoustic reflector formed over a substrate and a resonator stack formed over the acoustic reflector. The acoustic reflector includes multiple acoustic impedance layers. The resonator stack includes a first electrode formed over the acoustic reflector, a piezoelectric layer formed over the first electrode, and a second electrode formed over the piezoelectric layer. A bridge is formed within one of the acoustic reflector and the resonator stack.