Abstract: A manufacturing method for a cap, for a hybrid vertically integrated component having a MEMS component a relatively large cavern volume having a low cavern internal pressure, and a reliable overload protection for the micromechanical structure of the MEMS component. A cap structure is produced in a flat cap substrate in a multistep anisotropic etching, and includes at least one mounting frame having at least one mounting surface and a stop structure, on the cap inner side, having at least one stop surface, the surface of the cap substrate being masked for the multistep anisotropic etching with at least two masking layers made of different materials, and the layouts of the masking layers and the number and duration of the etching steps being selected so that the mounting surface, the stop surface, and the cap inner side are situated at different surface levels of the cap structure.

Abstract: A micromechanical component is described including a substrate having a spacer layer and a test structure for ascertaining the thickness of the spacer layer. The test structure includes a seismic mass, which is elastically deflectable along a measuring axis parallel to the substrate, a first electrode system and a second electrode system for deflecting the seismic mass along the measuring axis, having a mass electrode, which is produced by a part of the seismic mass, and a substrate electrode, which is situated on the substrate in each case, the first electrode system being designed to be thicker than the second electrode system by the layer thickness of the spacer layer.

Abstract: A microelectromechanical sensor module includes a sensing mechanism for measuring an acceleration, pressure, air humidity or the like, a control mechanism for controlling the sensing mechanism, an energy supply mechanism for supplying the sensor module with energy, and a transmission mechanism for transmitting signals of the sensing mechanism. At least three of the mechanisms are integrated at the chip level in at least one chip in each case. A corresponding method is implemented to produce the microelectromechanical sensor module.

Abstract: A micromechanical device measures an acceleration, a pressure or the like. It comprises a substrate having at least one fixed electrode, a seismic mass moveably arranged on the substrate, at least one ground electrode, which is arranged on the seismic mass, and resetting means for returning the seismic mass into an initial position, wherein the fixed electrode and the ground electrode are configured in one measurement plane for measuring an acceleration, a pressure or the like in the measurement plane, and wherein the fixed electrode and the ground electrode are configured for measuring an acceleration, pressure or the like acting on the seismic mass perpendicular to the measurement plane. The disclosure likewise relates to a corresponding method and a corresponding use.

Abstract: Measures are proposed by which the design freedom is significantly increased in the case of the implementation of the micromechanical structure of the MEMS element of a component, which includes a carrier for the MEMS element and a cap for the micromechanical structure of the MEMS element, the MEMS element being mounted on the carrier via a standoff structure. The MEMS element is implemented in a layered structure, and the micromechanical structure of the MEMS element extends over at least two functional layers of this layered structure, which are separated from one another by at least one intermediate layer.

Abstract: A method for self-adjustment of a triaxial acceleration sensor during operation includes: calibrating the sensor; checking the self-adjustment for an interfering acceleration, with the aid of a measurement equation and estimated values for sensitivity and offset; repeating the adjustment if an interfering acceleration is recognized; and accepting the estimated values for sensitivity and offset as calibration values if an interfering acceleration is not recognized. The step of checking the self-adjustment includes: estimating sensitivity and/or offset and the variance thereof; determining an innovation as the difference between a measured value of the measurement equation and an estimated value of the measurement equation; testing the innovation for a normal distribution; and recognizing the interfering acceleration in the event of a deviation from the normal distribution.

Abstract: A method for producing an electronic module, in that at least one first microelectronic component is provided and is electrically connected to a second microelectronic component by a first flip-chip method step; at least one dielectric component is provided which has at least one printed circuit trace, and at least one printed circuit trace of the dielectric component is electrically connected to the second microelectronic component; and the second microelectronic component is electrically connected by a second flip-chip method step to a printed circuit board by way of the printed circuit trace(s) of the dielectric component, in order to avoid vias through a microelectronic component; the invention also relates to a corresponding electronic module.

Abstract: A sensor for capacitive detection of a mechanical deflection includes a substrate having a first substrate electrode and a second substrate electrode; and a mass movable relative to the substrate. The mass is divided into: a first electrically separate region having a first ground electrode; and a second electrically separate region of the mass having a second ground electrode. At least one portion of the first ground electrode is situated in a first region between the first substrate electrode and the second substrate electrode, and forms a first differential capacitor. At least one portion of the second ground electrode is situated in a second region between the first substrate electrode and the second substrate electrode, and forms a second differential capacitor.

Abstract: A method for producing a micromechanical component is described. The method includes providing a substrate having a layer system including an insulating material situated on the substrate, a conductive layer section and a protective layer structure connected to the conductive layer section, which borders a section of the insulating material. The method furthermore includes carrying out an isotropic etching process for removing a part of the insulating material, the conductive layer section and the protective layer structure preventing the removal of the bordered section of the insulating material; and a structural element being developed, which includes the conductive layer section, the protective layer structure and the bordered section of the insulating material.

Abstract: A method for determining the sensitivity of a sensor provides the following steps: a) first and second deflection voltages are applied to first and second electrode systems of the sensor, respectively, and first and second electrostatic forces are exerted on an elastically suspended seismic mass of the sensor by the first and second electrode systems, respectively, and a restoring force is exerted on the mass as a result of the elasticity of the mass, and a force equilibrium is established among the first and second electrostatic forces and the restoring force, and the mass assumes a deflection position characteristic of the force equilibrium, and an output signal characteristic of the force equilibrium and of the deflection position is measured; and b) the sensitivity of the sensor is computed on the basis of the first and second deflection voltages.

Abstract: A micromechanical acceleration sensor includes a substrate, an elastic diaphragm which extends parallel to the substrate plane and which is partially connected to the substrate, and which has a surface region which may be deflected perpendicular to the substrate plane, and a seismic mass whose center of gravity is situated outside the plane of the elastic diaphragm. The seismic mass extends at a distance over substrate regions which are situated outside the region of the elastic diaphragm and which include a system composed of multiple electrodes, each of which together with oppositely situated regions of the seismic mass forms a capacitor in a circuit. In its central region the seismic mass is attached to the elastic diaphragm in the surface region of the elastic diaphragm which may be deflected perpendicular to the substrate plane.

Abstract: A drive element is provided having a substrate, a seismic mass, a drive electrode and a counter-electrode, one of the two electrodes being connected to the substrate and the other of the two electrodes being connected to the seismic mass; and the drive electrode and the counter-electrodes being provided for the excitation of motion of the seismic mass in a main direction of motion; and in addition, the drive electrode includes a first and a second partial electrode, which are switchable separately from each other.

Abstract: A micro electrical-mechanical system (MEMS) is disclosed. The MEMS includes a substrate, a first pivot extending upwardly from the substrate, a first lever arm with a first longitudinal axis extending above the substrate and pivotably mounted to the first pivot for pivoting about a first pivot axis, a first capacitor layer formed on the substrate at a location beneath a first capacitor portion of the first lever arm, a second capacitor layer formed on the substrate at a location beneath a second capacitor portion of the first lever arm, wherein the first pivot supports the first lever arm at a location between the first capacitor portion and the second capacitor portion along the first longitudinal axis, and a first conductor member extending across the first longitudinal axis and spaced apart from the first pivot axis.

Abstract: A method for adjusting an acceleration sensor which includes a substrate and a seismic mass, the acceleration sensor having first and further first electrodes attached to the substrate on a first side, counter-electrodes of the seismic mass being situated between the first and further first electrodes, the acceleration sensor having further second electrodes on a second side and further fourth electrodes on a fourth side opposite the second side, an essentially equal first excitation voltage being applied to the first and further first electrodes in a first step for exciting a first deflection of the seismic mass along a first direction, the first deflection being compensated in a second step by applying a first compensation voltage to the further second and further fourth electrodes.

Abstract: A sensor element is provided for sensing accelerations in three spatial directions, which furnishes reliable measurement results and moreover can be implemented economically and with a small configuration. The sensor element encompasses at least one seismic mass deflectable in three spatial directions, a diaphragm structure that functions as a suspension mount for the seismic mass, and at least one stationary counterelectrode for capacitive sensing of the deflections of the diaphragm structure. According to the exemplary embodiments and/or exemplary methods of the present invention, the diaphragm structure encompasses at least four electrode regions, electrically separated from one another, that are mechanically coupled via the seismic mass.

Abstract: A microsystem, e.g., a micromechanical sensor, has a first cavity which is sealed off from the surroundings and a second cavity which is sealed off from the surroundings. The first cavity is bounded by a first bond joint and the second cavity is bounded by a second bond joint. Either the first bond joint or the second bond joint is a eutectic bond joint or a diffusion-soldered joint.

Abstract: A microsystem has a first cavity which is sealed off from the surroundings and a second cavity which is sealed off from the surroundings. The first cavity is bounded by a first bond joint and the second cavity is bounded by a second bond joint. Either the first bond joint or the second bond joint is a eutectic bond joint or a diffusion-soldered joint.

Abstract: A contact arrangement for establishing a spaced, electrically conducting connection between a first wafer and a second wafer includes an electrical connection contact, a passivation layer on the electrical connection contact, and a dielectric spacer layer arranged on the passivation layer, wherein the contact arrangement is arranged at least on one of the first wafer and the second wafer, wherein the contact arrangement comprises trenches at least partly filled with a first material capable of forming a metal-metal connection, wherein the trenches are continuous trenches from the dielectric spacer layer through the passivation layer as far as the electrical connection contact, and wherein the first material is arranged in the trenches from the electrical connection contact as far as the upper edge of the trenches.

Abstract: A method for producing a micromechanical component is described. The method includes providing a substrate having a layer system including an insulating material situated on the substrate, a conductive layer section and a protective layer structure connected to the conductive layer section, which borders a section of the insulating material. The method furthermore includes carrying out an isotropic etching process for removing a part of the insulating material, the conductive layer section and the protective layer structure preventing the removal of the bordered section of the insulating material; and a structural element being developed, which includes the conductive layer section, the protective layer structure and the bordered section of the insulating material.

Abstract: A device is provided for resonantly driving a micromechanical system, which includes at least one seismic mass supported by spring vibrations, at least one drive for driving the vibration of the seismic mass and at least one element that is motionally coupled to the seismic mass. Furthermore, the device includes at least one detection element for detecting a relational parameter, that changes with the vibration of the seismic mass, between the motionally coupled element and the detection element, the detection element being equipped to cause an interruption of the vibration drive when a predetermined value of the relational parameter is reached.