Patents by Inventor Barry Jon Male
Barry Jon Male has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20240096761Abstract: A packaged integrated circuit (IC) includes a leadframe including a die pad. The packaged IC also includes a first circuit on the die pad, the first circuit having a region. The packaged IC also includes a second circuit on the first circuit, the second circuit being spaced from the region by a gap. The packaged IC also includes an attachment layer between the first and second circuits, the attachment layer and the first and second circuits enclosing at least a part of the gap over the region. The packaged IC also includes a mold compound encapsulating the first and second circuits, the attachment layer, and the at least part of the gap.Type: ApplicationFiled: December 4, 2023Publication date: March 21, 2024Applicant: Texas Instruments IncorporatedInventors: Barry Jon Male, Paul Merle Emerson, Sandeep Shylaja Krishnan
-
Patent number: 11925119Abstract: A system on an integrated circuit (IC) chip includes an input terminal and a return terminal, a heater, a thermopile, and a switch device. The heater is coupled between the input terminal and the return terminal. The thermopile is spaced apart from the heater by a galvanic isolation region. The switch device includes a control input coupled to an output of the thermopile. The switch device is coupled to at least one output terminal of the IC chip.Type: GrantFiled: December 14, 2021Date of Patent: March 5, 2024Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: Barry Jon Male, Henry Litzmann Edwards
-
Patent number: 11884538Abstract: A sensor device includes a first and second Micro-Electro-Mechanical (MEM) structures. The first MEM structure includes a first heating element on a first layer of the first MEM structure. The first heating element includes an input adapted to receive an input signal. The first MEM structure also includes a first temperature sensing element on a second layer of the first MEM structure. The second MEM structure includes a second heating element on a first layer of the second MEM structure and a second temperature sensing element on a second layer of the second MEM structure. An output circuit has a first input coupled to the first temperature sensing element and a second input coupled to the second temperature sensing element.Type: GrantFiled: September 28, 2021Date of Patent: January 30, 2024Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: Marco Corsi, Barry Jon Male
-
Patent number: 11837529Abstract: A packaged integrated circuit (IC) includes a leadframe including a die pad and leads around the die pad, an analog IC die having first bond pads on its active top side, and a second circuit including second circuit bond pads attached to the analog IC die by an attachment layer configured as a ring with a hollow center that provides an inner gap. A bottom side of the analog IC or the second circuit is attached to the die pad. Bond wires couple at least some of the first bond pads or some of the second circuit bond pads to the leads, and there is a second coupling between others of the second circuit bond pads and others of the first bond pads. A mold compound is for encapsulating the second circuit and the analog IC.Type: GrantFiled: March 18, 2022Date of Patent: December 5, 2023Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: Barry Jon Male, Paul Merle Emerson, Sandeep Shylaja Krishnan
-
Publication number: 20230089201Abstract: In examples, an electronic device comprises a printed circuit board (PCB), an orifice extending through the PCB, and a semiconductor die suspended above the orifice by aluminum bond wires. The semiconductor die is vertically aligned with the orifice and the bond wires coupled to the PCB.Type: ApplicationFiled: November 4, 2022Publication date: March 23, 2023Inventors: Barry Jon MALE, Marco CORSI
-
Patent number: 11538771Abstract: In a described example, an integrated circuit includes: a semiconductor substrate having a first surface and an opposite second surface; at least one dielectric layer overlying the first surface of the semiconductor substrate; at least one inductor coil in the at least one dielectric layer with a plurality of coil windings separated by coil spaces, the at least one inductor coil lying in a plane oriented in a first direction parallel to the first surface of the semiconductor substrate, the at least one inductor coil electrically isolated from the semiconductor substrate by a portion of the at least one dielectric layer; and trenches extending into the semiconductor substrate in a second direction at an angle with respect to the first direction, the trenches underlying the inductor coil and filled with dielectric replacement material.Type: GrantFiled: August 4, 2020Date of Patent: December 27, 2022Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: Barry Jon Male, Rajarshi Mukhopadhyay
-
Patent number: 11538767Abstract: An integrated circuit includes a lead frame, a first die, and a second die. The first die is bonded to and electrically connected to the lead frame. The second die is electrically connected to and spaced apart from the first die.Type: GrantFiled: April 6, 2018Date of Patent: December 27, 2022Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: Barry Jon Male, Paul Merle Emerson, Kurt Peter Wachtler
-
Patent number: 11495522Abstract: In examples, an electronic device comprises a printed circuit board (PCB), an orifice extending through the PCB, and a semiconductor die suspended above the orifice by aluminum bond wires. The semiconductor die is vertically aligned with the orifice and the bond wires coupled to the PCB.Type: GrantFiled: December 14, 2020Date of Patent: November 8, 2022Assignee: Texas Instruments IncorporatedInventors: Barry Jon Male, Marco Corsi
-
Publication number: 20220208657Abstract: A packaged integrated circuit (IC) includes a leadframe including a die pad and leads around the die pad, an analog IC die having first bond pads on its active top side, and a second circuit including second circuit bond pads attached to the analog IC die by an attachment layer configured as a ring with a hollow center that provides an inner gap. A bottom side of the analog IC or the second circuit is attached to the die pad. Bond wires couple at least some of the first bond pads or some of the second circuit bond pads to the leads, and there is a second coupling between others of the second circuit bond pads and others of the first bond pads. A mold compound is for encapsulating the second circuit and the analog IC.Type: ApplicationFiled: March 18, 2022Publication date: June 30, 2022Inventors: Barry Jon Male, Paul Merle Emerson, Sandeep Shylaja Krishnan
-
Publication number: 20220189857Abstract: In examples, an electronic device comprises a printed circuit board (PCB), an orifice extending through the PCB, and a semiconductor die suspended above the orifice by aluminum bond wires. The semiconductor die is vertically aligned with the orifice and the bond wires coupled to the PCB.Type: ApplicationFiled: December 14, 2020Publication date: June 16, 2022Inventors: Barry Jon MALE, Marco CORSI
-
Patent number: 11302611Abstract: A packaged integrated circuit (IC) includes a leadframe including a die pad and leads around the die pad, an analog IC die having first bond pads on its active top side, and a second circuit including second circuit bond pads attached to the analog IC die by an attachment layer configured as a ring with a hollow center that provides an inner gap. A bottom side of the analog IC or the second circuit is attached to the die pad. Bond wires couple at least some of the first bond pads or some of the second circuit bond pads to the leads, and there is a second coupling between others of the second circuit bond pads and others of the first bond pads. A mold compound is for encapsulating the second circuit and the analog IC.Type: GrantFiled: November 28, 2018Date of Patent: April 12, 2022Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: Barry Jon Male, Paul Merle Emerson, Sandeep Shylaja Krishnan
-
Patent number: 11296016Abstract: Semiconductor devices and methods and apparatus to produce such semiconductor devices are disclosed. An integrated circuit package includes a lead frame including a die attach pad and a plurality of leads; a die including a MEMs region defined by a plurality of trenches, the die electrically connected to the plurality of leads; and a mold compound covering portions of the die, the mold compound defining a cavity between a surface of the die and a surface of the mold compound, wherein the mold compound defines a vent.Type: GrantFiled: November 9, 2017Date of Patent: April 5, 2022Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: Robert Allan Neidorff, Benjamin Cook, Steven Alfred Kummerl, Barry Jon Male, Peter Smeys
-
Publication number: 20220102609Abstract: A system on an integrated circuit (IC) chip includes an input terminal and a return terminal, a heater, a thermopile, and a switch device. The heater is coupled between the input terminal and the return terminal. The thermopile is spaced apart from the heater by a galvanic isolation region. The switch device includes a control input coupled to an output of the thermopile. The switch device is coupled to at least one output terminal of the IC chip.Type: ApplicationFiled: December 14, 2021Publication date: March 31, 2022Inventors: Barry Jon Male, Henry Litzmann Edwards
-
Patent number: 11264369Abstract: In described examples, an integrated circuit includes a leadframe structure, which includes electrical conductors. A first coil structure is electrically connected to a first pair of the electrical conductors of the leadframe structure. The first coil structure is partially formed on a semiconductor die structure. A second coil structure is electrically connected to a second pair of the electrical conductors of the leadframe structure. The second coil structure is partially formed on the semiconductor die structure. A molded package structure encloses portions of the leadframe structure. The molded package structure exposes portions of the first and second pairs of the electrical conductors to allow external connection to the first and second coil structures. The molded package structure includes a cavity to magnetically couple portions of the first and second coil structures.Type: GrantFiled: April 27, 2020Date of Patent: March 1, 2022Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: Barry Jon Male, Benjamin Stassen Cook, Robert Alan Neidorff, Steve Kummerl
-
Patent number: 11227986Abstract: A system on an integrated circuit (IC) chip includes an input terminal and a return terminal. A heater coupled between the input terminal and the return terminal. A thermopile is spaced apart from the heater by a galvanic isolation region. A switch device includes a control input coupled to an output of the thermopile. The switch device is coupled to at least one output terminal of the IC chip.Type: GrantFiled: November 30, 2018Date of Patent: January 18, 2022Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: Barry Jon Male, Henry Litzmann Edwards
-
Publication number: 20220009767Abstract: A sensor device includes a first and second Micro-Electro-Mechanical (MEM) structures. The first MEM structure includes a first heating element on a first layer of the first MEM structure. The first heating element includes an input adapted to receive an input signal. The first MEM structure also includes a first temperature sensing element on a second layer of the first MEM structure. The second MEM structure includes a second heating element on a first layer of the second MEM structure and a second temperature sensing element on a second layer of the second MEM structure. An output circuit has a first input coupled to the first temperature sensing element and a second input coupled to the second temperature sensing element.Type: ApplicationFiled: September 28, 2021Publication date: January 13, 2022Inventors: Marco CORSI, Barry Jon MALE
-
Patent number: 11211305Abstract: An integrated circuit having a body comprised of semiconducting material has one or more electronic components formed in a first region of the body and at least another electronic component formed in the second region of the body. A thermal barrier separates the two regions. By one approach that thermal barrier comprises a gap formed in the body. The gap may comprise an air gap or may be partially or wholly filled with material that inhibits thermal conduction. The thermal barrier may at least substantially surround the aforementioned second region. The second region may also include one or more temperature sensors disposed therein. A temperature control circuit may use the corresponding temperature information from within the second region to actively control the second region temperature using a temperature forcing element that is disposed at least proximal to the second region.Type: GrantFiled: March 31, 2017Date of Patent: December 28, 2021Assignee: TEXAS INSTRUMENTS INCORPORATEDInventor: Barry Jon Male
-
Patent number: 11155460Abstract: A sensor device includes a first and second Micro-Electro-Mechanical (MEM) structures. The first MEM structure includes a first heating element on a first layer of the first MEM structure. The first heating element includes an input adapted to receive an input signal. The first MEM structure also includes a first temperature sensing element on a second layer of the first MEM structure. The second MEM structure includes a second heating element on a first layer of the second MEM structure and a second temperature sensing element on a second layer of the second MEM structure. An output circuit has a first input coupled to the first temperature sensing element and a second input coupled to the second temperature sensing element.Type: GrantFiled: November 29, 2019Date of Patent: October 26, 2021Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: Marco Corsi, Barry Jon Male
-
Publication number: 20210163281Abstract: A sensor device includes a first and second Micro-Electro-Mechanical (MEM) structures. The first MEM structure includes a first heating element on a first layer of the first MEM structure. The first heating element includes an input adapted to receive an input signal. The first MEM structure also includes a first temperature sensing element on a second layer of the first MEM structure. The second MEM structure includes a second heating element on a first layer of the second MEM structure and a second temperature sensing element on a second layer of the second MEM structure. An output circuit has a first input coupled to the first temperature sensing element and a second input coupled to the second temperature sensing element.Type: ApplicationFiled: November 29, 2019Publication date: June 3, 2021Inventors: MARCO CORSI, BARRY JON MALE
-
Publication number: 20200365532Abstract: In a described example, an integrated circuit includes: a semiconductor substrate having a first surface and an opposite second surface; at least one dielectric layer overlying the first surface of the semiconductor substrate; at least one inductor coil in the at least one dielectric layer with a plurality of coil windings separated by coil spaces, the at least one inductor coil lying in a plane oriented in a first direction parallel to the first surface of the semiconductor substrate, the at least one inductor coil electrically isolated from the semiconductor substrate by a portion of the at least one dielectric layer; and trenches extending into the semiconductor substrate in a second direction at an angle with respect to the first direction, the trenches underlying the inductor coil and filled with dielectric replacement material.Type: ApplicationFiled: August 4, 2020Publication date: November 19, 2020Inventors: Barry Jon Male, Rajarshi Mukhopadhyay