Abstract: Treated fiber substrates and methods of making and using the same are disclosed. The disclosed treated fiber substrates provide persistent, durable, broad spectrum, antimicrobial activity. The treated fiber substrates may be used in a variety of materials to impart antimicrobial activity thereto.

Abstract: According to the present invention, water repellant curable compositions comprise: (i) one or more polyacid; (ii) one or more polyol comprising at least two hydroxyl groups; (iii) one or more reactive waterproofing agent chosen from a C5 to C30 alk(en)yl monocarboxylate of a (poly)ethoxylated trihydric polyol, C5 to C30 alk(en)ylamine (poly)alkoxylate, C5 to C30 alk(en)yl diamine (poly)alkoxylate, C5 to C30 alk(en)ylamine (poly)alkoxylate containing an ether or thiother group in the alk(en)ylamine group, and mixtures thereof. The compositions are dilutable with water to make thermosetting aqueous binder compositions. The present invention also provides methods of treating or contacting substrates chosen from a non-woven, woven and a composite, such as glass fiber substrates, with the thermosetting aqueous binder compositions, and drying and curing, and the water resistant products produced thereby.

Abstract: A curable composition, useful as a thermosetting binder, having urea, a polycarboxy polymer or co-polymer and a polyol.

Abstract: A method for chemical mechanical polishing of semiconductor substrates containing a metal layer requiring removal and metal interconnects utilizing a composition containing engineered copolymer molecules comprising hydrophilic functional groups and relatively less hydrophilic functional groups; the engineered copolymer molecules enabling contact-mediated reactions between the polishing pad surface and the substrate surface during CMP resulting in minimal dishing of the metal interconnects in the substrate.

Abstract: A method for disinfecting or sanitizing a surface by applying an antimicrobial composition comprising a metal-polymer complex.

Abstract: A curable aqueous composition including (a) a polyacid including at least two carboxylic acid groups, anhydride groups, or salts thereof; (b) a polyol including at least two hydroxyl groups; and (c) an emulsion polymer including, as copolymerized units, greater than 30% by weight, based on the weight of the emulsion polymer solids, ethylenically unsaturated acrylic monomer including a C5 or greater alkyl group; wherein the ratio of the number of equivalents of the carboxylic acid groups, anhydride groups, or salts thereof to the number of equivalents of the hydroxyl groups is from 1/0.01 to 1/3, and wherein the carboxylic acid groups, anhydride groups, or salts thereof are neutralized to an extent of less than 35% with a fixed base is provided. Also provided is a method for treating heat-resistant fibers or a heat-resistant nonwoven formed therefrom with the curable aqueous composition and the article prepared thereby.

Abstract: According to the present invention, water repellant curable compositions comprise: (i) one or more polyacid comprising at least two carboxylic acid groups, anhydride groups, or salts thereof; (ii) one or more polyol comprising at least two hydroxyl groups; (iii) one or more reactive waterproofing agent chosen from a C5 to C30 alk(en)yl 2-hydroxyethyl (alk(en))amide, C5 to C30 alk(en)yl bis(2-hydroxyethyl)amide, C1 to C30 alk(en)yl 2-hydroxyethyl (alk(en))amine, C11 to C30 alk(en)yl bis(2-hydroxy-ethyl) amine, C11 to C30 alk(en)yl tris(2-hydroxyethyl)amine, C5 to C30 alk(en)yl monoglyceride, C5 to C30 alk(en)yl monocarboxylate of a trihydric polyol, and mixtures thereof; and, (iv), optionally, one or more phosphorous-containing accelerator, wherein the ratio of the number of equivalents of said carboxylic acid groups, anhydride groups, or salts thereof to the total number of equivalents of said hydroxyl groups is from 1/0.01 to 1/3.

Abstract: Fibers that durably contain antimicrobial materials such that the antimicrobial materials are resistant to being abraided away or washed off during use. The antimicrobial materials contained in the fibers are not prone to the development of resistant strains of bacteria. Also disclosed are methods of making and using the fibers.

Abstract: A composition that includes polymers such as acrylic acid homopolymers and copolymers, a polybasic acid and a strong acid, useful as a binder for substrates, including but not limited to fiberglass.

Abstract: A curable composition including a polymer comprising, as copolymerized units, a monomer having carboxylic acid groups, anhydride groups, or salts thereof, and at least one of certain hydroxyl group-comprising monomers wherein the ratio of the number of equivalents of the carboxylic acid groups, anhydride groups, or salts thereof to the number of equivalents of the hydroxyl groups is from about 1/0.01 to about 1/3, and wherein the carboxylic acid groups, anhydride groups, or salts thereof are neutralized to an extent of less than about 35% with a fixed base is provided. Also provided is a method for treating a substrate with the curable composition and a substrate bearing the cured composition.

Abstract: Antimicrobial compositions and methods of making and using the same are disclosed. The disclosed antimicrobial compositions provide persistent, broad spectrum, antimicrobial activity. The antimicrobial compositions may be used in the preparation of antimicrobial articles. The antimicrobial compositions may also be used to inhibit the growth of microorganisms by introducing those compositions onto or into an environment subject to microbial attack.

Abstract: Treated fiber substrates and methods of making and using the same are disclosed. The disclosed treated fiber substrates provide persistent, durable, broad spectrum, antimicrobial activity. The treated fiber substrates may be used in a variety of materials to impart antimicrobial activity thereto.

Abstract: The present invention provides low-cost formaldehyde-free curable aqueous compositions comprising 100 weight parts of one or more than one binder chosen from (i) mixtures of one or more than one polycarboxylic acid or polymeric polyacid and one or more than one polyol compound comprising at least two hydroxyl or epoxy groups, (ii) copolymers or copolymeric polyacids bearing carboxylic acid groups or anhydride groups and hydroxyl groups, and (iii) mixtures thereof, and 10 to 40 weight parts of one or more than one extender having an average particle size ranging from 0.5 ?m or more and as high as 45 ?m or less, preferably chosen from microcrystalline silica, diatomaceous silica, kaolin, bentonite, and anhydrous aluminosilicate clay delaminated. In the inventive binder compositions, the ratio of the wet over dry tensile strength of said composition is about 0.5 or greater.

Abstract: A curable composition including a compound, containing as polymerized units, carboxylic acid groups, anhydride groups, or salts thereof, and a styrene, ?-methyl styrene, butyl (meth)acrylate, methyl methacrylate, ethyl (meth)acrylate, mono-alkyl (meth)acrylamide, or di-alkyl (meth)acrylamide ethylenically unsaturated monomer having a solubility in water of less than 2 g/100 g water at 25° C.; wherein the compound is either admixed with or copolymerized with a hydroxyl group-containing compound; the curable composition contains from about 3 to about 25 weight percent, based on the total weight of monomers in the curable composition, of the ethylenically unsaturated monomer; the ratio of the number of equivalents of the carboxylic acid groups, anhydride groups, or salts thereof to the number of equivalents of the hydroxyl groups is from about 1/0.01 to about 1/3, is provided. Also provided is a method for treating a substrate with the curable composition, articles prepared by the method of the invention.

Abstract: A method for chemical mechanical polishing of semiconductor substrates containing a metal layer requiring removal and metal interconnects utilizing a composition containing engineered copolymer molecules comprising hydrophilic functional groups and relatively less hydrophilic functional groups; the engineered copolymer molecules enabling contact-mediated reactions between the polishing pad surface and the substrate surface during CMP resulting in minimal dishing of the metal interconnects in the substrate.

Abstract: A method for chemical mechanical polishing of semiconductor substrates containing a metal layer requiring removal and metal interconnects utilizing a composition containing engineered copolymer molecules comprising hydrophilic functional groups and relatively less hydrophilic functional groups; the engineered copolymer molecules enabling contact-mediated reactions between the polishing pad surface and the substrate surface during CMP resulting in minimal dishing of the metal interconnects in the substrate.

Abstract: A curable aqueous composition including (a) a polyacid including at least two carboxylic acid groups, anhydride groups, or salts thereof; (b) a polyol including at least two hydroxyl groups; and (c) an emulsion polymer including, as copolymerized units, greater than 30% by weight, based on the weight of the emulsion polymer solids, ethylenically unsaturated acrylic monomer including a C5 or greater alkyl group; wherein the ratio of the number of equivalents of the carboxylic acid groups, anhydride groups, or salts thereof to the number of equivalents of the hydroxyl groups is from 1/0.01 to 1/3, and wherein the carboxylic acid groups, anhydride groups, or salts thereof are neutralized to an extent of less than 35% with a fixed base is provided. Also provided is a method for treating heat-resistant fibers or a heat-resistant nonwoven formed therefrom with the curable aqueous composition and the article prepared thereby.

Abstract: A curable composition including a polymer comprising, as copolymerized units, a monomer having carboxylic acid groups, anhydride groups, or salts thereof, and at least one of certain hydroxyl group-comprising monomers wherein the ratio of the number of equivalents of the carboxylic acid groups, anhydride groups, or salts thereof to the number of equivalents of the hydroxyl groups is from about 1/0.01 to about 1/3, and wherein the carboxylic acid groups, anhydride groups, or salts thereof are neutralized to an extent of less than about 35% with a fixed base is provided. Also provided is a method for treating a substrate with the curable composition and a substrate bearing the cured composition.

Abstract: A method for chemical mechanical polishing of semiconductor substrates containing a metal layer requiring removal and metal interconnects utilizing a composition containing engineered copolymer molecules comprising hydrophilic functional groups and relatively less hydrophilic functional groups; the engineered copolymer molecules enabling contact-mediated reactions between the polishing pad surface and the substrate surface during CMP resulting in minimal dishing of the metal interconnects in the substrate.

Abstract: This invention provides a triggered response composition in the form of a barrier material and a delivery device that includes one or more polyelectrolytes in contact with an aqueous system that is stable and insoluble in a liquid medium and that exhibits one or more chemical/physical responses in the liquid medium, wherein the chemical/physical response of the composition is triggered upon a change of ionic strength in the liquid medium.