Patents by Inventor BENJAMIN STASSEN COOK
BENJAMIN STASSEN COOK has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20240153841Abstract: In described examples, a method comprises forming a patterned region on a first surface of the semiconductor substrate. The method also comprises forming circuitry in the patterned region. The method further comprises forming a metallic layer on a second surface of the semiconductor substrate, in which the second surface opposes the first surface; and forming a carbon layer on the metallic layer.Type: ApplicationFiled: December 19, 2023Publication date: May 9, 2024Applicant: Texas Instruments IncorporatedInventors: Benjamin Stassen Cook, Nazila Dadvand, Archana Venugopal, Daniel Lee Revier
-
Publication number: 20240145526Abstract: In described examples, an integrated circuit comprises: a substrate; a semiconductor die on the substrate; and a device on the substrate and electrically coupled to the semiconductor die, the device including a polymer structure coated with a metal.Type: ApplicationFiled: January 4, 2024Publication date: May 2, 2024Applicant: Texas Instruments IncorporatedInventors: Benjamin Stassen Cook, Daniel Lee Revier
-
Publication number: 20240109247Abstract: A layer of additive material is formed in a circular printing area on a substrate using additive sources distributed across a printing zone. The additive sources form predetermined discrete amounts of the additive material. The substrate and the additive sources are rotated with respect to each other around a center of rotation, so that a pattern of the additive material is formed in a circular printing area on the substrate. Each additive source receives actuation waveforms at an actuation frequency that is proportional to a distance of the additive source from the center of rotation. The actuation waveforms include formation signals, with a maximum of one formation signal in each cycle of the actuation frequency. The formation signals result in the additive sources forming the predetermined discrete amounts of the additive material on the substrate.Type: ApplicationFiled: December 4, 2023Publication date: April 4, 2024Inventors: Daniel Lee Revier, Sean Ping Chang, Benjamin Stassen Cook
-
Patent number: 11948871Abstract: Disclosed embodiments include an integrated circuit (IC) comprising a silicon wafer, first and second conductive lines on the silicon wafer. There are first, second and third insulation blocks with portions on the first and second conductive lines and the silicon wafer, a metal pillar on the surface of the first conductive line opposite the silicon wafer, and a conductive adhesive block on the surface of the second conductive line opposite the silicon wafer. The IC also has a lead frame having first and second leads, and a capacitor having first and second capacitor terminals in which the first capacitor terminal is connected to the second lead using conductive adhesive, the second capacitor terminal is connected to the second conductive line through the conductive adhesive block, and the first lead is coupled to the first conductive line.Type: GrantFiled: May 19, 2021Date of Patent: April 2, 2024Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: Benjamin Stassen Cook, Yogesh Kumar Ramadass, Salvatore Frank Pavone, Mahmud Halim Chowdhury
-
Patent number: 11938715Abstract: A microstructure comprises a plurality of interconnected units wherein the units are formed of graphene tubes. The graphene tubes may be formed by photo-initiating the polymerization of a monomer in a pattern of interconnected units to form a polymer microlattice, removing unpolymerized monomer, coating the polymer microlattice with a metal, removing the polymer microlattice to leave a metal microlattice, depositing graphitic carbon on the metal microlattice, converting the graphitic carbon to graphene, and removing the metal microlattice.Type: GrantFiled: December 21, 2018Date of Patent: March 26, 2024Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: Luigi Colombo, Nazila Dadvand, Benjamin Stassen Cook, Archana Venugopal
-
Publication number: 20240077514Abstract: A method comprises receiving a signal from a piezoelectric device and receiving a measurement of a temperature of the piezoelectric device. The method further comprises reading a first parameter from a memory, in which the first parameter depends on the temperature and relates the signal to an acceleration value and reading a second parameter from the memory, in which the second parameter represents a degree of drift of the piezoelectric device at the temperature. The method further comprises determining an acceleration of the piezoelectric device based on the signal, the first parameter, and the second parameter.Type: ApplicationFiled: November 13, 2023Publication date: March 7, 2024Applicant: Texas Instruments IncorporatedInventors: Scott Robert SUMMERFELT, Benjamin Stassen COOK
-
Patent number: 11908776Abstract: A semiconductor device includes a metal substrate including a through-hole aperture having a multi-size cavity including a larger area first cavity portion above a smaller area second cavity portion that defines a first ring around the second cavity portion, where the first cavity portion is sized with area dimensions to receive a semiconductor die having a top side with circuitry coupled to bond pads thereon and a back side with a metal (BSM) layer thereon. The semiconductor die is mounted top side up with the BSM layer on the first ring. A metal die attach layer directly contacts the BSM layer, sidewalls of the bottom cavity portion, and a bottom side of the metal substrate.Type: GrantFiled: January 6, 2021Date of Patent: February 20, 2024Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: Benjamin Stassen Cook, Nazila Dadvand, Sreenivasan Koduri
-
Patent number: 11869864Abstract: In some examples, a system comprises a set of nanoparticles and a set of nanowires extending from the set of nanoparticles.Type: GrantFiled: February 24, 2022Date of Patent: January 9, 2024Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: Benjamin Stassen Cook, Ralf Muenster, Sreenivasan Kalyani Koduri
-
Patent number: 11865773Abstract: A layer of additive material is formed in a circular printing area on a substrate using additive sources distributed across a printing zone. The additive sources form predetermined discrete amounts of the additive material. The substrate and the additive sources are rotated with respect to each other around a center of rotation, so that a pattern of the additive material is formed in a circular printing area on the substrate. Each additive source receives actuation waveforms at an actuation frequency that is proportional to a distance of the additive source from the center of rotation. The actuation waveforms include formation signals, with a maximum of one formation signal in each cycle of the actuation frequency. The formation signals result in the additive sources forming the predetermined discrete amounts of the additive material on the substrate.Type: GrantFiled: November 11, 2019Date of Patent: January 9, 2024Assignee: Texas Instruments IncorporatedInventors: Daniel Lee Revier, Sean Ping Chang, Benjamin Stassen Cook
-
Patent number: 11869925Abstract: In described examples, a method for fabricating a semiconductor device and a three dimensional structure, and packaging them together, includes: fabricating the integrated circuit on a substrate, immersing the substrate in a liquid encapsulation material, and illuminating the liquid encapsulation material to polymerize the liquid encapsulation material. Immersing the semiconductor device is performed to cover a layer of a platform in the liquid encapsulation material. The platform is a lead frame, a packaging substrate, or the substrate. The illuminating step targets locations of the liquid encapsulation material covering the layer. Illuminated encapsulation material forms solid encapsulation material that is fixedly coupled to contiguous portions of the semiconductor device and of the solid encapsulation material. The immersing and illuminating steps are repeated until a three dimensional structure is formed. The integrated circuit and the three dimensional structure are encapsulated in a single package.Type: GrantFiled: February 1, 2021Date of Patent: January 9, 2024Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: Benjamin Stassen Cook, Daniel Lee Revier
-
Patent number: 11854933Abstract: In described examples, a semiconductor wafer with a thermally conductive surface layer comprises a bulk semiconductor layer having a first surface and a second surface, circuitry on the first surface, a metallic layer attached to the first surface or the second surface, and a graphene layer attached to the metallic layer. The first surface opposes the second surface. The metallic layer comprises a transition metal.Type: GrantFiled: December 30, 2020Date of Patent: December 26, 2023Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: Benjamin Stassen Cook, Nazila Dadvand, Archana Venugopal, Daniel Lee Revier
-
Patent number: 11815526Abstract: A method includes measuring a temperature of a semiconductor die, in which the semiconductor die includes a piezoelectric device, a pyroelectric device, and a memory. The method further includes receiving a first signal from the pyroelectric device, and based on the first signal, determining a parameter to be combined with a second signal from the piezoelectric device. The method further includes storing the parameter and the measured temperature into the memory.Type: GrantFiled: April 28, 2022Date of Patent: November 14, 2023Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: Scott Robert Summerfelt, Benjamin Stassen Cook
-
Publication number: 20230335355Abstract: A switch that includes a droplet capable of spreading between two conductors to allow them to be coupled when a voltage is applied. The droplet can be enclosed by a cap that is bonded to a wafer that the droplet is placed upon, and include metallic properties. The cap can create a cavity that may be filled by a fluid, gas, or vapor. The cavity can have multiple conductors that extend partially or fully through it. The droplet can couple the conductors when specific voltages, or frequencies are applied to them. At the specific voltage and frequency, the droplet can spread, allowing at least two conductors to be coupled.Type: ApplicationFiled: June 23, 2023Publication date: October 19, 2023Inventors: Adam Joseph Fruehling, Dishit Paresh Parekh, Daniel Lee Revier, Benjamin Stassen Cook
-
Patent number: 11791296Abstract: In some examples, an electronic device comprises a first component having a surface, a second component having a surface, and a bond layer positioned between the surfaces of the first and second components to couple the first and second components to each other. The bond layer includes a set of metallic nanowires and a dielectric portion. The dielectric portion comprises a polymer matrix and dielectric nanoparticles.Type: GrantFiled: December 7, 2021Date of Patent: October 17, 2023Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: Scott Robert Summerfelt, Benjamin Stassen Cook, Ralf Jakobskrueger Muenster, Sreenivasan Kalyani Koduri
-
Patent number: 11774519Abstract: In a described example, a structure includes a substrate having a surface with multiple sides. A sensor is positioned within the substrate and a seed layer is over at least four sides of the surface of the substrate. A magnetic shield layer is over the seed layer for the at least four sides of the surface of the substrate.Type: GrantFiled: August 26, 2020Date of Patent: October 3, 2023Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: Yong Deng, Jo Bito, Benjamin Stassen Cook
-
Publication number: 20230307312Abstract: An integrated circuit has a substrate and an interconnect region disposed on the substrate. The interconnect region includes a plurality of interconnect levels. Each interconnect level includes interconnects in dielectric material. The integrated circuit includes a thermal via in the interconnect region. The thermal via extends vertically in at least one of the interconnect levels in the interconnect region. The thermal via includes a cohered nanoparticle film in which adjacent nanoparticles are cohered to each other. The thermal via has a thermal conductivity higher than dielectric material touching the thermal via. The cohered nanoparticle film is formed by a method which includes an additive process.Type: ApplicationFiled: May 4, 2023Publication date: September 28, 2023Inventors: Benjamin Stassen Cook, Archana Venugopal, Luigi Colombo, Robert Reid Doering
-
Patent number: 11728111Abstract: A switch that includes a droplet capable of spreading between two conductors to allow them to be coupled when a voltage is applied. The droplet can be enclosed by a cap that is bonded to a wafer that the droplet is placed upon, and include metallic properties. The cap can create a cavity that may be filled by a fluid, gas, or vapor. The cavity can have multiple conductors that extend partially or fully through it. The droplet can couple the conductors when specific voltages, or frequencies are applied to them. At the specific voltage and frequency the droplet can spread allowing at least two conductors to be coupled.Type: GrantFiled: December 27, 2018Date of Patent: August 15, 2023Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: Adam Joseph Fruehling, Dishit Paresh Parekh, Daniel Lee Revier, Benjamin Stassen Cook
-
Patent number: 11728242Abstract: In some examples, a semiconductor package comprises a semiconductor die having a first surface and a second surface opposing the first surface. The package comprises an orifice extending through a thickness of the semiconductor die from the first surface to the second surface. The package comprises a set of metallic nanowires positioned within the orifice and extending through the thickness of the semiconductor die from the first surface to the second surface.Type: GrantFiled: April 8, 2020Date of Patent: August 15, 2023Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: Benjamin Stassen Cook, Ralf Jakobskrueger Muenster, Sreenivasan Kalyani Koduri
-
Publication number: 20230243770Abstract: A gas sensor has a microstructure sensing element which comprises a plurality of interconnected units wherein the units are formed of connected graphene tubes. The graphene tubes may be formed by photo-initiating the polymerization of a monomer in a pattern of interconnected units to form a polymer microlattice, removing unpolymerized monomer, coating the polymer microlattice with a metal, removing the polymer microlattice to leave a metal microlattice, depositing graphitic carbon on the metal microlattice, converting the graphitic carbon to graphene, and removing the metal microlattice.Type: ApplicationFiled: March 8, 2023Publication date: August 3, 2023Applicant: Texas Instruments IncorporatedInventors: Archana VENUGOPAL, Benjamin Stassen Cook, Nazila Dadvand, Luigi Colombo
-
Patent number: 11714011Abstract: A system comprises a member to receive a mechanical force, and a sensor to sense the mechanical force. The sensor is mounted on the member using a set of nanoparticles and a set of nanowires coupled to the set of nanoparticles.Type: GrantFiled: April 8, 2020Date of Patent: August 1, 2023Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: Ralf Jakobskrueger Muenster, Sreenivasan Kalyani Koduri, Benjamin Stassen Cook