Abstract: In one aspect, a vacuum chuck supports a substrate on an end effector, the vacuum chuck comprising a position reference structure and a suction cup. The position reference structure is mounted to the surface and comprises a reference surface. The suction cup is located proximate the reference surface and comprising a suction mount. In another aspect, a method of chucking a substrate to a vacuum chuck is provided. The vacuum chuck comprises a suction cup and a position reference structure. The method comprises attaching the suction cup to the substrate to form a seal therebetween. The suction cup is deformed such that the substrate contacts the position reference structure. The substrate is then leveled on the position reference structure.

Abstract: An integrated semiconductor substrate bevel cleaning system that enables transfer of substrates through the bevel cleaner either with or without substrate processing within the bevel cleaner. The invention provides an integrated bevel cleaning apparatus comprising a transfer position, a rinsing position and an etching position.

Abstract: A method and an apparatus is provided that may fix a point at which an etchant or a fluid sprayed from a nozzle impacts a substrate. By fixing a first angle measured between the inventive nozzle and a substrate support and fixing a process height of a nozzle relative to a substrate support, a second angle, measured between a fluid sprayed from the nozzle and a line tangent to a substrate support, may vary without affecting the fluid impact point.